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10AX027E4F29E3SG

Intel

10AX027E4F29E3SG by Intel

Intel's 10AX027E4F29E3SG FPGA boasts 270K logic cells, TSMC tech, and 10162 CLBs. Ideal for applications requiring high-speed processing and complex logic operations in a compact form factor. With 360 inputs/outputs, 0.93V max supply voltage, and PLASTIC/EPOXY package material.

Median Price

$965.630

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7

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1k+

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Verical

USA . 29 parts In-Stock

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$917.750

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Mouser Electronics

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Digiode

USA . 180 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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VNN

France . 25,082 parts In-Stock

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Vyrian

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Chip Stock

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AZTECH Wire

Italy . 445 parts In-Stock

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$7.504

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Modulus Dynamics

Lithuania . 491 parts In-Stock

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MARBEL Systems

Belgium . 3,545 parts In-Stock

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Kenton Components

USA . 461 parts In-Stock

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Texas Native Microelectronics

USA . 2,668 parts In-Stock

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$74.370

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Corohmni

South Africa . 26 parts In-Stock

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Vigor

Singapore . 281 parts In-Stock

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One Stop Electronics

USA . 16 parts In-Stock

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Ampacity Inc.

Singapore . 16 parts In-Stock

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Semicontronic

India . 16 parts In-Stock

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Corphita

USA . 395 parts In-Stock

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Aranea Global

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Argo Parts USA

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Continental Prestige Electronics

USA . 4,456 parts In-Stock

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Microchip USA

USA . 909 parts In-Stock

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Advanced Electronics

New Zealand . 900 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Supply Digital

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Qasali Group International

UK . 697 parts In-Stock

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Overview

Unlock limitless possibilities with the Intel 10AX027E4F29E3SG FPGA. Made by the renowned manufacturer Intel, this versatile Field Programmable Gate Array boasts 270,000 logic cells and a whopping 10,162 CLBs, making it ideal for a wide range of applications. With its low supply voltage, high number of inputs and outputs, and innovative technology from TSMC, this FPGA offers unparalleled flexibility and performance. Whether you're designing cutting-edge electronics or pushing the boundaries of technology, the Intel 10AX027E4F29E3SG FPGA is your key to success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the FPGA lightweight and cost-effective.

No. of Logic Cells: 270000

With a large number of logic cells, this FPGA can handle complex logic operations efficiently.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards.

Maximum Supply Voltage: 0.93 V

The low maximum supply voltage helps in reducing power consumption.

Technology Used: TSMC

TSMC technology ensures high performance and reliability in the FPGA.

No. of Inputs: 360

With 360 inputs, this FPGA can handle a wide range of input signals.

Nominal Supply Voltage (V): 0.9

A nominal supply voltage of 0.9V provides a balance between performance and power efficiency.

No. of Terminals: 780

The large number of terminals allows for versatile connectivity options.

Package Style (Meter): GRID ARRAY

The grid array package style offers high density and efficient use of space on a PCB.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature ensures reliability in various environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for operation in a wide range of thermal conditions.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10AX027E4F29E3SG attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

270000

No. of Inputs:

360

No. of Outputs:

360

No. of CLBs:

10162

Technology:

TSMC

Sub-Category:

Field Programmable Gate Arrays

Organization:

10162 CLBS

Power Characteristics

Nominal Supply Voltage:

0.9

Minimum Supply Voltage:

.87 V

Maximum Supply Voltage:

.93 V

Power Supplies:

0.9 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

29 mm

Width:

29 mm

Maximum Seated Height:

3.35 mm

Package Equivalence Code:

BGA780,28X28,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

780

Standards

JESD-30 Code:

S-PBGA-B780

Qualified:

No

Trade Compliance

10AX027E4F29E3SG Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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