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10M25DAF484C8G

Intel

10M25DAF484C8G by Intel

The Intel 10M25DAF484C8G FPGA features 25000 logic cells, 1563 CLBs, and 360 inputs/outputs. It operates at a max supply voltage of 1.25V and is suitable for applications requiring high-performance programmable ICs in a compact square package with surface mount capability.

Median Price

$102.190

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DigiKey

USA . 17 parts In-Stock

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Nova Conductors

Japan . 84 parts In-Stock

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Digiode

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Vyrian

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Chip Stock

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Cyclops Electronics Ltd

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VNN

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RLX Solution Inc.

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Prism Electronics

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AZTECH Wire

Italy . 765 parts In-Stock

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$10.101

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MARBEL Systems

Belgium . 230 parts In-Stock

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Texas Native Microelectronics

USA . 3,291 parts In-Stock

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Kenton Components

USA . 45 parts In-Stock

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Vigor

Singapore . 10 parts In-Stock

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Qasali Group International

UK . 263 parts In-Stock

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Modulus Dynamics

Lithuania . 1,218 parts In-Stock

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Continental Prestige Electronics

USA . 3,099 parts In-Stock

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Microchip USA

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Ampacity Inc.

Singapore . 124 parts In-Stock

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Semicontronic

India . 124 parts In-Stock

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Corphita

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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Corohmni

South Africa . 123 parts In-Stock

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One Stop Electronics

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Lixinc

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A-Z Elektronik GmbH

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Futuretech Components

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Argo Parts USA

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Supply Digital

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GreenTree Electronics

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Netroflash

USA . 100 parts In-Stock

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Perfect Parts

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Overview

Unlock endless possibilities with the Intel 10M25DAF484C8G FPGA, a cutting-edge solution for high-performance applications. Manufactured by Intel, a renowned industry leader, this Field Programmable Gate Array offers unparalleled quality and reliability. With 25,000 logic cells and 1563 CLBs, this FPGA provides unmatched flexibility and customization. Ideal for a wide range of applications, this product is designed to meet your unique needs with ease. Experience the value and benefits of Intel technology with the 10M25DAF484C8G FPGA - the ultimate choice for innovation and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is lightweight and durable, making this FPGA easy to handle and suitable for a variety of applications.

No. of Logic Cells: 25000

A large number of logic cells provide high flexibility and capability for complex processing tasks.

Maximum Supply Voltage: 1.25 V

The maximum supply voltage of 1.25V ensures safe operation and protects the FPGA from potential damage due to voltage spikes.

No. of CLBs: 1563

The 1563 configurable logic blocks enable versatile design options and efficient implementation of logic functions.

No. of Inputs: 360

With 360 inputs, this FPGA can handle a wide range of input signals, enhancing its ability to interface with external devices.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a circuit board and facilitates easy mounting and integration.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage of 1.2V ensures stable and reliable operation of the FPGA within its specified voltage range.

Power Supplies (V): 1.2

Having consistent power supplies at 1.2V ensures consistent performance and avoids issues related to varying power levels.

No. of Terminals: 484

The large number of terminals provide ample connectivity options, facilitating easy integration of the FPGA into a system.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable gate array allows for customization and reconfiguration of the logic functions, making it adaptable to changing requirements.

Package Style (Meter): GRID ARRAY

The grid array package style offers a compact and organized layout, making it easy to route connections and optimize signal flow.

Minimum Supply Voltage: 1.15 V

The minimum supply voltage of 1.15V ensures the FPGA can operate within a range of voltages, providing flexibility in power supply options.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows the FPGA to operate reliably in demanding environmental conditions.

Pitch Of Terminal: 1 mm

The 1mm pitch of terminals enables precise and compact mounting of the FPGA on a PCB, optimizing space utilization.

Organization: 1563 CLBS

The organized structure of 1563 configurable logic blocks simplifies design implementation and enhances efficiency in logic functions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures the FPGA can function reliably in a wide range of temperature conditions.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn/Ag/Cu)

The use of tin/silver/copper finishing on terminals provides excellent conductivity and corrosion resistance for reliable connections.

Position Of Terminal: BOTTOM

The bottom position of terminals simplifies the PCB layout and improves thermal management by allowing heat dissipation through the bottom.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that the FPGA can withstand moderate exposure to moisture during storage and assembly.

Maximum Seated Height: 2 mm

The maximum seated height of 2mm ensures a compact form factor, making this FPGA suitable for space-constrained applications.

Width: 23 mm

The compact width of 23mm allows for easy integration of the FPGA into a system without occupying excessive space on the PCB.

No. of Outputs: 360

Having 360 outputs enables the FPGA to drive multiple external devices and communicate with other components effectively.

Length: 23 mm

The 23mm length offers a balanced form factor, making this FPGA suitable for a variety of applications without compromising on performance.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10M25DAF484C8G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

25000

No. of Inputs:

360

No. of Outputs:

360

No. of CLBs:

1563

Sub-Category:

Field Programmable Gate Arrays

Organization:

1563 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Power Supplies:

1.2 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

10M25DAF484C8G Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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