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EP3SE80F1152C3G

Intel

EP3SE80F1152C3G by Intel

EP3SE80F1152C3G by Intel is a FPGA with 80000 logic cells, 3200 CLBs, and 744 inputs/outputs. It operates b/w -40 to 85 °C and has a package style of grid array. Ideal for applications requiring high-speed data processing in compact electronic systems.

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Overview

Unleash the power of cutting-edge technology with the EP3SE80F1152C3G by Intel. This Field Programmable Gate Array (FPGA) boasts 80,000 logic cells and 3,200 CLBs, making it ideal for a wide range of applications. With a maximum supply voltage of 0.94 V and a minimum operating temperature of 0 °C, this FPGA offers unmatched performance and reliability. Whether you're designing advanced electronics or pushing the boundaries of innovation, the EP3SE80F1152C3G delivers the value and benefits you need to stay ahead in today's fast-paced world. Elevate your projects with Intel's top-quality FPGA solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the FPGA, ensuring it can withstand various environmental conditions.

No. of Logic Cells: 80000

With a high number of logic cells, this FPGA offers ample capacity for complex designs and computations.

Surface Mount: YES

Surface mount capability allows for easy and secure installation onto circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 0.94 V

The maximum supply voltage of 0.94 V ensures safe and efficient operation of the FPGA within specified limits.

No. of CLBs: 3200

The 3200 Configurable Logic Blocks (CLBs) provide flexibility and versatility for programming custom logic functions and designs.

No. of Inputs: 744

A high number of inputs allows for versatile input configurations, enabling the FPGA to handle a wide range of data and signals.

Package Shape: SQUARE

The square package shape is easy to work with and facilitates efficient placement and routing on circuit boards.

Form Of Terminal: BALL

Ball terminals offer secure connections and enable reliable data transfer between the FPGA and other components in the system.

Nominal Supply Voltage (V): 0.9

The nominal supply voltage of 0.9 V ensures consistent and stable power delivery to the FPGA for reliable performance.

No. of Terminals: 1152

With a high number of terminals, this FPGA can support multiple connections and interfaces, making it suitable for complex system designs.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a Field Programmable Gate Array, this IC offers programmability and customization for a wide range of applications and functions.

Package Style (Meter): GRID ARRAY

The grid array package style facilitates easy integration and alignment with other components on the circuit board, enhancing overall system performance.

Minimum Supply Voltage: 0.86 V

The minimum supply voltage of 0.86 V ensures that the FPGA can operate efficiently even at lower power levels, enabling energy-saving applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows the FPGA to function reliably in a wide range of environmental conditions.

Pitch Of Terminal: 1 mm

The 1 mm pitch of the terminals enables precise and secure connections, improving signal integrity and overall system reliability.

Organization: 3200 CLBS

The organizational structure of 3200 CLBs provides a systematic framework for implementing complex logic functions and designs within the FPGA.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures that the FPGA can function reliably even in cold environments.

Position Of Terminal: BOTTOM

Bottom positioning of the terminals simplifies installation and connections with other components, streamlining the overall system design.

Maximum Seated Height: 3.5 mm

The maximum seated height of 3.5 mm ensures that the FPGA can be securely mounted on the circuit board without protruding excessively, saving space.

Width: 35 mm

The 35 mm width provides a compact form factor for the FPGA, making it suitable for applications where space is limited.

No. of Outputs: 744

With a high number of outputs, this FPGA can drive multiple signals and data streams, supporting diverse functionalities and applications.

Length: 35 mm

The 35 mm length provides a balanced form factor for the FPGA, ensuring compatibility with standard mounting and assembly processes.

Technical Specifications

Field Programmable Gate Arrays (FPGA) EP3SE80F1152C3G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

80000

No. of Inputs:

744

No. of Outputs:

744

No. of CLBs:

3200

Organization:

3200 CLBS

Additional Features:

It can also operate from 1.05 to 1.15 V supply

Power Characteristics

Nominal Supply Voltage:

0.9

Minimum Supply Voltage:

.86 V

Maximum Supply Voltage:

.94 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

35 mm

Width:

35 mm

Maximum Seated Height:

3.5 mm

Package Equivalence Code:

BGA1152,34X34,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1152

Trade Compliance

EP3SE80F1152C3G Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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