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1SG280HN1F43E1VG

Intel

1SG280HN1F43E1VG by Intel

Intel's 1SG280HN1F43E1VG FPGA boasts 2753000 logic cells, 344125 CLBs, and 704 inputs/outputs. Ideal for applications requiring high-speed data processing and complex algorithm implementation in industries like telecommunications, aerospace, and automotive.

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Vyrian

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Nova Conductors

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AZTECH Wire

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Ampacity Inc.

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MARBEL Systems

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Texas Native Microelectronics

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Kenton Components

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Qasali Group International

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Aztec Data Supply Inc.

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Continental Prestige Electronics

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Overview

Unleash the power of cutting-edge technology with the 1SG280HN1F43E1VG by Intel, a high-quality Field Programmable Gate Array designed to elevate your projects to new heights. With over 2.7 million logic cells and 344,125 CLBs, this FPGA offers unparalleled flexibility and performance for a wide range of applications. Intel's reputation for excellence ensures that you're investing in top-tier reliability and innovation. Experience seamless integration, lightning-fast speeds, and endless possibilities with the 1SG280HN1F43E1VG. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This plastic/epoxy material provides durability and protection for the FPGA, ensuring reliable performance in various environments.

No. of Logic Cells: 2753000

With a large number of logic cells, this FPGA is capable of handling complex processing tasks and intricate algorithms efficiently.

Surface Mount: YES

The surface mount feature allows for easy installation on circuit boards, making it convenient for electronic system integration.

No. of CLBs: 344125

Having a high number of Configurable Logic Blocks (CLBs) enables versatile logic configurations and flexible programming options.

No. of Inputs: 704

The FPGA offers a large number of input options, allowing for a wide range of data sources and input signals to be processed.

Package Shape: SQUARE

The square package shape is space-efficient and promotes easy integration into circuit designs with minimal wasted space.

Form Of Terminal: BALL

The ball terminal form provides secure connections and reliable signal transmission between the FPGA and other components in the system.

No. of Terminals: 1760

With a high number of terminals, this FPGA offers plenty of connectivity options for interfacing with external devices and peripherals.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a Field Programmable Gate Array, this IC type allows for reprogramming and customization of logic functions, making it versatile for various applications.

Package Style (Meter): GRID ARRAY

The grid array package style provides a structured and organized layout for the terminals, facilitating easier installation and maintenance.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this FPGA can withstand demanding thermal conditions without compromising performance.

Pitch Of Terminal: 1 mm

The 1mm terminal pitch allows for precise alignment and easy soldering during assembly, ensuring reliable electrical connections.

Organization: 344125 CLBS

The organization of 344125 Configurable Logic Blocks provides a structured architecture for implementing complex logic functions efficiently.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in challenging temperature environments, enhancing the FPGA's durability.

Position Of Terminal: BOTTOM

Having terminals positioned at the bottom facilitates easier routing and connection of signals, optimizing the layout of the FPGA on the circuit board.

Maximum Seated Height: 3.881 mm

With a low maximum seated height, this FPGA can be integrated into compact electronic devices without adding excessive thickness to the design.

Width: 42.5 mm

The compact width of 42.5mm makes this FPGA suitable for applications where space is limited, optimizing the use of available board real estate.

No. of Outputs: 704

The FPGA offers a high number of output options, enabling it to drive multiple devices or subsystems simultaneously for enhanced functionality.

Length: 42.5 mm

With a length of 42.5mm, this FPGA is compact and can be easily accommodated in tight spaces within electronic systems, maximizing design flexibility.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 1SG280HN1F43E1VG attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

2753000

No. of Inputs:

704

No. of Outputs:

704

No. of CLBs:

344125

Organization:

344125 CLBS

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

42.5 mm

Width:

42.5 mm

Maximum Seated Height:

3.881 mm

Package Equivalence Code:

BGA1760,42X42,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1760

Trade Compliance

1SG280HN1F43E1VG Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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