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10M16SCU324C8G

Intel

10M16SCU324C8G by Intel

Intel's 10M16SCU324C8G FPGA features 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. With a max supply voltage of 3.15V, it is ideal for applications requiring high-performance computing in commercial extended temperature environments. The package style is grid array with low profile and fine pitch terminals, making it suitable for compact designs.

Median Price

$59.550

Lifecycle Status

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7

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DigiKey

USA . 52 parts In-Stock

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$59.550

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$46.453

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Nova Conductors

Japan . 50 parts In-Stock

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$41.444

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Digiode

USA . 209 parts In-Stock

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Chip Stock

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VNN

France . 4,266 parts In-Stock

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Vyrian

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Sensible Micro Corp

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AZTECH Wire

Italy . 683 parts In-Stock

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$7.026

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Aztec Data Supply Inc.

USA . 446 parts In-Stock

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$30.640

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Vigor

Singapore . 253 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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$40.615

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Continental Prestige Electronics

USA . 19 parts In-Stock

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Corphita

USA . 157 parts In-Stock

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Ampacity Inc.

Singapore . 343 parts In-Stock

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Microchip USA

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$54.660

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Corohmni

South Africa . 443 parts In-Stock

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Texas Native Microelectronics

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MARBEL Systems

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Argo Parts USA

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Kenton Components

USA . 713 parts In-Stock

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RC Electronics

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Qasali Group International

UK . 293 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with Intel's 10M16SCU324C8G Field Programmable Gate Array (FPGA). This versatile device offers unparalleled quality and performance, backed by Intel's reputation for innovation and reliability. Perfect for a wide range of applications, from industrial automation to telecommunications, this FPGA delivers optimal value and flexibility. With 16000 logic cells and 1000 CLBs, it provides the perfect solution for your project needs. Experience seamless integration and superior functionality with Intel's 10M16SCU324C8G FPGA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and flexibility, making the product suitable for various environments.

No. of Logic Cells: 16000

With a high number of logic cells, this FPGA offers ample resources for complex digital designs.

Surface Mount: YES

Easy surface mounting allows for convenient integration into different systems and PCBs.

Maximum Supply Voltage: 3.15 V

The high maximum supply voltage ensures stable and reliable performance in demanding applications.

No. of CLBs: 1000

A large number of Configurable Logic Blocks (CLBs) provide versatility and customization options for designs.

No. of Inputs: 320

A high number of inputs allows for connectivity to multiple external devices and components.

Package Shape: SQUARE

The square package shape offers efficient use of PCB space and easy alignment for soldering.

Form Of Terminal: BALL

Ball terminals enable secure connections and improved heat dissipation, enhancing overall reliability.

Nominal Supply Voltage (V): 3

The nominal supply voltage of 3V is commonly used, making the FPGA compatible with standard power sources.

No. of Terminals: 324

The high number of terminals provides ample connectivity options for interfacing with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being an FPGA, this product offers flexibility and reconfigurability for various applications and design changes.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers space-saving and efficient PCB layout options.

Minimum Supply Voltage: 2.85 V

The low minimum supply voltage ensures energy efficiency and compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this FPGA can withstand harsh environmental conditions.

Pitch Of Terminal: 0.8 mm

The small pitch of terminals allows for compact design layouts and efficient signal routing.

Organization: 1000 CLBS

An organization of 1000 Configurable Logic Blocks provides ample resources for implementing complex logic functions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in cold climates or environments.

Position Of Terminal: BOTTOM

Bottom terminals offer ease of soldering and provide a secure connection to the PCB.

Maximum Seated Height: 1.55 mm

The low seated height allows for a compact and low-profile design, ideal for space-constrained applications.

Width: 15 mm

The compact width of 15mm enables easy integration into various system designs.

No. of Outputs: 320

A high number of outputs offers flexibility in routing signals and interfacing with external devices.

Length: 15 mm

The short length of 15mm contributes to a compact form factor, suitable for space-sensitive applications.

Grading Of Temperature: COMMERCIAL EXTENDED

With commercial extended temperature grading, this FPGA can operate reliably in a wide range of environmental conditions.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10M16SCU324C8G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

16000

No. of Inputs:

320

No. of Outputs:

320

No. of CLBs:

1000

Organization:

1000 CLBS

Additional Features:

Also Operates at 3.3 V nominal supply

Power Characteristics

Nominal Supply Voltage:

3

Minimum Supply Voltage:

2.85 V

Maximum Supply Voltage:

3.15 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA324,18X18,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.8 mm

No. of Terminals:

324

Standards

JESD-30 Code:

S-PBGA-B324

Trade Compliance

10M16SCU324C8G Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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