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M2S090TS-1FCS325

Microsemi

M2S090TS-1FCS325 by Microsemi

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 325; Package Code: TFBGA; Package Shape: RECTANGULAR; Nominal Supply Voltage (V): 1.2;

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Lifecycle Status

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Semicontronic

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RGB Technical Solutions

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Technical Specifications

Field Programmable Gate Arrays (FPGA) M2S090TS-1FCS325 attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microsemi

IC Features

Programmable IC Type:

No. of Logic Cells:

86316

No. of Inputs:

180

No. of Outputs:

180

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Additional Features:

LG-MIN, WD-MIN

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

240 °C (464 °F)

Peak Reflow Time:

30 s

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Thin Profile, Fine Pitch

Package Code:

Package Shape:

Length:

13.5 mm

Width:

11 mm

Maximum Seated Height:

1.16 mm

Package Equivalence Code:

BGA325,21X21,20

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Lead

Terminal Pitch:

.5 mm

No. of Terminals:

325

Standards

JESD-30 Code:

R-PBGA-B325

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

M2S090TS-1FCS325 Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microsemi

Microsemi Corporation, a wholly owned subsidiary of Microchip Technology Inc. (Nasdaq: MCHP), offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, California.

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