Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Intel 1SG280HU1F50E1VG is a FPGA with 2753000 logic cells and 344125 CLBs. It has 736 inputs/outputs, operates b/w 0-100°C, and features a grid array package style. Ideal for applications requiring high-speed data processing and complex algorithm implementation in various industries.
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This material is lightweight and durable, making the FPGA easy to handle and resistant to damage during handling or installation.
With a large number of logic cells, this FPGA has the capability to handle complex processing tasks and high-performance applications.
Being surface mountable allows for easy integration onto PCBs, saving space and reducing assembly complexity.
The large number of Configurable Logic Blocks provides flexibility and versatility in implementing various logic functions and designs.
Having a high number of inputs enables the FPGA to interface with a wide range of external devices and sensors.
The square shape of the package allows for efficient use of board space and easier alignment during assembly.
Ball terminals provide a reliable and secure connection, ensuring good electrical contact and signal integrity.
The large number of terminals enables versatile connectivity options and compatibility with a variety of PCB designs.
Being field programmable allows for flexibility in design iterations and customization to specific application requirements.
The grid array package style offers ease of soldering and increased mechanical strength, ensuring reliability in harsh operating conditions.
The high maximum operating temperature range ensures reliable performance in demanding environments with elevated temperatures.
The small pitch of terminals allows for high-density mounting and compact PCB design, ideal for space-constrained applications.
The organized layout of 344,125 Configurable Logic Blocks provides a structured approach to creating complex logic circuits efficiently.
With a low minimum operating temperature, the FPGA can reliably function even in cold environments without performance degradation.
Having terminals positioned at the bottom facilitates easy PCB layout and routing of signals for efficient design implementation.
The low seated height allows for a slim profile and minimizes the overall height of the FPGA on the PCB, saving space in compact designs.
The compact width of the FPGA enables efficient board space utilization and ease of integration into various electronic systems.
A high number of outputs allows for driving multiple devices and signals, enabling complex system designs and high-performance applications.
The compact length of the FPGA contributes to space-saving on the PCB and facilitates efficient routing of signals for optimized performance.
Field Programmable Gate Arrays (FPGA) 1SG280HU1F50E1VG attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel
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JESD-30 Code:
1SG280HU1F50E1VG Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Software 11-15-22 Stratix10 DS Update 3/Jun/2021
PCN Other - Guidelines Update 11/Apr/2022
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
2N2222A
SPC TECHNOLOGY/ MULTICOMP
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM2931AZ-5.0G
Onsemi
LM2931AZ-5.0G by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 5V and max output current of 0.1A. It has a max dropout voltage of 0.6V, making it suitable for applications requiring stable power supply in temperature-sensitive environments up to 125°C. The package style is cylindrical with wire terminals, ideal for rail packing methods in various electronic devices.
SMBJ18CA
World Products
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
NDT2955
NDT2955 by Onsemi is a P-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 15A and EAS of 174mJ, suitable for ENHANCEMENT MODE operation. With a compact SMALL OUTLINE package and -55 to 150 °C operating range, it offers efficient power dissipation up to 3W.
Fairchild Semiconductor
LL4148
Bkc Semiconductors
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BSS138BKW,115
NXP Semiconductors
NXP Semiconductors' BSS138BKW,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A ID. Ideal for SWITCHING applications, it features a built-in diode, 1.6 ohm RDS(on), and operates in ENHANCEMENT MODE. Suitable for surface mount with GULL WING terminals, it meets AEC-Q101 standards.
2N7002
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 40; Minimum DS Breakdown Voltage: 60 V;
ESD5Z5.0T1G
ESD5Z5.0T1G by Onsemi is a unidirectional Trans Voltage Suppressor Diode with 5V reverse test voltage and 174W peak power dissipation. It is used for transient suppression in electronic circuits, meeting IEC-61000-4-2, 4-4 standards and UL recognized for reliability.
1554216002
Molex
WIRE AND CABLE;
M39029/58-360
Glenair
CONNECTOR ACCESSORY; Contact Gender: MALE; Material: COPPER ALLOY; IEC Conformity: NO; MIL-Connector Accessory Name: CONTACT; MIL Conformity: YES;
BAV99
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CN
Harris Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
SDR0604-101KL
Bourns
SDR0604-101KL by Bourns is a surface mount fixed inductor with a nominal inductance of 100 uH. It is a general purpose inductor suitable for power applications, with a max rated current of 0.52 A and a self-resonance frequency of 9 MHz.
Silicon Transistor
M39029/56351
Souriau
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Gender: FEMALE; Insertion Tools: M81969/14-10; Tool Settings: M22520/2-10; DIN Conformity: NO;
First Components International
Silicon Standard
Synsemi
1N4148
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
XCAU25P-1FFVB676E
Xilinx
FIELD PROGRAMMABLE GATE ARRAY;
10M04SAU169I7G
Altera
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
EP3C16F484C8N
Intel
EP3C16F484C8N by Intel is a CMOS FPGA with 15408 logic cells and CLBs. It operates at a max clock frequency of 472.5 MHz, making it suitable for high-speed applications like telecommunications equipment and industrial automation systems. With a package style of grid array and moisture sensitivity level of 3, this FPGA offers versatile programmability in a compact form factor for various electronic designs.
