Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Intel 10M25DCF484I7G is a Field Programmable Gate Array (FPGA) with 25000 logic cells. It has a max supply voltage of 1.25V and can operate at temperatures up to 100°C. This FPGA is commonly used in industrial applications requiring programmable ICs for high-performance computing.
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The use of plastic/epoxy as the package body material ensures durability and protection for the FPGA, making it resistant to damage from external factors. This makes it a reliable choice for various applications.
With a high number of logic cells, this FPGA offers ample capacity for complex designs and allows for the implementation of intricate digital logic functions. It provides versatility and flexibility for diverse applications.
The surface mount capability of this FPGA simplifies and speeds up the assembly process, making it easier to integrate into electronic systems. It is a convenient feature for efficient manufacturing and integration.
The high maximum supply voltage of 1.25 V allows for reliable operation and stable performance within the specified limits. This ensures proper functionality and suitability for a wide range of power supply systems.
With a substantial number of configurable logic blocks (CLBs), this FPGA offers extensive resources for implementing complex digital systems. It enables the efficient implementation of designs with significant computational requirements.
The large number of inputs provides ample connectivity options, allowing for the processing and integration of numerous data signals. This supports the development of advanced and intricate digital logic designs.
The square package shape is a standard form factor that enables easy handling, placement, and integration of the FPGA into electronic systems. It is a practical and widely adopted package shape.
The use of ball terminals simplifies the soldering process and enhances the mechanical stability of the FPGA connections. It ensures reliable electrical contacts and robust interconnectivity.
The specified nominal supply voltage of 1.2 V ensures compatibility with various power supply systems and facilitates reliable operation. It provides flexibility and ease of integration into existing designs.
The availability of multiple power supplies at 1.2 V enables separate and efficient power management for different functional segments of the FPGA. It enhances power efficiency and performance reliability.
The abundance of terminals facilitates diverse connections and enables seamless integration with other components and systems. It allows for versatile usage and compatibility across different applications.
Being a field-programmable gate array, this IC type offers immense flexibility and adaptability by allowing users to customize and reconfigure the digital logic functions. It provides opportunities for rapid prototyping and system reconfiguration.
The grid array package style ensures ease of mounting and superior mechanical strength, making it suitable for applications with demanding environmental conditions. It offers robustness and reliability.
The low minimum supply voltage of 1.15 V allows for efficient power management and potential energy savings. It enables operation in low-voltage environments while maintaining optimal performance.
The high maximum operating temperature of 100°C ensures that the FPGA can withstand demanding thermal environments without compromising its functionality. It extends the range of potential applications.
The 1 mm terminal pitch provides appropriate spacing for accurate and reliable connections. It allows for efficient integration and supports ease of assembly processes.
The organization of 1563 configurable logic blocks (CLBs) within the FPGA enhances design versatility and accommodates complex digital logic requirements. It offers extensive computational resources for various applications.
The low minimum operating temperature of -40°C ensures the FPGA's reliable performance in harsh and extreme cold environments. It allows for expanded application possibilities.
The use of tin/silver/copper as terminal finishing materials enhances the FPGA's corrosion resistance and ensures robust electrical connections. It provides longevity and reliability in different operating conditions.
The terminals located at the bottom of the package enable efficient and reliable connection to other system components or circuit boards. This positioning facilitates convenient integration and maintenance.
With an MSL of 3, this FPGA has moderate sensitivity to moisture. It requires appropriate handling and storage procedures to prevent potential damage during manufacturing and assembly processes.
The maximum seated height of 2 mm allows for compact and space-efficient placement of the FPGA within electronic systems. It supports design optimization and space-saving applications.
With a width of 23 mm, this FPGA offers a compact form factor suitable for space-constrained applications. It provides flexibility and ease of integration into diverse system designs.
The abundant number of outputs allows for the dissemination of digital signals to other components or subsystems. It facilitates seamless integration and exchange of data within complex digital systems.
The length of 23 mm contributes to the FPGA's compact and standardized form factor, making it compatible with an extensive range of applications. It supports ease of integration and design flexibility.
Being graded for industrial temperature ranges, this FPGA operates reliably under harsh conditions, including extreme temperature variations. It ensures performance stability in rugged environments.
Field Programmable Gate Arrays (FPGA) 10M25DCF484I7G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel
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10M25DCF484I7G Programmable ICs trade compliance attributes, and parameters.
