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XC7A15T-1CSG325I

Xilinx

XC7A15T-1CSG325I by Xilinx

The Xilinx XC7A15T-1CSG325I is a FPGA with 16640 logic cells, 1300 CLBs, and max clock frequency of 1098 MHz. It is used in industrial applications requiring high-speed processing and programmable ICs for various electronic systems.

Median Price

$64.796

Lifecycle Status

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Farnell

UK . 504 parts In-Stock

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$60.993

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Mouser Electronics

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Element14

Singapore . 504 parts In-Stock

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Newark

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DigiKey

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Digiode

USA . 474 parts In-Stock

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VNN

France . 73 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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Cyclops Electronics Ltd

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Vyrian

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Semicontronic

India . 377 parts In-Stock

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$45.800

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$44.655

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$44.426

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Ampacity Inc.

Singapore . 108 parts In-Stock

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Vigor

Singapore . 786 parts In-Stock

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Corphita

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Continental Prestige Electronics

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Netroflash

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Microchip USA

USA . 1,153 parts In-Stock

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$60.840

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$59.840

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$59.340

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$58.840

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Modulus Dynamics

Lithuania . 238 parts In-Stock

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$73.422

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Corohmni

South Africa . 303 parts In-Stock

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Advanced Electronics

New Zealand . 619 parts In-Stock

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Aztec Data Supply Inc.

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Texas Native Microelectronics

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Kenton Components

USA . 120 parts In-Stock

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$189.498

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$189.498

Qasali Group International

UK . 481 parts In-Stock

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Lixinc

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QUARKTWIN TECHNOLOGY LTD

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Supply Digital

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GreenTree Electronics

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Overview

Unlock limitless possibilities with the XC7A15T-1CSG325I by Xilinx. As a leading manufacturer in Field Programmable Gate Arrays (FPGA), Xilinx delivers top-quality products designed to exceed expectations. Whether you're in automotive, telecommunications, or aerospace industries, this FPGA is your go-to solution for high-performance applications. Experience the value of unparalleled flexibility, reliability, and innovation that Xilinx brings to the table. Embrace the future with Xilinx and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the device.

No. of Logic Cells: 16640

Offers a high level of programmable logic for complex applications.

Surface Mount: YES

Easily soldered onto a circuit board for convenient integration.

Maximum Supply Voltage: 1.05 V

Efficiently operates at a low supply voltage, reducing power consumption.

No. of CLBs: 1300

Provides a large number of configurable logic blocks for flexibility in design.

No. of Inputs: 250

Offers a sufficient number of input ports for data processing and communication.

Package Shape: SQUARE

Maximizes space utilization on the circuit board.

Form Of Terminal: BALL

Enhances connectivity with other components in the system.

No. of Terminals: 325

Provides multiple connection points for versatility in wiring.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Allows for customization and reprogramming of the device for different applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enables compact and efficient packaging on the circuit board.

Minimum Supply Voltage: 0.95 V

Supports low power operation and energy efficiency.

Maximum Operating Temperature: 100 °C

Can withstand high operating temperatures in industrial environments.

Pitch Of Terminal: 0.8 mm

Provides fine pitch terminals for precise connections.

Maximum Combinatorial Delay of a CLB: 1.27 ns

Ensures quick processing and response times in logic operations.

Organization: 1300 CLBS

Organized configuration of logic blocks for efficient design implementation.

Minimum Operating Temperature: -40 °C

Suitable for operation in extreme cold conditions.

Finishing Of Terminal Used: TIN SILVER COPPER

Provides corrosion resistance and conductivity for reliable connections.

Position Of Terminal: BOTTOM

Allows for easy access and efficient routing of connections on the board.

Moisture Sensitivity Level (MSL): 3

Indicates the level of protection against moisture damage during handling and storage.

Maximum Seated Height: 1.5 mm

Low profile design for space-constrained applications.

Width: 15 mm

Compact size for versatile placement on the circuit board.

Maximum Clock Frequency: 1098 MHz

Supports high-speed operation for real-time processing requirements.

No. of Outputs: 250

Provides multiple output ports for data transmission and display.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time for reflow soldering during manufacturing.

Peak Reflow Temperature °C: 260

High reflow temperature capability for reliable solder joints.

Length: 15 mm

Compact and standardized form factor for easy integration into designs.

Grading Of Temperature: INDUSTRIAL

Suitable for use in industrial environments with extended temperature ranges.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7A15T-1CSG325I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

16640

No. of Inputs:

250

No. of Outputs:

250

No. of CLBs:

1300

Maximum Clock Frequency:

1098 MHz

CLB Maximum Delay:

1.27 ns

Organization:

1300 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.5 mm

Package Equivalence Code:

BGA325,18X18,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

325

Standards

JESD-30 Code:

S-PBGA-B325

JESD-609 Code:

e1

Trade Compliance

XC7A15T-1CSG325I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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