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EP3SL50F780C4G

Intel

EP3SL50F780C4G by Intel

EP3SL50F780C4G by Intel is a FPGA with 47500 logic cells, 1900 CLBs, and 488 inputs/outputs. It operates b/w 0-85°C, has a supply voltage range of 0.86-0.94 V, and features a square package shape with ball terminals. Ideal for applications requiring high-speed data processing and customizable logic functions in compact designs.

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Vyrian

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Digiode

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Nova Conductors

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Ampacity Inc.

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AZTECH Wire

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Advanced Electronics

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MARBEL Systems

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Texas Native Microelectronics

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Kenton Components

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Overview

Unleash the power of cutting-edge technology with the Intel EP3SL50F780C4G Field Programmable Gate Array. Designed by a trusted industry leader, this FPGA offers unparalleled quality and reliability for your electronic projects. With a multitude of applications in various industries, this FPGA provides endless possibilities for innovation. Experience the value and benefits of increased efficiency, flexibility, and performance that this product brings to the table. Upgrade your projects today with the Intel EP3SL50F780C4G and take your creations to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance between durability and affordability, making the product cost-effective.

No. of Logic Cells: 47500

With a large number of logic cells, this FPGA can handle complex and high-performance tasks efficiently.

Surface Mount: YES

Being surface mountable makes the installation and integration of this FPGA easier and more convenient.

Maximum Supply Voltage: 0.94 V

The maximum supply voltage of 0.94 V ensures safe operation of the FPGA within specified limits.

No. of CLBs: 1900

The 1900 configurable logic blocks provide flexibility in designing and implementing various logic functions.

No. of Inputs: 488

Having a large number of inputs allows for connecting multiple external devices and signals to the FPGA.

Package Shape: SQUARE

The square package shape facilitates efficient use of space and easy placement on circuit boards.

Form Of Terminal: BALL

The ball terminal design ensures reliable contact and connection between the FPGA and other components.

Nominal Supply Voltage (V): 0.9

The nominal supply voltage of 0.9 V is suitable for low-power applications, enhancing energy efficiency.

No. of Terminals: 780

The high number of terminals allows for extensive connectivity options and compatibility with various interfaces.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a field-programmable device, this FPGA offers flexibility in customization and reconfiguration for different applications.

Package Style (Meter): GRID ARRAY

The grid array package style provides a compact and organized arrangement of terminals, enhancing reliability and ease of assembly.

Minimum Supply Voltage: 0.86 V

The low minimum supply voltage of 0.86 V enables reliable operation even in low-power scenarios.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this FPGA can withstand high temperature environments without performance degradation.

Pitch Of Terminal: 1 mm

The 1 mm pitch of terminals allows for precise and secure connections, enhancing overall reliability.

Organization: 1900 CLBS

The organized structure of 1900 configurable logic blocks facilitates efficient design and implementation of complex logic functions.

Minimum Operating Temperature: 0 °C

The FPGA is designed to operate reliably even at very low temperatures, making it suitable for a wide range of environments.

Position Of Terminal: BOTTOM

Having terminals at the bottom makes it easier to integrate the FPGA into circuits and ensures a neat and compact layout.

Maximum Seated Height: 3 mm

The maximum seated height of 3 mm allows for easy accommodation within compact systems and devices.

Width: 29 mm

The compact width of 29 mm ensures space-efficient placement on circuit boards or within devices.

No. of Outputs: 488

A high number of outputs allows for versatile signal routing and processing capabilities, enhancing overall functionality.

Length: 29 mm

With a length of 29 mm, this FPGA offers a balanced form factor suitable for various applications and integration scenarios.

Technical Specifications

Field Programmable Gate Arrays (FPGA) EP3SL50F780C4G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

47500

No. of Inputs:

488

No. of Outputs:

488

No. of CLBs:

1900

Organization:

1900 CLBS

Additional Features:

It can also operate from 1.05 to 1.15 V supply

Power Characteristics

Nominal Supply Voltage:

0.9

Minimum Supply Voltage:

.86 V

Maximum Supply Voltage:

.94 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

29 mm

Width:

29 mm

Maximum Seated Height:

3 mm

Package Equivalence Code:

BGA780,28X28,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

780

Standards

JESD-30 Code:

S-PBGA-B780

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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