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EP3SL110F1152C4G

Intel

EP3SL110F1152C4G by Intel

EP3SL110F1152C4G by Intel is a FPGA with 107.5K logic cells, 4300 CLBs, and 744 inputs/outputs. It operates b/w -40 to 85°C and has a package size of 35x35mm. Ideal for applications requiring high-speed data processing and customizable logic functions in compact designs.

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Vyrian

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AZTECH Wire

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Advanced Electronics

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Overview

Unlock endless possibilities with the EP3SL110F1152C4G by Intel, a cutting-edge Field Programmable Gate Array (FPGA) that offers unparalleled quality and reliability. Intel, a trusted manufacturer known for innovation, brings you a product that is versatile and ideal for a wide range of applications. From high-speed data processing to complex algorithm implementations, this FPGA delivers unmatched performance and efficiency. With a multitude of logic cells and inputs, along with a compact square package design, the EP3SL110F1152C4G provides exceptional value and benefits to customers seeking top-notch solutions for their projects. Experience the power of Intel's FPGA technology today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components and provides durability and protection for the FPGA.

No. of Logic Cells: 107500

With a large number of logic cells, this FPGA can handle complex logic operations and tasks efficiently.

Surface Mount: YES

Being surface mountable allows for easier and more efficient integration into circuit boards.

Maximum Supply Voltage: 0.94 V

The low maximum supply voltage helps in reducing power consumption and heat generation.

No. of CLBs: 4300

Having a high number of Configurable Logic Blocks enables flexibility and versatility in programming the FPGA.

No. of Inputs: 744

A large number of inputs means the FPGA can handle a wide range of external signals and data.

Package Shape: SQUARE

The compact square shape allows for efficient use of space on a circuit board.

Form Of Terminal: BALL

The ball terminals offer a reliable and secure connection to the FPGA.

Nominal Supply Voltage (V): 0.9

The nominal supply voltage provides a stable operating range for the FPGA.

No. of Terminals: 1152

With a high number of terminals, the FPGA can connect to multiple external components and interfaces.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a FPGA allows for customization and reprogramming of logic functions as needed.

Package Style (Meter): GRID ARRAY

The grid array package style offers a high terminal count in a compact layout.

Minimum Supply Voltage: 0.86 V

The low minimum supply voltage allows for operation in energy-efficient applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliability in various environmental conditions.

Pitch Of Terminal: 1 mm

The small pitch of terminals allows for high-density connectivity in a small footprint.

Organization: 4300 CLBS

The organized layout of 4300 Configurable Logic Blocks simplifies the programming and utilization of the FPGA.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the FPGA can function in cold environments.

Position Of Terminal: BOTTOM

The terminals positioned at the bottom of the FPGA facilitate easy connectivity within a circuit board.

Maximum Seated Height: 3.5 mm

The low seated height allows for a slim and compact profile when integrated into electronic devices.

Width: 35 mm

The moderate width provides a balanced size for integration and placement on a circuit board.

No. of Outputs: 744

Having a large number of outputs allows the FPGA to drive multiple external components and signals.

Length: 35 mm

The moderate length offers flexibility in orientation and positioning on a circuit board.

Technical Specifications

Field Programmable Gate Arrays (FPGA) EP3SL110F1152C4G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

107500

No. of Inputs:

744

No. of Outputs:

744

No. of CLBs:

4300

Organization:

4300 CLBS

Additional Features:

It can also operate from 1.05 to 1.15 V supply

Power Characteristics

Nominal Supply Voltage:

0.9

Minimum Supply Voltage:

.86 V

Maximum Supply Voltage:

.94 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

35 mm

Width:

35 mm

Maximum Seated Height:

3.5 mm

Package Equivalence Code:

BGA1152,34X34,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1152

Trade Compliance

EP3SL110F1152C4G Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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