Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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EP3SE80F1152C3G by Intel is a FPGA with 80000 logic cells, 3200 CLBs, and 744 inputs/outputs. It operates b/w -40 to 85 °C and has a package style of grid array. Ideal for applications requiring high-speed data processing in compact electronic systems.
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Plastic/epoxy material provides durability and protection for the FPGA, ensuring it can withstand various environmental conditions.
With a high number of logic cells, this FPGA offers ample capacity for complex designs and computations.
Surface mount capability allows for easy and secure installation onto circuit boards, saving space and simplifying the assembly process.
The maximum supply voltage of 0.94 V ensures safe and efficient operation of the FPGA within specified limits.
The 3200 Configurable Logic Blocks (CLBs) provide flexibility and versatility for programming custom logic functions and designs.
A high number of inputs allows for versatile input configurations, enabling the FPGA to handle a wide range of data and signals.
The square package shape is easy to work with and facilitates efficient placement and routing on circuit boards.
Ball terminals offer secure connections and enable reliable data transfer between the FPGA and other components in the system.
The nominal supply voltage of 0.9 V ensures consistent and stable power delivery to the FPGA for reliable performance.
With a high number of terminals, this FPGA can support multiple connections and interfaces, making it suitable for complex system designs.
As a Field Programmable Gate Array, this IC offers programmability and customization for a wide range of applications and functions.
The grid array package style facilitates easy integration and alignment with other components on the circuit board, enhancing overall system performance.
The minimum supply voltage of 0.86 V ensures that the FPGA can operate efficiently even at lower power levels, enabling energy-saving applications.
The high maximum operating temperature of 85°C allows the FPGA to function reliably in a wide range of environmental conditions.
The 1 mm pitch of the terminals enables precise and secure connections, improving signal integrity and overall system reliability.
The organizational structure of 3200 CLBs provides a systematic framework for implementing complex logic functions and designs within the FPGA.
The low minimum operating temperature of 0°C ensures that the FPGA can function reliably even in cold environments.
Bottom positioning of the terminals simplifies installation and connections with other components, streamlining the overall system design.
The maximum seated height of 3.5 mm ensures that the FPGA can be securely mounted on the circuit board without protruding excessively, saving space.
The 35 mm width provides a compact form factor for the FPGA, making it suitable for applications where space is limited.
With a high number of outputs, this FPGA can drive multiple signals and data streams, supporting diverse functionalities and applications.
The 35 mm length provides a balanced form factor for the FPGA, ensuring compatibility with standard mounting and assembly processes.
Field Programmable Gate Arrays (FPGA) EP3SE80F1152C3G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel
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EP3SE80F1152C3G Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Mult PN LABEL 01/08/2023
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
1N4148
Comchip Technology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N7002
Formosa Microsemi
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Maximum Drain Current (Abs) (ID): .115 A;
M39029/58-360
Fct Electronic
CONNECTOR ACCESSORY; IEC Conformity: NO; Alternate Contact Sources: MILITARY; MIL Conformity: YES; Contact Gender: MALE; MIL-Connector Accessory Name: CONTACT;
1N4148WS
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SSL-LXA228SRC-TR11
Lumex
SSL-LXA228SRC-TR11 by Lumex is a 1.9mm SINGLE COLOR LED with peak wavelength of 660nm and max forward current of 0.03A. Ideal for applications requiring SUPER RED light emission, such as indicator lights in electronic devices due to its clear lens and surface mounting feature.
LL4148
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N2222A
Tesla Elektronicke Soucastky
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAV99
Won-top Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Vishay Telefunken
LL4148GS08
Temic Semiconductors
LL4148GS08 by Temic Semiconductors is a glass diode with a max reverse recovery time of 0.008 us and max forward voltage of 1 V. It is a rectifier diode with a max output current of 0.15 A, ideal for applications requiring fast switching speeds and low power dissipation in electronic circuits.
BSS138K-13
Diodes Incorporated
BSS138K-13 by Diodes Inc. is a N-channel FET with 50V DS breakdown voltage, ideal for switching applications. It features single configuration with built-in diode, operating in enhancement mode. With 3 terminals and 0.31A max drain current, it offers high performance in small outline package style.
Excel (Suzhou) Semiconductor
Jiangsu Changjiang Electronics Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Operating Mode: ENHANCEMENT MODE; Transistor Application: SWITCHING;
SS14
Changzhou Starsea Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
261
New England Microwave
Other Interface ICs; No. of Terminals: 14; Package Equivalence Code: FL14(UNSPEC); Power Supplies (V): +-5,-15; Package Body Material: PLASTIC/EPOXY; Surface Mount: YES;
First Components International
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Operating Temperature: 200 Cel; Config: SINGLE; No. of Elements: 1;
TE Connectivity
TE Connectivity's M39029/58-360 is a CRIMP terminal backshell for 22-28 AWG wires, rated at 5A. Ideal for male contacts in Mil-Spec applications, it offers a cross-section area of 0.34 mm2 and ensures secure connections in demanding environments.
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): .715 V; Maximum Operating Temperature: 150 Cel; Maximum Reverse Recovery Time: .006 us; Maximum Output Current: .2 A;
87832-1420
Molex
87832-1420 by Molex is a 14-contact board connector with 0.079" pitch, suitable for commercial applications. It features matte tin over nickel finish, glass-filled polyamide insulator, and polarization key for easy assembly. Withstanding voltage of 1400VAC and operating temperature range from -55 to 105°C make it reliable for various electronic devices.