EP2C5T144C8N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
10M04DCU324I7G
Intel's 10M04DCU324I7G FPGA features 4000 logic cells, 250 CLBs, and 246 inputs/outputs. With a max supply voltage of 1.25V, it is ideal for industrial applications requiring high-performance programmable ICs in a compact square package with 0.8mm terminal pitch.
XCAU20P-2SFVB784E
Xilinx XCAU20P-2SFVB784E FPGA offers 238437 logic cells, 13625 CLBs, and 228 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor with a package style of grid array, fine pitch. Operating temperature range from 0 to 100°C makes it versatile for various industrial uses.
10CL016YF484C8G
Intel's 10CL016YF484C8G is a FPGA with 963 CLBs, operating voltage of 1.15-1.25V, and temp range of 0-85°C. It features a grid array package style, square shape, and ball terminals. Ideal for applications requiring high flexibility and customization in electronic circuit design.
10M16SAE144I7G
Intel 10M16SAE144I7G is a FPGA with 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. It operates at 2.85-3.15V, -40 to 100°C, ideal for industrial applications requiring high-performance programmable ICs in compact form factors with low power consumption.
A3P1000-FGG484I
Actel
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
LCMXO2-1200HC-4TG100I
Lattice Semiconductor
LCMXO2-1200HC-4TG100I by Lattice Semiconductor is a 1280 logic cell FPGA with max clock freq of 133MHz. Operating temp range -40 to 100°C, suitable for applications requiring high-speed processing in compact designs. Features 79 inputs/outputs and operates at nominal voltage of 2.5V.
EP3C40F484C7N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: RECTANGULAR;
XC7A35T-2FGG484C
Xilinx XC7A35T-2FGG484C FPGA features 33280 logic cells, 2600 CLBs, and a max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.
XC7A15T-2FTG256I
Xilinx XC7A15T-2FTG256I FPGA offers 16640 logic cells, 1300 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and low power consumption. Package style: Grid Array, Low Profile, Fine Pitch.
XC7A200T-2FBG676C
Xilinx XC7A200T-2FBG676C FPGA features 215360 logic cells, 16825 CLBs, and a max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing and programmable ICs in a compact grid array package with CMOS technology.
XC3SD1800A-4CSG484C
The Xilinx XC3SD1800A-4CSG484C FPGA features 37440 logic cells, 4160 CLBs, and 1800000 equivalent gates. It operates at a max clock frequency of 250 MHz and is suitable for applications requiring high-speed processing and programmable ICs in commercial extended temperature environments.
XC7A12T-1CSG325C
The Xilinx XC7A12T-1CSG325C is a FPGA with 12800 logic cells, 1000 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
XC7S25-2CSGA225C
Xilinx XC7S25-2CSGA225C FPGA features 23360 logic cells, 1825 CLBs, and a max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment, industrial automation systems, and data center infrastructure.
LFE5U-25F-6BG256I
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): 260; JESD-609 Code: e1; Finishing Of Terminal Used: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3;
EP4CE15E22C8N
The EP4CE15E22C8N by Altera is a field programmable gate array (FPGA) with 15408 logic cells and 963 configurable logic blocks (CLBs). It operates at a maximum supply voltage of 1.25V and has 81 inputs and outputs. This FPGA is surface mountable and has a package shape of square, with a gull wing form of terminal. It is suitable for applications that require high-speed processing and programmability.
LFCPNX-100-8CBG256I
FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
1SG250HU2F50E1VG
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 2397; Package Code: BGA; Package Shape: SQUARE; Width: 50 mm;
1SG250HU2F50I1VG
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 2397; Package Code: BGA; Package Shape: SQUARE; No. of Inputs: 736;
1SG280HN1F43I1VG
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Length: 42.5 mm;
1SG280HN1F43I1VGAS
1SG280LN3F43I1VP
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;
1SG280HN1F43E1VG
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
1SG280HN1F43I2LG
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Maximum Operating Temperature: 100 Cel;
1SG280LN2F43I1VGAS
1SG280LU2F50E2VG
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 2397; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA2397,49X49,40;
1SG280HN3F43E3VG
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;
1SG280HN3F43I3VG
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 3.881 mm;
1SG280HU2F50E2VG
1SG280HU1F50E2LG
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 2397; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 3.881 mm;
1SG280HU1F50E2VG
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 2397; Package Code: BGA; Package Shape: SQUARE; No. of CLBs: 344125;
1SG280HU1F50I1VG
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 2397; Package Code: BGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;
1SG280HU1F50I2VG
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 2397; Package Code: BGA; Package Shape: SQUARE; Maximum Operating Temperature: 100 Cel;
1SG280HU1F50E2LP
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 2397; Package Code: BGA; Package Shape: SQUARE; Organization: 344125 CLBS;
1SG280HU1F50E3XP
1SG280HU1F50I3XP
1SG280HU1F50C2LG
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 2397; Package Code: BGA; Package Shape: SQUARE; Pitch Of Terminal: 1 mm;
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