Loading...

1SG280HU1F50E1VG

Intel

1SG280HU1F50E1VG by Intel

The Intel 1SG280HU1F50E1VG is a FPGA with 2753000 logic cells and 344125 CLBs. It has 736 inputs/outputs, operates b/w 0-100°C, and features a grid array package style. Ideal for applications requiring high-speed data processing and complex algorithm implementation in various industries.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,156 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,156

-

-

-

-

Chip Stock

USA . 1,297 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,297

-

-

-

-

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

VNN

France . 676 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

676

-

-

-

-

Digiode

USA . 428 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

428

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 897 parts In-Stock

1+ parts

$14.140

100+ parts

-

1k+ parts

-

10k+ parts

-

897

$14.140

-

-

-

MARBEL Systems

Belgium . 548 parts In-Stock

1+ parts

$63.272

100+ parts

$60.742

1k+ parts

-

10k+ parts

-

548

$63.272

$60.742

-

-

Texas Native Microelectronics

USA . 309 parts In-Stock

1+ parts

$72.727

100+ parts

$69.818

1k+ parts

$67.636

10k+ parts

-

309

$72.727

$69.818

$67.636

-

Kenton Components

USA . 200 parts In-Stock

1+ parts

$87.272

100+ parts

-

1k+ parts

-

10k+ parts

$76.800

200

$87.272

-

-

$76.800

Microchip USA

USA . 2,544 parts In-Stock

1+ parts

$46,162.110

100+ parts

-

1k+ parts

-

10k+ parts

-

2,544

$46,162.110

-

-

-

Qasali Group International

UK . 4,482 parts In-Stock

1+ parts

-

100+ parts

$188.508

1k+ parts

-

10k+ parts

$172.799

4,482

-

$188.508

-

$172.799

Continental Prestige Electronics

USA . 4,391 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,391

-

-

-

-

Argo Parts USA

USA . 3,170 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,170

-

-

-

-

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Corphita

USA . 210 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

210

-

-

-

-

Overview

Unlock limitless possibilities with the Intel 1SG280HU1F50E1VG Field Programmable Gate Array. Manufactured by Intel, a trusted name in technology, this FPGA boasts 2753000 logic cells and 344125 CLBs, making it a powerhouse for customizable applications. From aerospace to telecommunications, this FPGA offers unparalleled flexibility and performance. Experience seamless integration, high-quality design, and reliable functionality with the Intel 1SG280HU1F50E1VG. Elevate your projects to new heights with this innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the FPGA easy to handle and resistant to damage during handling or installation.

No. of Logic Cells: 2753000

With a large number of logic cells, this FPGA has the capability to handle complex processing tasks and high-performance applications.

Surface Mount: YES

Being surface mountable allows for easy integration onto PCBs, saving space and reducing assembly complexity.

No. of CLBs: 344125

The large number of Configurable Logic Blocks provides flexibility and versatility in implementing various logic functions and designs.

No. of Inputs: 736

Having a high number of inputs enables the FPGA to interface with a wide range of external devices and sensors.

Package Shape: SQUARE

The square shape of the package allows for efficient use of board space and easier alignment during assembly.

Form Of Terminal: BALL

Ball terminals provide a reliable and secure connection, ensuring good electrical contact and signal integrity.

No. of Terminals: 2397

The large number of terminals enables versatile connectivity options and compatibility with a variety of PCB designs.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being field programmable allows for flexibility in design iterations and customization to specific application requirements.

Package Style (Meter): GRID ARRAY

The grid array package style offers ease of soldering and increased mechanical strength, ensuring reliability in harsh operating conditions.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature range ensures reliable performance in demanding environments with elevated temperatures.

Pitch Of Terminal: 1 mm

The small pitch of terminals allows for high-density mounting and compact PCB design, ideal for space-constrained applications.

Organization: 344125 CLBS

The organized layout of 344,125 Configurable Logic Blocks provides a structured approach to creating complex logic circuits efficiently.

Minimum Operating Temperature: 0 °C

With a low minimum operating temperature, the FPGA can reliably function even in cold environments without performance degradation.

Position Of Terminal: BOTTOM

Having terminals positioned at the bottom facilitates easy PCB layout and routing of signals for efficient design implementation.

Maximum Seated Height: 3.881 mm

The low seated height allows for a slim profile and minimizes the overall height of the FPGA on the PCB, saving space in compact designs.

Width: 50 mm

The compact width of the FPGA enables efficient board space utilization and ease of integration into various electronic systems.

No. of Outputs: 736

A high number of outputs allows for driving multiple devices and signals, enabling complex system designs and high-performance applications.

Length: 50 mm

The compact length of the FPGA contributes to space-saving on the PCB and facilitates efficient routing of signals for optimized performance.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 1SG280HU1F50E1VG attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

2753000

No. of Inputs:

736

No. of Outputs:

736

No. of CLBs:

344125

Organization:

344125 CLBS

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

50 mm

Width:

50 mm

Maximum Seated Height:

3.881 mm

Package Equivalence Code:

BGA2397,49X49,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B2397

Trade Compliance

1SG280HU1F50E1VG Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20