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M1A3P1000-FG144M

Microchip Technology

M1A3P1000-FG144M by Microchip Technology

M1A3P1000-FG144M by Microchip Technology is a FPGA with 24576 logic cells, 97 inputs/outputs, and 1000000 equivalent gates. It operates at max clock frequency of 350 MHz and supports supply voltages of 1.425-1.575 V. Ideal for military applications requiring high-speed processing in compact spaces due to its low profile grid array package design.

Median Price

$240.380

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 62 parts In-Stock

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$240.380

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Chip Stock

USA . 882 parts In-Stock

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Vyrian

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835

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Digiode

USA . 440 parts In-Stock

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AZTECH Wire

Italy . 194 parts In-Stock

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$8.971

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Corohmni

South Africa . 1,214 parts In-Stock

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$25.541

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Semicontronic

India . 807 parts In-Stock

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$35.000

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$34.125

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$33.950

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807

$35.000

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Advanced Electronics

New Zealand . 1,102 parts In-Stock

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$125.553

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$119.275

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$119.275

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1,102

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Aztec Data Supply Inc.

USA . 755 parts In-Stock

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$167.850

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Aranea Global

USA . 100 parts In-Stock

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$235.572

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$226.150

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Continental Prestige Electronics

USA . 5,037 parts In-Stock

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$240.380

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Microchip USA

USA . 8,194 parts In-Stock

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Argo Parts USA

USA . 3,182 parts In-Stock

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RGB Technical Solutions

Ukraine . 2,039 parts In-Stock

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Corphita

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Overview

Unleash the power of cutting-edge technology with the M1A3P1000-FG144M by industry leader Microchip Technology. This Field Programmable Gate Array (FPGA) boasts 24,576 logic cells and 1,000,000 equivalent gates, delivering unmatched performance for a wide range of applications. With a maximum clock frequency of 350 MHz and MILITARY-grade temperature grading, this FPGA is built to excel in demanding environments. Experience seamless integration, high reliability, and unparalleled flexibility with the M1A3P1000-FG144M, setting a new standard in advanced programmable ICs. Elevate your projects with Microchip Technology's superior quality and innovation today!

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material is durable and cost-effective, making it a reliable choice for long-term use.

No. of Logic Cells:

24576 - With a high number of logic cells, this FPGA offers ample room for complex designs and applications.

Surface Mount:

YES - Being surface mountable makes installation and maintenance of this FPGA easy and efficient.

Maximum Supply Voltage:

1.575 V - This higher voltage tolerance ensures stability and reliability in varying power conditions.

No. of CLBs:

24576 - The large number of Configurable Logic Blocks allows for versatile programming and customization.

Technology Used:

CMOS - CMOS technology offers low power consumption and high noise immunity, enhancing overall performance.

No. of Inputs:

97 - With a high number of inputs, this FPGA can handle a wide range of data and signals efficiently.

Package Shape:

SQUARE - The square shape makes this FPGA easy to integrate into various system designs.

Form Of Terminal:

BALL - Ball terminals provide secure connections and facilitate high-speed data transmission.

No. of Equivalent Gates:

1000000 - This FPGA offers a high gate count, enabling the implementation of complex logic functions.

Nominal Supply Voltage (V):

1.5 - The nominal supply voltage of 1.5V ensures compatibility with standard power sources.

Packing Method:

TRAY - The tray packing method offers protection during shipping and handling, minimizing the risk of damage.

Power Supplies (V):

1.5,1.5/3.3 - Multiple power supply options cater to diverse application requirements and voltage preferences.

No. of Terminals:

144 - The high number of terminals allows for connectivity with various external components and systems.

Programmable IC Type:

FIELD PROGRAMMABLE GATE ARRAY - Being FPGA means it can be reprogrammed for different functions, providing flexibility.

Package Style (Meter):

GRID ARRAY, LOW PROFILE - The low profile and grid array style of the package save space and enhance thermal performance.

Minimum Supply Voltage:

1.425 V - With a low minimum supply voltage, this FPGA can operate efficiently in power-sensitive applications.

Maximum Operating Temperature:

125 °C - The high maximum operating temperature ensures reliability in harsh environmental conditions.

Pitch Of Terminal:

1 mm - The small terminal pitch allows for high-density interconnections in compact designs.

Organization:

24576 CLBS, 1000000 GATES - The organized structure of CLBs and gates enables efficient logic implementation and programming.

Minimum Operating Temperature:

55 °C - With a low minimum operating temperature, this FPGA can function in extreme cold environments.

Finishing Of Terminal Used:

TIN LEAD SILVER - The use of tin, lead, and silver in terminal finishing enhances conductivity and corrosion resistance.

Position Of Terminal:

BOTTOM - Bottom terminal placement facilitates easy board-level assembly and soldering.

Moisture Sensitivity Level (MSL):

3 - MSL 3 rating ensures safe storage and handling to prevent moisture-related damage.

Maximum Seated Height:

1.55 mm - The low seated height profile saves space and allows for compact system integration.

Width:

13 mm - The narrow width of the FPGA makes it suitable for applications with space constraints.

Maximum Clock Frequency:

350 MHz - With a high clock frequency, this FPGA can process data rapidly for real-time applications.

No. of Outputs:

97 - A high number of outputs enables this FPGA to drive multiple external devices and subsystems.

Length:

13 mm - The compact length of the FPGA makes it suitable for miniaturized electronic designs.

Grading Of Temperature:

MILITARY - Military-grade temperature rating ensures high reliability and performance in challenging operational environments.

Technical Specifications

Field Programmable Gate Arrays (FPGA) M1A3P1000-FG144M attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

24576

No. of Inputs:

97

No. of Outputs:

97

No. of CLBs:

24576

No. of Equivalent Gates:

1000000

Maximum Clock Frequency:

350 MHz

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

24576 CLBS, 1000000 Gates

Power Characteristics

Nominal Supply Voltage:

1.5

Minimum Supply Voltage:

1.425 V

Maximum Supply Voltage:

1.575 V

Power Supplies:

1.5,1.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile

Package Code:

Package Shape:

Length:

13 mm

Width:

13 mm

Maximum Seated Height:

1.55 mm

Packing Method:

Tray

Package Equivalence Code:

BGA144,12X12,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Lead Silver

Terminal Pitch:

1 mm

No. of Terminals:

144

Standards

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

M1A3P1000-FG144M Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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