Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Intel's 1SG280HU2F50E2VG FPGA boasts 2753000 logic cells, 344125 CLBs, and 736 inputs/outputs. Ideal for applications requiring high-speed data processing and complex algorithm implementations in fields like telecommunications, aerospace, and industrial automation.
Median Price
-
Lifecycle Status
Suppliers In-Stock
5
In-Stock Inventory
1k+
Vyrian
1+ parts
100+ parts
1k+ parts
10k+ parts
Chip Stock
Digiode
Nova Conductors
VNN
Ampacity Inc.
$13.000
AZTECH Wire
$17.680
Texas Native Microelectronics
$177.705
$156.380
Kenton Components
$213.246
$204.716
$198.319
$187.656
Qasali Group International
$479.804
$446.217
Microchip USA
$33,914.763
MARBEL Systems
Continental Prestige Electronics
Argo Parts USA
Corphita
Aranea Global
Robosynatics
Lucentia Tech
$119.939
$111.064
The use of plastic/epoxy material makes the FPGA lightweight and durable, perfect for portable electronics.
The high number of logic cells allows for complex logic functions to be implemented in the FPGA, making it versatile for a wide range of applications.
Surface mount capability makes it easy to integrate the FPGA onto a circuit board, simplifying the manufacturing process.
With a large number of Configurable Logic Blocks (CLBs), this FPGA can support intricate logic designs and algorithms.
The high number of inputs allows for a large amount of data to be processed simultaneously, increasing the efficiency of the FPGA.
Square package shape ensures easy placement and alignment on the circuit board, saving space and enabling efficient layout.
The ball terminals provide a reliable connection to the circuit board, ensuring secure and stable operation of the FPGA.
With a high number of terminals, the FPGA can support a complex network of connections, enabling versatile functionality.
Being a field programmable device, this FPGA allows for flexible reprogramming and customization, making it adaptable to changing requirements.
The grid array package style offers a high-density configuration, allowing for a large number of logic elements to be packed in a compact space.
With a high maximum operating temperature, this FPGA can withstand demanding thermal conditions, ensuring reliable performance in various environments.
The small pitch of terminals allows for close spacing on the circuit board, enabling efficient routing and saving space in the overall design.
Organized into 344125 Configurable Logic Blocks, this FPGA provides a structured architecture for implementing complex logic functions and algorithms.
With a low minimum operating temperature, this FPGA can function reliably in cold environments, offering versatility in various operating conditions.
Having terminals positioned at the bottom simplifies the assembly process and allows for easy access during integration onto the circuit board.
The low maximum seated height ensures that the FPGA can fit comfortably in compact electronic devices, without adding significant bulk.
With a standard width of 50mm, this FPGA can easily fit into standard PCB layouts, facilitating straightforward integration into electronic systems.
The high number of outputs allows for multiple signals or data streams to be generated simultaneously, increasing the processing capabilities of the FPGA.
The standard length of 50mm ensures compatibility with common PCB dimensions, making it easy to incorporate this FPGA into various electronic designs.
Field Programmable Gate Arrays (FPGA) 1SG280HU2F50E2VG attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel
Programmable IC Type:
No. of Logic Cells:
No. of Inputs:
No. of Outputs:
No. of CLBs:
Organization:
Minimum Operating Temperature:
Maximum Operating Temperature:
Package Body Material:
Surface Mountable:
Package Style:
Package Code:
Package Shape:
Length:
Width:
Maximum Seated Height:
Package Equivalence Code:
Terminal Position:
Terminal Style:
Terminal Pitch:
No. of Terminals:
JESD-30 Code:
1SG280HU2F50E2VG Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Software 11-15-22 Stratix10 DS Update 3/Jun/2021
PCN Other - Guidelines Update 11/Apr/2022
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
DS18B20+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Package Shape or Style: RECTANGULAR; Maximum Operating Current: 1.5 mA; Package Equivalence Code: SIP3,.1,50;
FDC5614P
Onsemi
FDC5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 20A Max IDM and 0.105 ohm RDS(ON), operating in ENHANCEMENT MODE at -55 to 150 °C. This SMALL OUTLINE transistor has a built-in diode, GULL WING terminals, and METAL-OXIDE SEMICONDUCTOR technology.
