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XC7A12T-1CSG325C

Xilinx

XC7A12T-1CSG325C by Xilinx

The Xilinx XC7A12T-1CSG325C is a FPGA with 12800 logic cells, 1000 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

Median Price

$59.450

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Newark

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Element14

Singapore . 96 parts In-Stock

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Farnell

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Digiode

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VNN

France . 873 parts In-Stock

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Nova Conductors

Japan . 15 parts In-Stock

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AZTECH Wire

Italy . 339 parts In-Stock

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$14.329

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Modulus Dynamics

Lithuania . 607 parts In-Stock

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Vigor

Singapore . 888 parts In-Stock

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Continental Prestige Electronics

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Ampacity Inc.

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Semicontronic

India . 91 parts In-Stock

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Corphita

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Netroflash

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Microchip USA

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$42.080

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Advanced Electronics

New Zealand . 750 parts In-Stock

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Texas Native Microelectronics

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Aztec Data Supply Inc.

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Corohmni

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Kenton Components

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Qasali Group International

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Argo Parts USA

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Overview

Upgrade your projects with the XC7A12T-1CSG325C by Xilinx, a top-tier Field Programmable Gate Array that delivers unparalleled quality and performance. As a trusted manufacturer in the industry, Xilinx ensures cutting-edge technology and reliability. Perfect for a wide range of applications, this FPGA offers flexibility and customization, giving you the power to design innovative solutions tailored to your needs. Experience the value and benefits of this product, from its high-speed operation to its low power consumption, making it an essential component for any project that demands excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and lightweight, making the product easy to handle and transport.

No. of Logic Cells: 12800

With a high number of logic cells, this FPGA can handle complex algorithms and calculations efficiently.

Surface Mount: YES

Surface mount technology allows for easy and secure installation on circuit boards, saving time and ensuring a reliable connection.

Maximum Supply Voltage: 1.05 V

Operating at a lower supply voltage helps reduce power consumption and heat generation, making the product more energy-efficient.

No. of CLBs: 1000

Having a large number of Configurable Logic Blocks (CLBs) allows for versatile and flexible programming options to meet various application requirements.

Technology Used: HKMG

Utilizing High-K Metal Gate (HKMG) technology ensures improved performance, lower power consumption, and enhanced reliability of the FPGA.

No. of Inputs: 150

With a high number of inputs, the FPGA can process multiple signals simultaneously, enabling it to handle complex input/output operations efficiently.

Package Shape: SQUARE

The square package shape allows for efficient use of space on circuit boards, optimizing the layout and reducing overall system size.

Form Of Terminal: BALL

Ball terminal design provides a secure and reliable connection, reducing the risk of signal interference or loss during operation.

No. of Terminals: 325

Having a sufficient number of terminals offers versatile connectivity options for interfacing with other components in the circuit design.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array (FPGA) allows for on-the-fly reprogramming and customization, making it suitable for prototyping and flexible design.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers enhanced thermal performance, compact design, and precise signal routing in a small form factor.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage allows for operation in low-power applications and extends battery life in portable devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the FPGA can withstand harsh environmental conditions and maintain performance under extreme temperature variations.

Pitch Of Terminal: 0.8 mm

The small pitch of terminals enables a high density of connections within a limited space, improving signal integrity and reducing interference.

Maximum Combinatorial Delay of a CLB: 1.27 ns

Having a low combinatorial delay ensures fast processing of logic operations, reducing latency and improving overall system performance.

Organization: 1000 CLBS

Organizing the FPGA into 1000 Configurable Logic Blocks (CLBs) offers a structured and efficient architecture for implementing complex logic functions and algorithms.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for reliable operation in cold environments without compromising performance or functionality.

Finishing Of Terminal Used: TIN SILVER COPPER

Using a finishing of tin, silver, and copper on terminals ensures excellent conductivity, corrosion resistance, and long-term reliability of signal transmission.

Position Of Terminal: BOTTOM

Placing terminals at the bottom of the package simplifies the mounting process and improves heat dissipation, enhancing overall system thermal management.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates the level of protection against moisture absorption during handling and storage, ensuring product reliability.

Maximum Seated Height: 1.5 mm

The low maximum seated height allows for a compact design and easy integration into space-constrained applications without compromising performance or functionality.

Width: 15 mm

With a width of 15 mm, the FPGA offers a slim profile for efficient placement on circuit boards, enabling dense and optimized system configurations.

Maximum Clock Frequency: 1098 MHz

Operating at a high maximum clock frequency enables fast processing of real-time data and complex computations, making the FPGA suitable for time-critical applications.

No. of Outputs: 150

The high number of outputs allows the FPGA to drive multiple peripheral devices or components simultaneously, expanding its capabilities and connectivity options.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and rework processes during manufacturing, maintaining the product's reliability and quality.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the FPGA can withstand high-temperature soldering processes without degradation, ensuring robust mechanical and electrical connections.

Length: 15 mm

The compact length of 15 mm allows for a space-efficient design and easy integration into various electronic devices or systems, optimizing the overall layout and form factor.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7A12T-1CSG325C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

12800

No. of Inputs:

150

No. of Outputs:

150

No. of CLBs:

1000

Maximum Clock Frequency:

1098 MHz

CLB Maximum Delay:

1.27 ns

Technology:

HKMG

Organization:

1000 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.5 mm

Package Equivalence Code:

BGA325,18X18,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

325

Standards

JESD-30 Code:

S-PBGA-B325

JESD-609 Code:

e1

Trade Compliance

XC7A12T-1CSG325C Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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