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10M25DAF484A7G

Intel

10M25DAF484A7G by Intel

Intel's 10M25DAF484A7G FPGA features 25000 logic cells, 1563 CLBs, and 360 inputs/outputs. With a package style of grid array and programmable IC type, it is ideal for automotive applications requiring high performance in a compact form factor.

Median Price

$158.980

Lifecycle Status

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6

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1k+

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DigiKey

USA . 95 parts In-Stock

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$158.980

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$127.182

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Nova Conductors

Japan . 68 parts In-Stock

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$118.867

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Digiode

USA . 451 parts In-Stock

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Vyrian

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Chip Stock

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VNN

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AZTECH Wire

Italy . 657 parts In-Stock

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$10.954

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MARBEL Systems

Belgium . 10 parts In-Stock

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$48.750

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$46.800

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Texas Native Microelectronics

USA . 5,592 parts In-Stock

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$56.035

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$53.794

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$52.113

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Kenton Components

USA . 15,377 parts In-Stock

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$67.242

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Corohmni

South Africa . 159 parts In-Stock

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Advanced Electronics

New Zealand . 4,474 parts In-Stock

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$112.694

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$92.409

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Continental Prestige Electronics

USA . 3,974 parts In-Stock

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One Stop Electronics

USA . 65 parts In-Stock

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$122.850

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Ampacity Inc.

Singapore . 65 parts In-Stock

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Aztec Data Supply Inc.

USA . 951 parts In-Stock

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Corphita

USA . 989 parts In-Stock

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Microchip USA

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Semicontronic

India . 65 parts In-Stock

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$267.380

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$260.696

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$259.359

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Argo Parts USA

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Supply Digital

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Qasali Group International

UK . 437 parts In-Stock

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$288.884

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$264.810

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Overview

Unlock boundless possibilities with the 10M25DAF484A7G by Intel, a high-quality Field Programmable Gate Array that offers unmatched flexibility and performance. Manufactured by industry leader Intel, this FPGA is designed to revolutionize your projects with its 25000 logic cells, 1563 CLBs, and 360 inputs and outputs. Whether you're in automotive, industrial, or consumer electronics, this versatile device provides endless solutions tailored to your needs. Experience the advantages of Intel's cutting-edge technology and elevate your designs to new heights with the 10M25DAF484A7G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the FPGA lightweight and durable, ideal for use in various applications.

No. of Logic Cells: 25000

With 25,000 logic cells, this FPGA has a high capacity for complex logic functions, making it suitable for advanced applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 1.25 V

The maximum supply voltage of 1.25 V ensures safe operation and protection of the FPGA components.

No. of CLBs: 1563

With 1563 Configurable Logic Blocks (CLBs), this FPGA offers flexibility and versatility in implementing different logic functions.

No. of Inputs: 360

Having 360 inputs allows for a high degree of input flexibility, making the FPGA suitable for a wide range of applications.

Package Shape: SQUARE

The square package shape is compact and space-efficient, making it easy to integrate the FPGA into various device designs.

Form Of Terminal: BALL

The ball terminal form provides secure connections and reliable contact, ensuring stable performance of the FPGA.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage of 1.2 V is within a safe operating range for the FPGA, ensuring stability and reliability.

No. of Terminals: 484

Having 484 terminals allows for adequate connectivity options and easy integration into circuit designs.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a Field Programmable Gate Array, this IC type offers flexibility in design and functionality, making it suitable for prototyping and production.

Package Style (Meter): GRID ARRAY

The grid array package style provides a high density of terminals and compact layout, optimizing space usage on the PCB.

Minimum Supply Voltage: 1.15 V

The minimum supply voltage of 1.15 V ensures compatibility with lower voltage systems while maintaining performance.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this FPGA can withstand high-temperature environments and operating conditions.

Pitch Of Terminal: 1 mm

The 1 mm pitch of terminals allows for precise and compact layout of connections, optimizing space on the PCB.

Organization: 1563 CLBS

The organizational structure of 1563 CLBs provides a balance between logic capacity and flexibility, ideal for a wide range of applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this FPGA can operate reliably in cold environments or extreme conditions.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn/Ag/Cu)

The finishing of terminals with tin, silver, and copper provides corrosion resistance and reliable connections, ensuring long-term performance.

Position Of Terminal: BOTTOM

The terminals positioned at the bottom facilitate easy integration and soldering onto the PCB, improving manufacturing efficiency.

Maximum Seated Height: 2 mm

With a maximum seated height of 2 mm, this FPGA is compact and space-efficient, ideal for slim device designs.

Width: 23 mm

The 23 mm width of the FPGA allows for easy integration into standard PCB layouts and enclosure designs.

No. of Outputs: 360

Having 360 outputs provides flexibility in routing signals and connecting to external components, enhancing the versatility of the FPGA.

Length: 23 mm

The 23 mm length of the FPGA ensures a compact form factor, suitable for space-constrained applications without compromising performance.

Grading Of Temperature: AUTOMOTIVE

With automotive-grade temperature grading, this FPGA is designed to withstand automotive environments and stringent temperature requirements, ensuring reliable operation in vehicle applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10M25DAF484A7G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

25000

No. of Inputs:

360

No. of Outputs:

360

No. of CLBs:

1563

Organization:

1563 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Trade Compliance

10M25DAF484A7G Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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