LP2950CDT-3.3G
LP2950CDT-3.3G by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max output current of 0.1A. It has a small outline package style, operates at temperatures ranging from -40 to 125 °C, and is suitable for applications requiring low dropout voltage and precise voltage regulation in electronic circuits.
M24308/2-1F
Positronic Industries
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Additional Features: STANDARD: MIL-DTL-24308, POLARIZED; Body or Shell Style: RECEPTACLE;
M39029/56351
Souriau
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Gender: FEMALE; Insertion Tools: M81969/14-10; Tool Settings: M22520/2-10; DIN Conformity: NO;
B340A-13-F
Diodes Incorporated
B340A-13-F by Diodes Inc. is a Schottky rectifier diode with 40V reverse test voltage, 3A max output current, and 0.5V max forward voltage. It is used for efficiency applications in electronics due to its small outline package and high operating temperature range of -55°C to 150°C.
1N4148
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N7002
Kec
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Transistor Application: SWITCHING; Package Body Material: PLASTIC/EPOXY;
LL4148
General Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
FDD5614P
FDD5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 45A IDM and 0.1 ohm RDS(ON), operating in ENHANCEMENT MODE at up to 175°C. The PLASTIC/EPOXY package with GULL WING terminals ensures efficient heat dissipation and reliable performance.
LM555CN
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
Continental Device India
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; Package Body Material: PLASTIC/EPOXY; JEDEC-95 Code: TO-236AB;
LM317T
Integrated Power Semiconductors
Other Regulators; No. of Terminals: 3; Operating Temperature (TJ-Min): 0 Cel; Terminal Pitch: 2.54 mm; Maximum Load Regulation (%): 1.5 %; Nominal Dropout Voltage-1: 3 V;
Lite-on Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Qualification: Not Qualified; Additional Features: LOW THRESHOLD; Minimum DS Breakdown Voltage: 60 V;
1N5819HW-7-F
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Silicon Transistor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
RK73H2ATTD10R0F
Koa Speer Electronics
RK73H2ATTD10R0F by Koa Speer Electronics is a 0805 SMT fixed resistor with 10 ohm resistance, 1% tolerance, and 0.25 W power dissipation. Ideal for surface mount applications in automotive electronics due to its AEC-Q200 reference standard and operating voltage of 150 V.
LM358N
Harris Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
ESD5Z5.0T1G
ESD5Z5.0T1G by Onsemi is a unidirectional Trans Voltage Suppressor Diode with 5V reverse test voltage and 174W peak power dissipation. It is used for transient suppression in electronic circuits, meeting IEC-61000-4-2, 4-4 standards and UL recognized for reliability.
XC6SLX16-2FTG256C
Xilinx
The Xilinx XC6SLX16-2FTG256C is a CMOS FPGA with 14579 logic cells, 1139 CLBs, and a max clock frequency of 667 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems. The package style is grid array, low profile, with a square shape and ball terminals for surface mount assembly.
LFE5UM-25F-7BG381I
Lattice Semiconductor
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
EP3C10M164C8N
Altera
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 164; Package Code: TFBGA; Package Shape: SQUARE;
XC7A12T-2CSG325I
XC7A12T-2CSG325I by Xilinx is a Field Programmable Gate Array (FPGA) with 12800 logic cells and a max clock frequency of 1286 MHz. It is commonly used in industrial applications for its high performance and programmability.
LCMXO3LF-4300C-5BG256I
LCMXO3LF-4300C-5BG256I by Lattice Semiconductor is a 4300 Logic Cells FPGA with 540 CLBs and 206 Inputs/Outputs. It operates b/w -40 to 100 °C, has a supply voltage range of 2.375V to 3.465V, and uses PLASTIC/EPOXY package material. Ideal for applications requiring high-performance programmable ICs in compact form factors.
5CGXFC4F7M11C8N
Intel
Intel's 5CGXFC4F7M11C8N FPGA boasts 50000 logic cells, 129 inputs/outputs, and operates at a max temp of 85°C. Ideal for applications requiring high-speed data processing and complex algorithm implementation in industries like telecommunications and automotive.
M1AGL250V5-FGG144I
Actel
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: LBGA; Package Shape: SQUARE;
A3P1000-FGG484
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
XC7A100T-1CS324I
The Xilinx XC7A100T-1CS324I is a FPGA with 101440 logic cells, 7925 CLBs, and max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package. Operating temperatures range from -40 to 100°C, making it suitable for various environments.
