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1SG250HU2F50I1VG

Intel

1SG250HU2F50I1VG by Intel

Intel's 1SG250HU2F50I1VG FPGA boasts 2422000 logic cells, 302750 CLBs, and 736 inputs/outputs. Ideal for applications requiring high-speed processing and customizable hardware acceleration in a compact form factor.

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Vyrian

USA . 6,493 parts In-Stock

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France . 1,625 parts In-Stock

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Digiode

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Nova Conductors

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Semicontronic

India . 1,252 parts In-Stock

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$11.000

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$10.725

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$10.670

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Ampacity Inc.

Singapore . 1,418 parts In-Stock

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AZTECH Wire

Italy . 424 parts In-Stock

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Corohmni

South Africa . 352 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,578 parts In-Stock

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Advanced Electronics

New Zealand . 3,461 parts In-Stock

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Texas Native Microelectronics

USA . 293 parts In-Stock

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Qasali Group International

UK . 2,336 parts In-Stock

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Microchip USA

USA . 114 parts In-Stock

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Bastille Electronics

Australia . 9,548 parts In-Stock

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MARBEL Systems

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Continental Prestige Electronics

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Argo Parts USA

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Kenton Components

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Corphita

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Overview

Experience the power of cutting-edge technology with the 1SG250HU2F50I1VG by Intel. As a leader in the industry, Intel brings you the ultimate Field Programmable Gate Array (FPGA) that offers unparalleled performance and versatility for a wide range of applications. Whether you're in the aerospace, automotive, or telecommunications industry, this FPGA is designed to meet your needs with its high-quality construction and innovative features. Unlock endless possibilities and accelerate your projects with Intel's 1SG250HU2F50I1VG FPGA - the smart choice for customers who demand nothing but the best.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material provides durability and protection for the FPGA, making it suitable for a wide range of applications.

No. of Logic Cells: 2422000

The high number of logic cells allows for complex program designs and advanced functionality within the FPGA.

Surface Mount: YES

The surface mount feature enables easy and convenient installation of the FPGA onto a circuit board.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this FPGA can function reliably in demanding environments without overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the FPGA can operate effectively in a wide range of temperature conditions.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 1SG250HU2F50I1VG attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

2422000

No. of Inputs:

736

No. of Outputs:

736

No. of CLBs:

302750

Organization:

302750 CLBS

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

50 mm

Width:

50 mm

Maximum Seated Height:

3.881 mm

Package Equivalence Code:

BGA2397,49X49,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B2397

Trade Compliance

1SG250HU2F50I1VG Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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