Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Intel 1SG280LN3F43I1VP is a FPGA with 2753000 logic cells, 344125 CLBs, and 704 inputs/outputs. It is used in applications requiring high-speed data processing and complex algorithm implementation due to its programmable nature and grid array package style. Operating temperature ranges from -40°C to 100°C, making it suitable for various environments.
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The use of plastic/epoxy material for the package body makes the product lightweight and durable, suitable for various applications.
Having a large number of logic cells allows for complex programmable logic designs to be implemented efficiently.
The surface mount feature enables easy and secure installation of the FPGA onto PCBs, making it convenient for circuit integration.
The high number of Configurable Logic Blocks (CLBs) provides flexibility in designing custom logic circuits and functions.
Having a large number of inputs allows for multiple signals to be processed simultaneously, enhancing the overall performance of the FPGA.
The square package shape offers efficient use of space on the PCB and simplifies the layout design process.
The use of ball terminals provides reliable electrical connections and facilitates the assembly process during PCB integration.
The high number of terminals allows for a greater number of connections to be made, enabling more complex circuit designs to be implemented.
Being a Field Programmable Gate Array (FPGA) enables the customization of logic functions and operations, making it ideal for prototyping and low-volume production.
The grid array package style ensures uniform spacing of terminals, simplifying the assembly process and providing a reliable electrical connection.
With a high maximum operating temperature, the FPGA can withstand demanding environmental conditions and maintain optimal performance.
The tight pitch of terminals allows for a compact design layout and efficient use of space on the PCB, enabling a high-density circuit integration.
The organization of 344125 Configurable Logic Blocks (CLBs) provides ample resources for implementing complex logic functions and algorithms.
The low minimum operating temperature range ensures reliable operation even in extreme cold environments, making the FPGA suitable for a wide range of applications.
Having terminals at the bottom of the package facilitates easier PCB mounting and soldering, simplifying the assembly process.
The low maximum seated height allows for a compact and slim design, making the FPGA suitable for applications with space constraints.
The compact width of the FPGA enables efficient use of space on the PCB and simplifies the layout design process.
Having a large number of outputs allows for multiple signals to be generated simultaneously, enhancing the flexibility and functionality of the FPGA.
The compact length of the FPGA contributes to a space-efficient design, making it ideal for applications where size is a critical factor.
Field Programmable Gate Arrays (FPGA) 1SG280LN3F43I1VP attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel
Programmable IC Type:
No. of Logic Cells:
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No. of Outputs:
No. of CLBs:
Organization:
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Maximum Operating Temperature:
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Surface Mountable:
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Length:
Width:
Maximum Seated Height:
Package Equivalence Code:
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No. of Terminals:
JESD-30 Code:
1SG280LN3F43I1VP Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Software 11-15-22 Stratix10 DS Update 3/Jun/2021
PCN Other - Guidelines Update 11/Apr/2022
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
M24308/2-1F
Cinch Connectivity Solutions
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Body Depth: .375 inch;
Souriau-sunbank Connection Technologies
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Body Length: 1.228 inch; Mounting Type: CABLE AND PANEL; Termination Type: CRIMP;
MC33269T-3.3G
Onsemi
MC33269T-3.3G by Onsemi is a fixed positive single output LDO regulator with a max output current of 0.8 A and a dropout voltage of 1.35 V. It is commonly used in applications that require stable voltage regulation, such as power supplies for electronic devices.
BAV99
Diodes Incorporated
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CN
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
ULN2803A
YOUTAI SEMICONDUCTOR CO LTD
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: GULL WING; No. of Terminals: 18; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G18;
FDN5618P
FDN5618P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage. It features a single configuration with built-in diode, suitable for switching applications. With 10A IDM and 0.17 ohm RDS(on), it operates in the temperature range of -55 to 150 °C, making it ideal for various electronic devices.