10M50SAE144I7G
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE; Peak Reflow Temperature (C): NOT SPECIFIED;
XC7A200T-L1FBG676I
Xilinx XC7A200T-L1FBG676I is a FPGA with 215360 logic cells, 16825 CLBs, and 400 inputs/outputs. Operating b/w -40 to 100 °C, it's ideal for applications requiring high-speed processing like telecommunications and industrial automation. With a grid array package style and moisture sensitivity level of 4, it offers versatile programmability in compact designs.
M7A3P1000-FGG484I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
10M08SCU169I7G
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: BGA; Package Shape: SQUARE; Pitch Of Terminal: .8 mm;
EP2C8T144C8N
EP2C8T144C8N by Intel is a FPGA with 8256 logic cells, 516 CLBs, and max clock frequency of 402.5 MHz. It operates at temperatures from 0 to 85 °C and has a package style of flatpack, low profile, fine pitch. Ideal for applications requiring high-speed processing and programmable logic in compact form factors.
XC6SLX16-2CSG225I
Xilinx XC6SLX16-2CSG225I FPGA features 14579 logic cells, 1139 CLBs, and a max clock frequency of 667 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with low profile design.
XC7A100T-1FGG484C
Xilinx XC7A100T-1FGG484C is a FPGA with 101440 logic cells, 7925 CLBs, and 285 inputs/outputs. Operating at max frequency of 1098 MHz, it's ideal for high-performance applications requiring fast combinatorial delay of 1.27 ns in a compact package style suitable for surface mount technology.
10M08SCE144I7G
The Intel 10M08SCE144I7G is a Field Programmable Gate Array with 8000 logic cells and 500 CLBs. It operates at a max supply voltage of 3.15V, suitable for industrial applications requiring high-performance FPGA solutions in compact form factors. The package style includes flatpack, heat sink/slug, low profile, and fine pitch options for versatile integration.
10CL025ZU256I8G
Intel's 10CL025ZU256I8G FPGA features 24624 logic cells, 1539 CLBs, and 150 inputs/outputs. With a package style of grid array, it is ideal for industrial applications requiring high-performance programmable ICs in a compact form factor.
EP3C25F324C8NES
EP3C25F324C8NES by Intel is a FPGA with 24624 CLBs, operating at max frequency of 472.5 MHz. It has a package style of GRID ARRAY and can handle temperatures from 0 to 85 °C. Ideal for applications requiring high-speed processing and programmable logic in compact form factor.
EP3C40F324I7N
The EP3C40F324I7N by Altera is a CMOS Field Programmable Gate Array with 39,600 logic cells. It has a maximum clock frequency of 472.5 MHz and operates in an industrial temperature range. Its compact BGA package makes it suitable for various applications requiring high performance and programmability.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
1SG250HU2F50E1VG
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 2397; Package Code: BGA; Package Shape: SQUARE; Width: 50 mm;
1SG250HU2F50I1VG
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 2397; Package Code: BGA; Package Shape: SQUARE; No. of Inputs: 736;
1SG280HN1F43I1VG
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Length: 42.5 mm;
1SG280HN1F43I1VGAS
FIELD PROGRAMMABLE GATE ARRAY;
1SG280LN3F43I1VP
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;
1SG280HN1F43E1VG
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
1SG280HN1F43I2LG
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Maximum Operating Temperature: 100 Cel;
1SG280LN2F43I1VGAS
1SG280HU1F50E1VG
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2397; Package Code: BGA; Package Shape: SQUARE;
1SG280LU2F50E2VG
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 2397; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA2397,49X49,40;
1SG280HN3F43E3VG
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;
1SG280HN3F43I3VG
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 3.881 mm;
1SG280HU2F50I2LG
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 2397; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage (V): 0.85;
1SG280HU2F50I2VG
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 2397; Package Code: BGA; Package Shape: SQUARE; Pitch Of Terminal: 1 mm;
1SG280HU2F50I1VP
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 2397; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
1SG280HU2F50I2LP
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 2397; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B2397;
1SG280HU2F50E3VP
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 2397; Package Code: BGA; Package Shape: SQUARE; Maximum Operating Temperature: 100 Cel;
1SG280HU2F50I3XP
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 2397; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: .82 V;
1SG280HU2F50E3VG
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 2397; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;
1SG280HU2F50I3VP
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 2397; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
© 2023 All rights reserved