Unisonic Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Body Material: PLASTIC/EPOXY; Package Shape: RECTANGULAR;
XC6SLX25-2CSG324C
Xilinx
Xilinx XC6SLX25-2CSG324C FPGA features 24051 logic cells, 1879 CLBs, and 226 inputs/outputs. Utilized in applications requiring high-speed processing such as telecommunications, networking, and industrial automation due to its max clock frequency of 667 MHz and low profile grid array package style.
LCMXO3LF-4300C-5BG256I
Lattice Semiconductor
LCMXO3LF-4300C-5BG256I by Lattice Semiconductor is a 4300 Logic Cells FPGA with 540 CLBs and 206 Inputs/Outputs. It operates b/w -40 to 100 °C, has a supply voltage range of 2.375V to 3.465V, and uses PLASTIC/EPOXY package material. Ideal for applications requiring high-performance programmable ICs in compact form factors.
10M16SCU169A7G
Altera
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: BGA; Package Shape: SQUARE;
XC3S400A-4FTG256C
Xilinx XC3S400A-4FTG256C FPGA offers 8064 logic cells, 896 CLBs, and 400000 gates. With a max clock frequency of 667 MHz, it is ideal for high-speed applications like telecommunications and networking. Operating temperature ranges from 0 to 85°C with a low profile grid array package style.
10M02DCV36I7G
The Altera 10M02DCV36I7G is a field-programmable gate array (FPGA) with 2000 logic cells. It uses CMOS technology and has 27 inputs and outputs. The package is a square BGA with 36 terminals and a pitch of 0.4mm. It operates at a nominal supply voltage of 1.2V. Suitable for various applications requiring FPGA functionality.
EP2C5Q208C8N
Intel
EP2C5Q208C8N by Intel is a FPGA with 4608 logic cells, 288 CLBs, and 142 inputs. It operates at a max clock frequency of 402.5 MHz and has a package style of flatpack, fine pitch. Ideal for applications requiring high-speed processing and programmable logic capabilities in compact designs.
10CL080YU484I7G
Intel's 10CL080YU484I7G FPGA features 5079 CLBs, operates at -40 to 100 °C, with a supply voltage of 1.2V. Ideal for industrial applications requiring high performance and flexibility in a compact GRID ARRAY package with 0.8mm terminal pitch.
M1A3P1000-FGG484I
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
ICE40HX8K-CB132
ICE40HX8K-CB132 by Lattice Semiconductor is a 1.2V FPGA with 7680 logic cells, 960 CLBs, and max clock frequency of 133MHz. Ideal for industrial applications requiring high-speed processing in a compact package with a grid array style and very thin profile.
A3P1000-PQG208I
Actel
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
EP4CE40F29C8N
The EP4CE40F29C8N by Altera is a field programmable gate array (FPGA) with 39,600 logic cells and 535 inputs and outputs. It operates at a maximum supply voltage of 1.03V and has a maximum clock frequency of 472.5 MHz. This FPGA has a compact BGA package with 780 terminals and can operate at a nominal supply voltage of 1V. Its applications include digital signal processing, network processing, and control plane processing.
XC5VLX30T-1FFG665C
Xilinx XC5VLX30T-1FFG665C FPGA features 30720 logic cells, 2400 CLBs, and a max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment, industrial automation systems, and data processing units.
M2GL025TS-1FGG484I
Microchip Technology
M2GL025TS-1FGG484I by Microchip Technology is a 27696 logic cell FPGA with 267 inputs/outputs. Operating at 1.2V, it has a temperature range of -40 to 100°C and comes in a square grid array package suitable for industrial applications.
10M50DAF484C8G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
M1A3P250-PQG208I
M1A3P250-PQG208I by Microchip Technology is a CMOS FPGA with 6144 CLBs and 250000 gates. It operates b/w -40 to 100 °C, with supply voltage range of 1.425V to 1.575V. Suitable for industrial applications requiring high gate count and programmable logic functions.
LFE5UM-25F-7BG381I
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
LFCPNX-100-9BBG484I
FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
EP4CE22E22C6N
EP4CE22E22C6N by Intel is a FPGA with 22320 logic cells, 1395 CLBs, and max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems. With a package style including flatpack and low profile options, it offers versatility in design and integration.
10CL080YF484I7G
Intel's 10CL080YF484I7G FPGA features 81264 logic cells, 5079 CLBs, and operates at a max voltage of 1.25V. Ideal for industrial applications requiring high-performance programmable ICs with 289 inputs/outputs in a compact square package.
10CL040ZU484I8G
The Intel 10CL040ZU484I8G is a Field Programmable Gate Array (FPGA) with 39,600 logic cells and 2,475 configurable logic blocks (CLBs). It has a max supply voltage of 1.03V and can operate in temperatures ranging from -40°C to 100°C. This FPGA is commonly used for industrial applications requiring high-performance programmable ICs.
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EP3SL50F780C4N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE;
EP3SL150F1152C4N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;
EP3SE80F1152C3N
EP3SE80F1152C2G
EP3SL110F780C3N
EP3SL150F780I3N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE;
EP3SL110F1152C4G
EP3SL50F780C2N
EP3SL50F780C4G
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE; Organization: 1900 CLBS;
EP3SE80F780C4LG
EP3SL110F780I4N
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B780;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): NOT SPECIFIED;
EP3SL150F780I4N
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE; Pitch Of Terminal: 1 mm;
EP3SE80F1152I2LN
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Maximum Operating Temperature: 100 Cel;
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