ECCN
3A991
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Max10 Pin Guide 3/Dec/2021 Mult Dev Software Chgs 3/Jun/2021
PCN Packaging - Mult Dev Label CHG 24/Jan/2020 Mult Dev Label Chgs 24/Feb/2020
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
BAV99
Vishay Telefunken
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WSF-7
Diodes Incorporated
1N4148WSF-7 by Diodes Inc. is a single silicon rectifier diode with max output current of 0.25A and max reverse voltage of 100V. It operates b/w -55 to 150°C, has a small outline package style, and is suitable for surface mount applications in various electronic circuits.
SMBJ18CA
Zowie Technology
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Rectron
1N4148WS
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358AN
STMicroelectronics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
M39029/58360
Souriau
CONNECTOR ACCESSORY; Associated Military - Specifications: MIL-DTL-38999; Tool Settings: M22520/2-09; Terminal Type: CRIMP; MIL Conformity: YES; Mating Contacts: M39029/56348;
RN41N-I/RM
Microchip Technology
Microchip Technology's RN41N-I/RM is a telecom IC with 35 terminals, operating from -40 to 85°C. It has a supply voltage of 3.3V and is surface mountable in industrial applications. The package style is rectangular, measuring 13.2mm x 20.1mm with a seated height of 2.2mm, suitable for telecom interface functions.
1N4148
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Tak Cheong Electronics Holdings
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM7805CT/NOPB
National Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Voltage Tolerance: 5 %; Operating Temperature (TJ-Max): 125 Cel; Maximum Output Voltage-1: 5.25 V;
1N5819HW-7-F
SPC TECHNOLOGY/ MULTICOMP
Weitron Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; Maximum Output Current: .215 A; JESD-609 Code: e0; Maximum Forward Voltage (VF): .715 V;
SSL-LXA228SRC-TR11
Lumex
SSL-LXA228SRC-TR11 by Lumex is a 1.9mm SINGLE COLOR LED with peak wavelength of 660nm and max forward current of 0.03A. Ideal for applications requiring SUPER RED light emission, such as indicator lights in electronic devices due to its clear lens and surface mounting feature.
American Power Devices
NUP2105LT1G
Onsemi
NUP2105LT1G by Onsemi is a Transient Suppression Device with 350W power dissipation, 29.1V breakdown voltage, and 44V clamping voltage. Commonly used in electronic circuits for surge protection due to its bidirectional polarity and silicon diode element material.
Promax-johnton
ULN2803A
Texas Instruments
ULN2803A by Texas Instruments is a peripheral driver with 8 functions. It has a max supply voltage of 3V and can operate in temperatures ranging from -40 to 85°C. This IC is commonly used as a buffer or inverter based peripheral driver for various applications.
2N2222A
Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
XCAU10P-1UBVA368E
Xilinx
FIELD PROGRAMMABLE GATE ARRAY;
5CEBA7F23C8N
Altera
The Altera 5CEBA7F23C8N is a Field Programmable Gate Array (FPGA) with a maximum supply voltage of 1.13V. It is a plastic/epoxy package with surface mount capabilities and a square shape. The FPGA has 484 terminals and a nominal supply voltage of 1.1V. It operates in temperatures ranging from 0 to 85 degrees Celsius. The package style is a grid array with a pitch of 1mm. Its compact size, wide temperature range, and programmability make it suitable for various applications requiring high-speed digital signal processing and data storage.
M1AGL250V5-FGG144I
M1AGL250V5-FGG144I by Microchip Technology is a CMOS FPGA with 6144 logic cells and 97 inputs/outputs. Operating b/w -40 to 100°C, it has a max supply voltage of 1.575 V and offers 250000 equivalent gates. Ideal for industrial applications requiring high gate count and low profile grid array packaging.
XC7S75-1FGGA484I
Xilinx XC7S75-1FGGA484I FPGA features 76800 logic cells, 6000 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact square package with surface mount technology.
LAE5UM-45F-6BG381E
Lattice Semiconductor
FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260;
M1A3P250-PQG208
Actel
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
10M08DCF256C8G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
LFE5U-12F-7BG256I
FIELD PROGRAMMABLE GATE ARRAY; Finishing Of Terminal Used: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1;
LFE5U-45F-7BG256I
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3;
EP3C10F256I7N
Intel
EP3C10F256I7N by Intel is a CMOS-based FPGA with 10320 logic cells and 182 inputs/outputs. It operates at a max clock frequency of 472.5 MHz and is commonly used in industrial applications requiring programmable ICs for high-speed data processing.
