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LFD2NX-40-9MG121C

Lattice Semiconductor

LFD2NX-40-9MG121C by Lattice Semiconductor

LFD2NX-40-9MG121C by Lattice Semiconductor is a 39,000 logic cell FPGA with FDSOI technology. It has 23 inputs and outputs, operates at a voltage range of 0.95V to 1.05V, and can withstand temperatures up to 85°C. This FPGA is used for various applications requiring programmable ICs in industries like telecommunications and automotive.

Median Price

$59.730

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Arrow

USA . 490 parts In-Stock

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$59.730

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$56.580

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$56.120

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Verical

USA . 490 parts In-Stock

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$59.730

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$56.580

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$56.120

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DigiKey

USA . 369 parts In-Stock

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$71.390

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$57.585

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369

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Nova Conductors

Japan . 150 parts In-Stock

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$45.755

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Chip Stock

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Vyrian

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Microchip USA

USA . 2,814 parts In-Stock

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$45.805

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Ampacity Inc.

Singapore . 365 parts In-Stock

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$55.170

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Netroflash

USA . 50 parts In-Stock

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$44.840

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$43.467

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$42.552

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Overview

Experience the cutting-edge technology of Lattice Semiconductor with the LFD2NX-40-9MG121C FPGA. This powerful device, featuring 39,000 logic cells and 9,750 CLBs, is designed to unlock limitless possibilities for your applications. With a nominal supply voltage of 1V and maximum operating temperature of 85°C, this field-programmable gate array offers unrivaled performance and reliability. Its surface mount capability and very thin profile make it easy to integrate into any project. Whether you're working on automotive systems, industrial automation, or wireless communication, the LFD2NX-40-9MG121C delivers superior quality and unmatched flexibility. Stay ahead of the game with Lattice Semiconductor's innovative solutions!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for packaging, ensuring the FPGA is protected during handling and operation.

No. of Logic Cells: 39000

High number of logic cells allows for complex programmable logic designs to be implemented efficiently.

Surface Mount: YES

Surface mountable design makes it easier to integrate the FPGA onto circuit boards, saving space and improving assembly efficiency.

Maximum Supply Voltage: 1.05 V

Efficient power consumption with a low maximum supply voltage, helping to reduce energy usage and heat generation.

No. of CLBs: 9750

A large number of Configurable Logic Blocks allows for versatile and customizable logic functions to be implemented.

Technology Used: FDSOI

FDSOI technology offers improved performance, power efficiency, and radiation tolerance compared to traditional silicon technologies.

No. of Inputs: 23

Sufficient number of inputs for accommodating multiple input signals and data sources in complex digital designs.

Package Shape: SQUARE

Square package shape is space-efficient and allows for easier alignment and integration with other components on a circuit board.

Form Of Terminal: BALL

Ball terminals provide reliable electrical connections and are suitable for high-density mounting applications.

No. of Terminals: 121

Sufficient number of terminals for connecting to external circuitry, enabling versatile interfacing and communication.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Field programmability allows for flexibility in logic design and the ability to reprogram the FPGA for different applications.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array package style with thin profile and fine pitch terminals allows for high-density mounting and efficient signal routing.

Minimum Supply Voltage: 0.95 V

Low minimum supply voltage enables operation under low power conditions and extends battery life in portable devices.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures reliable performance in various environmental conditions.

Pitch Of Terminal: 0.5 mm

Fine pitch terminals enable compact design and high pin count in a small form factor.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for reliable operation in cold environments without performance degradation.

Finishing Of Terminal Used: TIN SILVER COPPER

Triple finish of tin, silver, and copper provides good conductivity, corrosion resistance, and solderability for reliable connections.

Position Of Terminal: BOTTOM

Bottom terminal positioning is convenient for board mounting and allows for efficient heat dissipation in the system.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard precautions for handling and storage to prevent damage.

Maximum Seated Height: 1 mm

Low seated height facilitates space-saving integration in compact electronic devices and PCB layouts.

Width: 6 mm

Narrow width allows for efficient placement on circuit boards and accommodates tight spacing requirements in electronic designs.

No. of Outputs: 23

Sufficient number of outputs for driving multiple output signals and interfacing with external devices in digital systems.

Maximum Time At Peak Reflow Temperature (s): 30

Short maximum reflow time ensures proper soldering of the FPGA during assembly, reducing the risk of thermal damage.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures effective soldering and robust connections for reliable performance in demanding applications.

Length: 6 mm

Compact length allows for flexible layout options and efficient use of space in electronic assemblies and PCB designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) LFD2NX-40-9MG121C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of Logic Cells:

39000

No. of Inputs:

23

No. of Outputs:

23

No. of CLBs:

9750

Technology:

FDSOI

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Very Thin Profile, Fine Pitch

Package Code:

Package Shape:

Length:

6 mm

Width:

6 mm

Maximum Seated Height:

1 mm

Package Equivalence Code:

BGA121,11X11,20

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.5 mm

No. of Terminals:

121

Standards

JESD-30 Code:

S-PBGA-B121

JESD-609 Code:

e1

Trade Compliance

LFD2NX-40-9MG121C Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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