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XCKU060-2FFVA1517I

Xilinx

XCKU060-2FFVA1517I by Xilinx

Xilinx XCKU060-2FFVA1517I FPGA offers 725550 logic cells, 2760 CLBs, and 624 inputs/outputs. Ideal for industrial applications requiring high-performance computing with a wide operating temperature range from -40 to 100°C. Package style is grid array with moisture sensitivity level of 4.

Median Price

$5,794.540

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Farnell

UK . 2 parts In-Stock

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Newark

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Mouser Electronics

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DigiKey

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Element14

Singapore . 2 parts In-Stock

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Digiode

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VNN

France . 459 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Vyrian

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Touchstone Systems

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J2 Sourcing AB

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Sunrise Surplus Inc.

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AZTECH Wire

Italy . 573 parts In-Stock

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$6.982

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Aztec Data Supply Inc.

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Modulus Dynamics

Lithuania . 240 parts In-Stock

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Texas Native Microelectronics

USA . 515 parts In-Stock

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$120.251

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Advanced Electronics

New Zealand . 1,362 parts In-Stock

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$140.378

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Corohmni

South Africa . 892 parts In-Stock

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Qasali Group International

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One Stop Electronics

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Ampacity Inc.

Singapore . 2 parts In-Stock

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Semicontronic

India . 2 parts In-Stock

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Corphita

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Continental Prestige Electronics

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Aranea Global

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Argo Parts USA

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MARBEL Systems

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Kenton Components

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GreenTree Electronics

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Supply Digital

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Overview

Unlock the power of innovation with the XCKU060-2FFVA1517I from Xilinx, a leading manufacturer in the field programmable gate array (FPGA) category. Boasting 725550 logic cells and 2760 CLBs, this FPGA offers unparalleled versatility for a wide range of applications. With a square package body material made of PLASTIC/EPOXY and a unique GRID ARRAY package style, this product provides customers with the quality and reliability they need. Experience the benefits of seamless integration, high performance, and cutting-edge technology that only Xilinx can deliver. Elevate your projects to new heights with the XCKU060-2FFVA1517I FPGA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

No. of Logic Cells: 725550

Having a high number of logic cells allows for complex programmable logic designs to be implemented.

Surface Mount: YES

Surface mount technology simplifies the assembly process and saves space on the PCB.

Maximum Supply Voltage: 0.979 V

The low maximum supply voltage helps in reducing power consumption and heat dissipation.

No. of CLBs: 2760

The high number of Configurable Logic Blocks (CLBs) indicates a high level of programmability and flexibility.

No. of Inputs: 624

Having a large number of inputs allows for multiple signals to be processed simultaneously.

Package Shape: SQUARE

The square package shape facilitates easier mounting and alignment on the PCB.

Form Of Terminal: BALL

Ball terminals improve electrical contact and reliability.

Nominal Supply Voltage (V): 0.95

The nominal supply voltage provides a stable operating voltage for the FPGA.

Power Supplies (V): 0.95

Consistent power supply voltage ensures reliable and stable performance.

No. of Terminals: 1517

A high number of terminals allow for more connections and versatility in circuit design.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array allows for customization and reprogramming of logic functions as needed.

Package Style (Meter): GRID ARRAY

Grid array package style offers high density and efficient routing of signals.

Minimum Supply Voltage: 0.922 V

The low minimum supply voltage ensures reliable operation even at lower power levels.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature allows for operation in a wide range of environments.

Pitch Of Terminal: 1 mm

The close terminal pitch enables a high number of connections in a limited space.

Organization: 2760 CLBS

The organized structure of 2760 Configurable Logic Blocks provides a systematic approach to design implementation.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation even in extreme cold conditions.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper for terminal finishing improves conductivity and corrosion resistance.

Position Of Terminal: BOTTOM

Having terminals at the bottom allows for easier mounting and connection to the PCB.

Moisture Sensitivity Level (MSL): 4

A moisture sensitivity level of 4 indicates the level of protection required during handling and storage.

Maximum Seated Height: 3.51 mm

The low seated height makes the FPGA suitable for applications with height constraints.

Width: 40 mm

The compact width allows for space-efficient placement on the PCB.

No. of Outputs: 624

A high number of outputs enable the FPGA to drive multiple external devices.

Maximum Time At Peak Reflow Temperature (s): 30

The FPGA can withstand peak reflow temperatures for a significant duration during the assembly process.

Peak Reflow Temperature °C: 245

The peak reflow temperature of 245°C ensures proper soldering and reliability of connections.

Length: 40 mm

The length of 40 mm provides a compact form factor for space-constrained designs.

Grading Of Temperature: INDUSTRIAL

Being rated for industrial temperature grades makes the FPGA suitable for rugged applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCKU060-2FFVA1517I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

725550

No. of Inputs:

624

No. of Outputs:

624

No. of CLBs:

2760

Sub-Category:

Field Programmable Gate Arrays

Organization:

2760 CLBS

Power Characteristics

Nominal Supply Voltage:

.95

Minimum Supply Voltage:

.922 V

Maximum Supply Voltage:

.979 V

Power Supplies:

0.95 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

40 mm

Width:

40 mm

Maximum Seated Height:

3.51 mm

Package Equivalence Code:

BGA1517,39X39,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1517

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XCKU060-2FFVA1517I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.7.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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