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A3P250-FGG144I

Microchip Technology

A3P250-FGG144I by Microchip Technology

Microchip Technology's A3P250-FGG144I is a CMOS FPGA with 6144 CLBs and 250000 gates. Operating at 1.5V, it offers a max clock frequency of 350MHz. Ideal for industrial applications requiring high gate count and clock speed in a compact grid array package.

Median Price

$24.240

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 297 parts In-Stock

1+ parts

$19.380

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$19.100

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297

$19.380

$19.100

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Arrow

USA . 138 parts In-Stock

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$23.490

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$22.080

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138

$23.490

$22.080

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DigiKey

USA . 99 parts In-Stock

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$24.240

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$23.880

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99

$24.240

$23.880

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Mouser Electronics

USA . 48 parts In-Stock

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$24.240

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$23.880

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48

$24.240

$23.880

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Newark

USA . 68 parts In-Stock

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$24.970

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$24.600

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68

$24.970

$24.600

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Master Electronics

USA . 74 parts In-Stock

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$26.930

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$23.410

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$23.180

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74

$26.930

$23.410

$23.180

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Element14

Singapore . 297 parts In-Stock

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$34.660

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$34.150

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297

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Future Electronics

Canada . 1,120 parts In-Stock

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$19.330

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Verical

USA . 74 parts In-Stock

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$27.140

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74

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Distributors (In-Stock)

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Digiode

USA . 120 parts In-Stock

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$18.411

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120

$18.411

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Nova Conductors

Japan . 100 parts In-Stock

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$24.100

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100

$24.100

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Electro Sonic

Canada . 160 parts In-Stock

1+ parts

$26.260

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$22.440

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$20.940

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160

$26.260

$22.440

$20.940

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IBS Electronics

USA . 233 parts In-Stock

1+ parts

$28.008

100+ parts

$26.087

1k+ parts

$25.652

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233

$28.008

$26.087

$25.652

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Sensible Micro Corp

USA . 1,686 parts In-Stock

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Vyrian

USA . 357 parts In-Stock

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Cyclops Electronics Ltd

UK . 340 parts In-Stock

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340

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NAC Semi

USA . 320 parts In-Stock

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$35.150

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$35.150

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VNN

France . 90 parts In-Stock

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ComSIT Distribution GmbH

Germany . 5 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 160 parts In-Stock

1+ parts

$16.470

100+ parts

$16.058

1k+ parts

$15.976

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160

$16.470

$16.058

$15.976

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Corphita

USA . 137 parts In-Stock

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$17.442

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137

$17.442

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Vigor

Singapore . 99,550 parts In-Stock

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$18.250

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99,550

$18.250

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Continental Prestige Electronics

USA . 307 parts In-Stock

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$21.060

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$20.750

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307

$21.060

$20.750

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Microchip USA

USA . 4,725 parts In-Stock

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$24.740

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$24.740

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Aztec Data Supply Inc.

USA . 1,627 parts In-Stock

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$138.926

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$138.926

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Corohmni

South Africa . 209 parts In-Stock

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$169.562

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Authorized Procurement Solutions

USA . 54,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 10,278 parts In-Stock

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West Coast Incorporated

USA . 4,537 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,408 parts In-Stock

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Argo Parts USA

USA . 3,308 parts In-Stock

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Glotronic Ltd.

UK . 3,140 parts In-Stock

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3,140

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Perfect Parts

USA . 896 parts In-Stock

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RC Electronics

USA . 844 parts In-Stock

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$24.490

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$22.350

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$21.680

844

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$24.490

$22.350

$21.680

Overview

Unlock the potential of your projects with the A3P250-FGG144I by Microchip Technology. This high-quality Field Programmable Gate Array offers unmatched flexibility and performance for a wide range of applications. Whether you're designing industrial automation systems or consumer electronics, this FPGA provides the power and reliability you need to bring your ideas to life. With a maximum supply voltage of 1.575V and 250,000 equivalent gates, this versatile component is sure to meet your project requirements with ease. Choose Microchip Technology for cutting-edge technology that delivers unparalleled value and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and flexibility in design, making the FPGA suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient integration of the FPGA onto circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 1.575 V

Supports a higher voltage range, allowing for robust performance and reliable operation under various operating conditions.

