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EP3SL110F780C3N

Intel

EP3SL110F780C3N by Intel

EP3SL110F780C3N by Intel is a FPGA with 107.5K logic cells, 4300 CLBs, and 488 inputs/outputs. It operates at a voltage range of 0.86V to 0.94V and supports power supplies of 1.2V/3.3V. This device is ideal for applications requiring high-speed data processing and complex logic implementations in various industries.

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Vyrian

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Nova Conductors

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Ampacity Inc.

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Semicontronic

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One Stop Electronics

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MARBEL Systems

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Texas Native Microelectronics

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Kenton Components

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Modulus Dynamics

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Microchip USA

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QUARKTWIN TECHNOLOGY LTD

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Glotronic Ltd.

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Supply Digital

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Aranea Global

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Futuretech Components

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Qasali Group International

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GreenTree Electronics

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Overview

Unlock endless possibilities with the Intel EP3SL110F780C3N Field Programmable Gate Array. This cutting-edge FPGA offers unparalleled quality and reliability, backed by the trusted Intel brand. Ideal for a wide range of applications, this versatile device boasts 107500 logic cells and 4300 CLBs, providing the flexibility and power you need for your projects. With a nominal supply voltage of 0.9V and maximum operating temperature of 85°C, this FPGA delivers top-notch performance in any environment. Elevate your designs and bring your ideas to life with the Intel EP3SL110F780C3N.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the FPGA, ensuring a long lifespan.

No. of Logic Cells: 107500

Having a high number of logic cells allows for complex logic functions and designs to be implemented.

Surface Mount: YES

Surface mount capability makes it easy to integrate this FPGA into various electronic devices.

Maximum Supply Voltage: 0.94 V

The low maximum supply voltage helps in reducing power consumption and heat generation.

No. of CLBs: 4300

Having a high number of Configurable Logic Blocks (CLBs) provides flexibility in designing custom logic circuits.

No. of Inputs: 488

A high number of inputs allows for more signals to be processed simultaneously.

Package Shape: SQUARE

Square package shape facilitates efficient use of space on a PCB.

Form Of Terminal: BALL

Ball terminals ensure secure connections and ease of soldering during installation.

Nominal Supply Voltage (V): 0.9

The nominal supply voltage of 0.9V ensures compatibility with various power systems.

Power Supplies (V): 1.2/3.3

Support for multiple power supply voltages allows for versatile integration in different systems.

No. of Terminals: 780

Having a high number of terminals enables connectivity with external devices and components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array (FPGA) enables customization and reconfiguration of logic functions as needed.

Package Style (Meter): GRID ARRAY

Grid array package style offers a reliable and robust mounting solution.

Minimum Supply Voltage: 0.86 V

The low minimum supply voltage ensures stability of operation even at low power levels.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows for deployment in various environments.

Pitch Of Terminal: 1 mm

A terminal pitch of 1mm provides compatibility with standard PCB layouts and assembly processes.

Organization: 4300 CLBS

The organization of 4300 Configurable Logic Blocks (CLBs) offers a balance of flexibility and performance in logic design.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable operation even in cold environments.

Position Of Terminal: BOTTOM

Bottom terminal placement allows for easier routing of signals on the PCB.

Maximum Seated Height: 3.2 mm

The low maximum seated height helps in compact PCB designs with minimal space requirements.

Width: 29 mm

The width of 29mm offers a balance between size and functionality for integration into various electronic devices.

No. of Outputs: 488

Having a high number of outputs allows for multiple signals to be generated simultaneously for complex applications.

Length: 29 mm

The length of 29mm complements the width, providing a square form factor for efficient PCB layout.

Technical Specifications

Field Programmable Gate Arrays (FPGA) EP3SL110F780C3N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

107500

No. of Inputs:

488

No. of Outputs:

488

No. of CLBs:

4300

Sub-Category:

Field Programmable Gate Arrays

Organization:

4300 CLBS

Additional Features:

It can also operate from 1.05 to 1.15 V supply

Power Characteristics

Nominal Supply Voltage:

0.9

Minimum Supply Voltage:

.86 V

Maximum Supply Voltage:

.94 V

Power Supplies:

1.2/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

29 mm

Width:

29 mm

Maximum Seated Height:

3.2 mm

Package Equivalence Code:

BGA780,28X28,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

780

Standards

JESD-30 Code:

S-PBGA-B780

Qualified:

No

Trade Compliance

EP3SL110F780C3N Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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