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EP3SL150F1152C4N

Intel

EP3SL150F1152C4N by Intel

Intel's EP3SL150F1152C4N FPGA boasts 142.5K logic cells, 5700 CLBs, and 744 inputs/outputs. With a package style of grid array and square shape, it is ideal for applications requiring high-speed processing in compact spaces. Operating b/w 0-85°C with low supply voltage, it suits various industrial and embedded systems.

Median Price

$2,288.510

Lifecycle Status

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8

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Arrow

USA . 67 parts In-Stock

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$1,779.950

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Verical

USA . 67 parts In-Stock

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Digiode

USA . 372 parts In-Stock

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Vyrian

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Flip Electronics

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Nova Conductors

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Andel Nordic

Denmark . 5,258 parts In-Stock

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$3.776

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$3.625

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$3.625

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AZTECH Wire

Italy . 216 parts In-Stock

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$19.488

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MARBEL Systems

Belgium . 902 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,505 parts In-Stock

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Kenton Components

USA . 4,253 parts In-Stock

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Modulus Dynamics

Lithuania . 1,410 parts In-Stock

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Texas Native Microelectronics

USA . 5,931 parts In-Stock

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$56.083

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$53.840

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$52.157

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Qasali Group International

UK . 457 parts In-Stock

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Corohmni

South Africa . 609 parts In-Stock

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Component Stockers USA

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$759.060

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Microchip USA

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One Stop Electronics

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Ampacity Inc.

Singapore . 67 parts In-Stock

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Semicontronic

India . 67 parts In-Stock

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$1,896.599

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Corphita

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Lixinc

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Continental Prestige Electronics

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Argo Parts USA

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Glotronic Ltd.

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Supply Digital

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Bastille Electronics

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Kepictronics

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Overview

Unlock endless possibilities with the EP3SL150F1152C4N by Intel. As a leading manufacturer in the field programmable gate arrays (FPGA) category, Intel delivers top-notch quality and reliability. With its 142,500 logic cells and 5700 CLBs, this FPGA offers unparalleled flexibility for a wide range of applications. Experience seamless integration and optimal performance with its 1.2/3.3 power supplies and 0.9 nominal supply voltage. Elevate your projects to new heights with the EP3SL150F1152C4N, where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the FPGA, making it ideal for long-term use in various environments.

No. of Logic Cells: 142500

A high number of logic cells allows for complex logic functions to be implemented in the FPGA, making it suitable for advanced applications.

Surface Mount: YES

Surface mount capability makes it easy to integrate the FPGA onto circuit boards, enabling compact and efficient designs.

Maximum Supply Voltage: 0.94 V

Low maximum supply voltage helps reduce power consumption and heat generation, increasing energy efficiency of the device.

No. of CLBs: 5700

A high number of Configurable Logic Blocks (CLBs) provides flexibility in designing and implementing custom logic functions in the FPGA.

No. of Inputs: 744

A high number of input pins allows for extensive connectivity options, enabling the FPGA to interface with a wide range of external devices.

Package Shape: SQUARE

Square package shape facilitates easier and more efficient placement on circuit boards, optimizing utilization of available space.

Technical Specifications

Field Programmable Gate Arrays (FPGA) EP3SL150F1152C4N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

142500

No. of Inputs:

744

No. of Outputs:

744

No. of CLBs:

5700

Sub-Category:

Field Programmable Gate Arrays

Organization:

5700 CLBS

Additional Features:

It can also operate from 1.05 to 1.15 V supply

Power Characteristics

Nominal Supply Voltage:

0.9

Minimum Supply Voltage:

.86 V

Maximum Supply Voltage:

.94 V

Power Supplies:

1.2/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

35 mm

Width:

35 mm

Maximum Seated Height:

3.5 mm

Package Equivalence Code:

BGA1152,34X34,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1152

Qualified:

No

Trade Compliance

EP3SL150F1152C4N Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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