CL31B104KBCNNNC
Samsung Electro-mechanics
Samsung Electro-mechanics CL31B104KBCNNNC is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It features X7R temperature characteristics, -55 to 125 °C operating range, and compact SMT package style. Ideal for applications requiring high reliability in compact electronic devices.
NC7WZ17P6X
The Onsemi NC7WZ17P6X is a logic gate with 2 functions, featuring a propagation delay of 13.1 ns at 1.8V supply voltage. Ideal for industrial applications, it operates b/w -40 to 85°C and has a max power supply current of 100mA. With Schmitt Trigger technology and small outline packaging, it suits compact electronic designs requiring fast signal processing.
2N7002
Itt Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Package Shape: RECTANGULAR;
CRCW080510K0FKEA
Vishay Intertechnology
Vishay Intertechnology's CRCW080510K0FKEA is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.125 W power dissipation. Ideal for surface mount applications in automotive electronics due to AEC-Q200 reference standard compliance and -55 to 155 °C operating temperature range.
SS14
Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Toshiba
2N2222A
General Transistor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SN65HVD234DR
Texas Instruments
SN65HVD234DR by Texas Instruments is an 8-terminal interface circuit with a data rate of 1 Mbps. Operating temperature ranges from -40 to 125 °C, making it ideal for automotive applications. With a supply voltage of 3.3 V and low current draw of 6 mA, it's suitable for network interfaces in compact designs.
LL4148-GS08
Telefunken Microelectronics
RECTIFIER DIODE; Surface Mount: YES; JESD-609 Code: e0; No. of Elements: 1; Maximum Operating Temperature: 175 Cel; Maximum Non Repetitive Peak Forward Current: 2 A;
261
New England Microwave
Other Interface ICs; No. of Terminals: 14; Package Equivalence Code: FL14(UNSPEC); Power Supplies (V): +-5,-15; Package Body Material: PLASTIC/EPOXY; Surface Mount: YES;
SMBJ18CA
Thinking Electronic Industrial
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Surge Components
1N4148
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LAE5UM-45F-6BG381E
Lattice Semiconductor
FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260;
LCMXO2-256ZE-1TG100C
LCMXO2-256ZE-1TG100C by Lattice Semiconductor is a 256 logic cell FPGA with 55 inputs/outputs, operating at 1.2V. It comes in a square package with gull wing terminals, suitable for applications requiring low-profile, fine-pitch ICs like consumer electronics and industrial automation.
XC6SLX45T-2CSG324I
Xilinx
Xilinx XC6SLX45T-2CSG324I is a FPGA with 43661 logic cells, 3411 CLBs, and max clock frequency of 667 MHz. It operates at -40 to 100°C, suitable for industrial applications requiring high-speed processing and programmable ICs in compact form factors.
LFE5U-45F-7BG256I
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3;
EP3C40F484I7N
Intel
EP3C40F484I7N by Intel is a FPGA with 39600 logic cells, 331 inputs/outputs, and max clock frequency of 472.5 MHz. Ideal for industrial applications requiring high-speed processing in compact designs due to its CMOS technology and grid array package style.
10CL120YF780I7G
Intel 10CL120YF780I7G is a FPGA with 7443 CLBs, 1.2V nominal voltage, and 100°C max operating temp. Ideal for industrial applications requiring high-performance programmable ICs in a compact square grid array package with bottom terminals.
XC6SLX45T-2FGG484C
Xilinx XC6SLX45T-2FGG484C FPGA features 43661 logic cells, 3411 CLBs, and 296 inputs/outputs. Utilized in applications requiring high-speed processing up to 667 MHz with a max operating temperature of 85°C. Ideal for projects demanding versatile programmable ICs in a compact grid array package.
M2GL050-VFG400I
Microchip Technology
Microchip Technology's M2GL050-VFG400I FPGA features 56340 logic cells, 207 inputs/outputs, and operates at a max supply voltage of 1.26V. Ideal for industrial applications requiring high-performance CMOS technology in a compact grid array package with low profile and fine pitch terminals.
