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10M25DCF484A7G

Intel

10M25DCF484A7G by Intel

Intel's 10M25DCF484A7G FPGA features 25000 logic cells, 1563 CLBs, and 360 inputs/outputs. With a package style of GRID ARRAY and PLASTIC/EPOXY material, it is ideal for automotive applications requiring high performance in a compact form factor. Operating b/w -40 to 125 °C, this FPGA offers versatility and reliability for various electronic systems.

Median Price

$109.112

Lifecycle Status

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6

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1k+

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Nova Conductors

Japan . 100 parts In-Stock

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Digiode

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Vyrian

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VNN

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Chip Stock

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Sensible Micro Corp

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AZTECH Wire

Italy . 624 parts In-Stock

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Aztec Data Supply Inc.

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Corohmni

South Africa . 19 parts In-Stock

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Aranea Global

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Continental Prestige Electronics

USA . 288 parts In-Stock

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Semicontronic

India . 51 parts In-Stock

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Ampacity Inc.

Singapore . 7 parts In-Stock

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Texas Native Microelectronics

USA . 8,343 parts In-Stock

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Corphita

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Component Stockers USA

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Advanced Electronics

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Microchip USA

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Argo Parts USA

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MARBEL Systems

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Supply Digital

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Qasali Group International

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Kenton Components

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Overview

Unlock limitless possibilities with the Intel 10M25DCF484A7G FPGA! Crafted by the renowned manufacturer Intel, this cutting-edge Field Programmable Gate Array boasts 25,000 logic cells and 360 inputs/outputs, delivering unparalleled performance in a compact square package. Ideal for automotive applications, this FPGA offers the flexibility to adapt to evolving technology needs. Elevate your projects with the superior quality and reliability of Intel, and experience the enhanced efficiency and innovation that this product brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the FPGA, making it suitable for a variety of environments.

No. of Logic Cells: 25000

The high number of logic cells allows for complex designs and computations to be implemented efficiently.

Surface Mount: YES

Surface mount compatibility makes for easy and convenient installation in electronic devices.

Maximum Supply Voltage: 1.25 V

The maximum supply voltage of 1.25V ensures safe operation without risking damage to the FPGA.

No. of CLBs: 1563

With 1563 configurable logic blocks, there is ample room for custom logic design and implementation in the FPGA.

No. of Inputs: 360

Having 360 inputs enables the FPGA to interface with a wide range of external devices and sensors.

Package Shape: SQUARE

The square package shape allows for efficient use of space and easy integration into electronic systems.

Form Of Terminal: BALL

The use of ball terminals simplifies the installation and connection process of the FPGA.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage of 1.2V ensures stable and efficient operation of the FPGA.

No. of Terminals: 484

Having 484 terminals provides ample connectivity options for interfacing with other components in a system.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable gate array allows for flexibility in design and reconfiguration without the need for specialized manufacturing.

Package Style (Meter): GRID ARRAY

The grid array package style offers a high level of connectivity and customization options for the FPGA.

Minimum Supply Voltage: 1.15 V

The minimum supply voltage of 1.15V ensures the FPGA can operate efficiently while conserving power.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C makes this FPGA suitable for use in a variety of industrial and automotive applications.

Pitch Of Terminal: 1 mm

The 1mm pitch of the terminals allows for compact and efficient PCB design when integrating the FPGA.

Organization: 1563 CLBS

With 1563 Configurable Logic Blocks, the organization of the FPGA allows for complex logic design and implementation.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the FPGA can function reliably in cold environments.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn/Ag/Cu)

The use of tin, silver, and copper finishes on the terminals ensures good conductivity and reliability in connections.

Position Of Terminal: BOTTOM

Having terminals on the bottom of the package allows for more efficient board layout and space utilization.

Maximum Seated Height: 2 mm

The low maximum seated height of 2mm allows for compact and slim designs when integrating the FPGA into devices.

Width: 23 mm

The compact width of 23mm allows for easy integration of the FPGA into a variety of electronic systems.

No. of Outputs: 360

Having 360 outputs allows the FPGA to communicate data and signals to external components efficiently.

Length: 23 mm

The compact length of 23mm makes this FPGA suitable for space-constrained applications.

Grading Of Temperature: AUTOMOTIVE

The automotive grade temperature rating ensures the FPGA can withstand harsh environmental conditions in automotive applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10M25DCF484A7G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

25000

No. of Inputs:

360

No. of Outputs:

360

No. of CLBs:

1563

Organization:

1563 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Trade Compliance

10M25DCF484A7G Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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