No. of CLBs: 6144

A high number of Configurable Logic Blocks (CLBs) provide ample resources for implementing complex designs and processing tasks efficiently.

Technology Used: CMOS

CMOS technology offers low power consumption, high speed, and reliable performance, making the FPGA energy-efficient and suitable for a variety of applications.

Package Shape: SQUARE

Square package shape allows for easy and symmetrical placement on circuit boards, facilitating efficient routing and integration in the overall system.

Form Of Terminal: BALL

Ball terminals provide reliable connections and enable easy soldering during the assembly process, ensuring secure electrical connections.

No. of Equivalent Gates: 250000

High number of equivalent gates enables the FPGA to handle complex logic operations, data processing, and algorithm implementations effectively.

Nominal Supply Voltage (V): 1.5

Stable nominal supply voltage ensures consistent performance and reliable operation of the FPGA in various applications.

Packing Method: TRAY

Tray packing method offers secure and organized storage, handling, and shipping of the FPGA units, minimizing the risk of damage during transportation.

No. of Terminals: 144

A sufficient number of terminals allow for easy integration and connection of the FPGA with other components, ensuring reliable electrical contacts.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array (FPGA) allows for flexible and customizable logic implementation, enabling rapid prototyping and design iterations.

Package Style (Meter): GRID ARRAY, LOW PROFILE

Grid array and low-profile package style offer efficient heat dissipation, compact design, and easy integration, making the FPGA suitable for space-constrained applications.

Minimum Supply Voltage: 1.425 V

Low minimum supply voltage ensures compatibility with a wide range of power sources and energy-efficient operation of the FPGA.

Maximum Operating Temperature: 100 °C

High maximum operating temperature tolerance ensures reliable performance in harsh environmental conditions and industrial applications.

Pitch Of Terminal: 1 mm

Optimal terminal pitch allows for efficient board layout, routing, and soldering, improving the overall reliability and performance of the FPGA.

Organization: 6144 CLBS, 250000 GATES

Well-organized structure with a sufficient number of CLBs and gates provides the necessary resources for implementing complex designs and algorithms in the FPGA.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures reliable performance in extreme cold environments, making the FPGA suitable for a wide range of applications.

Finishing Of Terminal Used: TIN SILVER COPPER

Tin, silver, and copper finishing on terminals offer excellent conductivity, corrosion resistance, and solderability, ensuring long-term reliability of electrical connections.

Position Of Terminal: BOTTOM

Bottom terminal placement allows for easy and efficient soldering, inspection, and rework during the assembly process, ensuring high-quality connections.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate moisture sensitivity, requiring standard handling and storage procedures to prevent moisture-related damage during assembly and use.

Maximum Seated Height: 1.55 mm

Low maximum seated height allows for compact and slim designs, reducing overall system size and enabling integration in space-constrained applications.

Width: 13 mm

Optimal width dimension offers compatibility with standard board layouts, routing, and mounting options, ensuring easy integration of the FPGA in various systems.

Maximum Clock Frequency: 350 MHz

High maximum clock frequency capability enables fast data processing, efficient logic operations, and real-time control applications with minimal latency.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds, the FPGA can undergo efficient soldering processes without compromising the component's reliability and functionality.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures reliable soldering and assembly of the FPGA onto circuit boards, maintaining stable electrical connections.

Length: 13 mm

Optimal length dimension offers compatibility with standard board layouts, routing, and mounting options, ensuring easy integration of the FPGA in various systems.

Grading Of Temperature: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh industrial environments, making the FPGA suitable for rugged applications with high temperature variations.

Technical Specifications

Field Programmable Gate Arrays (FPGA) A3P250-FGG144I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of CLBs:

6144

No. of Equivalent Gates:

250000

Maximum Clock Frequency:

350 MHz

Technology:

CMOS

Organization:

6144 CLBS, 250000 Gates

Power Characteristics

Nominal Supply Voltage:

1.5

Minimum Supply Voltage:

1.425 V

Maximum Supply Voltage:

1.575 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile

Package Code:

Package Shape:

Length:

13 mm

Width:

13 mm

Maximum Seated Height:

1.55 mm

Packing Method:

Tray

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

144

Standards

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

A3P250-FGG144I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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