EP3C10F256I7N
Altera
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: RECTANGULAR;
10CX150YF672E6G
Intel's 10CX150YF672E6G FPGA boasts 150,000 logic cells and 54,770 CLBs. Operating b/w 0-100°C with a supply voltage range of 0.87-0.93V, it offers 236 inputs/outputs for various applications requiring high-performance programmable ICs in a square grid array package.
LFE5UM-25F-6BG381I
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
A3P1000-PQG208
Actel
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
A3P250-PQG208
XC7S25-1CSGA324Q
XC7S25-1CSGA324Q by Xilinx is a PLASTIC/EPOXY FPGA with 23360 logic cells, 1825 CLBs, and a max clock frequency of 1098 MHz. It is commonly used in automotive applications due to its AUTOMOTIVE temperature grading.
10M16SAU169I7G
The Intel 10M16SAU169I7G is a FPGA with 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. It operates at supply voltages b/w 2.85V to 3.15V and temperatures from -40°C to 100°C. Ideal for industrial applications requiring high-performance programmable ICs in a compact grid array package.
10CL006YE144C8G
Intel 10CL006YE144C8G FPGA features 392 CLBs, operates at 1.2V nominal voltage, and has a max operating temperature of 85°C. Ideal for applications requiring high-performance programmable ICs in compact form factors with low power consumption.
EP4CE6F17C6N
EP4CE6F17C6N by Intel is a FPGA with 6272 logic cells, 392 CLBs, and max clock frequency of 472.5 MHz. Ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems due to its low profile package style and high operating temperature range up to 85°C.
XC6SLX4-2TQG144I
The Xilinx XC6SLX4-2TQG144I is a FPGA with 3840 logic cells, 300 CLBs, and max clock frequency of 667 MHz. It operates at temperatures ranging from -40 to 100 °C and is ideal for industrial applications requiring high-speed processing in compact designs.
EP4CGX22CF19I7N
The EP4CGX22CF19I7N FPGA by Altera is a plastic/epoxy package with 21280 logic cells, 1330 CLBs, and 150 inputs/outputs. It operates at a maximum clock frequency of 472.5 MHz and has a square package shape with a width and length of 19mm. This FPGA is suitable for various applications requiring programmable ICs and high-performance logic processing.
XC6SLX25-2FGG484C
The Xilinx XC6SLX25-2FGG484C is a FPGA with 24051 logic cells, 1879 CLBs, and max clock frequency of 667 MHz. It operates at a nominal voltage of 1.2V and is suitable for applications requiring high-speed processing in electronics and telecommunications industries.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
1SG250HU2F50E1VG
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 2397; Package Code: BGA; Package Shape: SQUARE; Width: 50 mm;
1SG250HU2F50I1VG
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 2397; Package Code: BGA; Package Shape: SQUARE; No. of Inputs: 736;
1SG280HN1F43I1VG
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Length: 42.5 mm;
1SG280HN1F43I1VGAS
FIELD PROGRAMMABLE GATE ARRAY;
1SG280HN1F43E1VG
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
1SG280HN1F43I2LG
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Maximum Operating Temperature: 100 Cel;
1SG280LN2F43I1VGAS
1SG280HU1F50E1VG
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2397; Package Code: BGA; Package Shape: SQUARE;
1SG280LU2F50E2VG
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 2397; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA2397,49X49,40;
1SG280HN3F43E3VG
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;
1SG280HN3F43I3VG
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 3.881 mm;
1SG280HU2F50E2VG
1SG280LN3F43E2VG
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
1SG280LN3F43I1VG
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; No. of Outputs: 704;
1SG280LN3F43I3XG
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;
1SG280LN3F43E2VP
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; No. of Inputs: 704;
1SG280LN3F43I2VP
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;
1SG280LN3F43I3VP
1SG280LN3F43C2LG
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B1760;
1SG280LN3F43C2LP
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Organization: 344125 CLBS;
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