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1SG280HU2F50I1VP

Intel

1SG280HU2F50I1VP by Intel

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 2397; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 380 parts In-Stock

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380

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Vyrian

USA . 307 parts In-Stock

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307

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 830 parts In-Stock

1+ parts

$11.000

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830

$11.000

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Texas Native Microelectronics

USA . 162 parts In-Stock

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$162.310

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$142.833

162

$162.310

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$142.833

Kenton Components

USA . 200 parts In-Stock

1+ parts

$194.772

100+ parts

$186.981

1k+ parts

$181.138

10k+ parts

$171.399

200

$194.772

$186.981

$181.138

$171.399

Qasali Group International

UK . 373 parts In-Stock

1+ parts

$438.237

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$407.560

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373

$438.237

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$407.560

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MARBEL Systems

Belgium . 4,676 parts In-Stock

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4,676

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Corphita

USA . 400 parts In-Stock

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400

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Technical Specifications

Field Programmable Gate Arrays (FPGA) 1SG280HU2F50I1VP attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

2753000

No. of Inputs:

736

No. of Outputs:

736

No. of CLBs:

344125

Organization:

344125 CLBS

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

50 mm

Width:

50 mm

Maximum Seated Height:

3.881 mm

Package Equivalence Code:

BGA2397,49X49,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B2397

Trade Compliance

1SG280HU2F50I1VP Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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