XC7A50T-2FGG484I
Xilinx XC7A50T-2FGG484I FPGA features 52160 logic cells, 4075 CLBs, and max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with CMOS technology.
5CGXFC7D6F31I7N
Intel's 5CGXFC7D6F31I7N FPGA features 150,000 logic cells and 5648 CLBs. With a max supply voltage of 1.13V, it is ideal for applications requiring high-speed processing and programmable ICs in various industries. The package body material is plastic/epoxy with a square shape and grid array style, making it suitable for surface mount installations with a pitch of 1mm.
LFE5UM-85F-8BG554C
FIELD PROGRAMMABLE GATE ARRAY; JESD-609 Code: e1; Finishing Of Terminal Used: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260;
XCAU15P-2SBVB484E
XC7A35T-3FTG256E
Xilinx XC7A35T-3FTG256E is a FPGA with 33280 logic cells, 2600 CLBs, and max clock frequency of 1412 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
M1A3P1000-FGG256I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
EP3C55F484I7N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: RECTANGULAR;
10M50SAE144I7G
The Intel 10M50SAE144I7G is a FPGA with 50000 logic cells, 3125 CLBs, and 500 inputs/outputs. Ideal for industrial applications requiring high performance in a compact package with a max supply voltage of 3.15 V and operating temperature range from -40 to 100 °C.
5CEBA4F17C8N
Intel's 5CEBA4F17C8N FPGA boasts 49000 logic cells, 128 inputs/outputs, and operates at a max supply voltage of 1.13V. Ideal for applications requiring high-speed data processing and complex algorithm implementations in various industries.
XC7A35T-1FTG256C
Xilinx XC7A35T-1FTG256C is a FPGA with 33280 logic cells, 2600 CLBs, and max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems. Package style: Grid Array, low profile, fine pitch.
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10M25SAE144I7G
Intel 10M25SAE144I7G is a 25000 logic cells FPGA with 1563 CLBs and 360 inputs/outputs. Operating at -40 to 100 °C, it's ideal for industrial applications requiring high-speed data processing in compact form factors. The package features a square shape, gull wing terminals, and low profile design for surface mount assembly.
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
10M25DAF256I7G
The 10M25DAF256I7G by Altera is a PLASTIC/EPOXY FPGA with 25000 logic cells, CMOS technology, and 178 inputs/outputs. It comes in a BGA package with 256 terminals and a pitch of 1mm. This FPGA operates at a nominal supply voltage of 1.2V and is suitable for various applications requiring programmable ICs.
The Intel 10M25DAF256I7G is a FPGA with 25000 logic cells, 1563 CLBs, and 360 inputs/outputs. It operates at temperatures from -40 to 100 °C and has a supply voltage range of 1.15-1.25 V. Ideal for industrial applications requiring high-performance programmable ICs in a compact square package with grid array style terminals.
10M25DAF484I7G
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
The Intel 10M25DAF484I7G is a FPGA with 25000 logic cells, 1563 CLBs, and 360 inputs/outputs. It operates at temperatures from -40 to 100 °C and has a supply voltage range of 1.15-1.25 V. Ideal for industrial applications requiring high-performance programmable ICs in a compact square grid array package.
10M25SAE144C8G
Intel's 10M25SAE144C8G FPGA features 25000 logic cells, 1563 CLBs, and 360 inputs/outputs. With a max supply voltage of 3.15V, it is ideal for applications requiring high-performance programmable ICs in commercial extended temperature environments.
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE;
10M25DAF256C8G
The Intel 10M25DAF256C8G is a FPGA with 25000 logic cells, 1563 CLBs, and 360 inputs/outputs. It operates at a voltage range of 1.15V to 1.25V and has a temperature range of 0°C to 85°C. This FPGA is suitable for applications requiring high-speed processing and programmable logic capabilities in various electronic systems.
10M25SAE144C8GES
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
10M25DCF484A7G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
10M25DAF484A7G
10M25DAF484C8G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
10M25DCF484I7G
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;
10M25DCF484C7P
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL EXTENDED; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
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