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EP3SE80F1152C2G

Intel

EP3SE80F1152C2G by Intel

EP3SE80F1152C2G by Intel is a FPGA with 80000 logic cells, 3200 CLBs, and 744 inputs/outputs. It operates b/w -40 to 85 °C and has a package style of GRID ARRAY. Ideal for applications requiring high-speed data processing in compact electronic systems.

Median Price

$5,776.640

Lifecycle Status

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4

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1k+

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Nova Conductors

Japan . 22 parts In-Stock

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Vyrian

USA . 5,422 parts In-Stock

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Chip Stock

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Digiode

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AZTECH Wire

Italy . 639 parts In-Stock

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$9.997

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Ampacity Inc.

Singapore . 438 parts In-Stock

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Corohmni

South Africa . 61 parts In-Stock

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Component Stockers USA

USA . 740 parts In-Stock

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Aztec Data Supply Inc.

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Texas Native Microelectronics

USA . 3,371 parts In-Stock

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Kenton Components

USA . 517 parts In-Stock

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Qasali Group International

UK . 278 parts In-Stock

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Continental Prestige Electronics

USA . 6,757 parts In-Stock

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Argo Parts USA

USA . 4,879 parts In-Stock

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$5,603.341

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Netroflash

USA . 500 parts In-Stock

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Microchip USA

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MARBEL Systems

Belgium . 2,362 parts In-Stock

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Corphita

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Overview

Unlock limitless possibilities with the EP3SE80F1152C2G by Intel, a cutting-edge Field Programmable Gate Array that boasts 80000 logic cells and 3200 CLBs. Intel's reputation for quality and innovation shines through in this FPGA, offering unparalleled performance and versatility for a wide range of applications. Whether you're looking to optimize your industrial automation processes or enhance your telecommunications systems, this product delivers exceptional value, benefits, and advantages to meet your unique needs. Upgrade to Intel's EP3SE80F1152C2G and experience the power of next-generation technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to environmental factors.

No. of Logic Cells: 80000

With a large number of logic cells, this FPGA can handle complex computations and tasks efficiently.

Surface Mount: YES

Being surface mountable allows for easy integration into electronic circuits and saves space on PCBs.

Maximum Supply Voltage: 0.94 V

This low voltage requirement helps in reducing power consumption and heat generation, contributing to energy efficiency.

No. of CLBs: 3200

The high number of Configurable Logic Blocks (CLBs) provides flexibility in designing and implementing various logic functions.

No. of Inputs: 744

A large number of inputs allow for handling a wide range of data inputs simultaneously, increasing the versatility of the FPGA.

Package Shape: SQUARE

The square shape of the package helps in efficient layout and utilization of space on PCBs.

Form Of Terminal: BALL

Ball terminals facilitate easy connection and mounting of the FPGA on the PCB, ensuring a reliable electrical connection.

Nominal Supply Voltage (V): 0.9

Having a nominal supply voltage of 0.9V minimizes power requirements and enhances overall energy efficiency.

No. of Terminals: 1152

The high number of terminals provides ample connectivity options and simplifies the integration of the FPGA into electronic systems.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As an FPGA, this product offers reprogrammability, allowing for flexibility in implementing different logic functions and algorithms.

Package Style (Meter): GRID ARRAY

The grid array package style offers a compact and organized layout, making it easier to mount and connect the FPGA on a PCB.

Minimum Supply Voltage: 0.86 V

The low minimum supply voltage requirement enhances compatibility with various power sources and improves power efficiency.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this FPGA can withstand harsh environmental conditions and extended usage.

Pitch Of Terminal: 1 mm

The tight pitch of terminals allows for high-density mounting on PCBs, maximizing board space utilization.

Organization: 3200 CLBS

The organized structure of 3200 Configurable Logic Blocks (CLBs) enhances ease of design and implementation of logic functions.

Minimum Operating Temperature: 0 °C

Being able to operate at 0°C ensures reliable performance even in cold environments or during startup conditions.

Position Of Terminal: BOTTOM

Having terminals at the bottom simplifies the PCB layout and ensures secure mounting of the FPGA.

Maximum Seated Height: 3.5 mm

The low maximum seated height enables compact designs and facilitates installation in space-constrained applications.

Width: 35 mm

The moderate width of 35mm allows for easy integration and placement of the FPGA on PCBs with standard dimensions.

No. of Outputs: 744

A large number of outputs provide ample options for transmitting processed data, improving the versatility of the FPGA.

Length: 35 mm

The compact length of 35mm helps in saving space on PCBs and allows for efficient layout and routing of signals.

Technical Specifications

Field Programmable Gate Arrays (FPGA) EP3SE80F1152C2G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

80000

No. of Inputs:

744

No. of Outputs:

744

No. of CLBs:

3200

Organization:

3200 CLBS

Additional Features:

It can also operate from 1.05 to 1.15 V supply

Power Characteristics

Nominal Supply Voltage:

0.9

Minimum Supply Voltage:

.86 V

Maximum Supply Voltage:

.94 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

35 mm

Width:

35 mm

Maximum Seated Height:

3.5 mm

Package Equivalence Code:

BGA1152,34X34,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1152

Trade Compliance

EP3SE80F1152C2G Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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