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Automotive FPGAs

Field Programmable Gate Arrays (FPGA)

Available Parts 84

Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC2S600E-6FG456Q by Xilinx

XC2S600E-6FG456Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

15552

329

329

3456

210000

357 MHz

CMOS

Field Programmable Gate Arrays

3456 CLBS, 210000 Gates

Maximum no. of gates 600000

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

456

S-PBGA-B456

e0

No

XA6SLX75-2CSG484Q by Xilinx

XA6SLX75-2CSG484Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

74637

328

328

5831

0.26 ns

5831 CLBS

1.23

1.2 V

1.26 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

XA6SLX75-3CSG484Q by Xilinx

XA6SLX75-3CSG484Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

74637

328

328

5831

0.21 ns

5831 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

LAMXO2280E-3FTN324E by Lattice Semiconductor

LAMXO2280E-3FTN324E

Lattice Semiconductor

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

2280

271

271

285

Field Programmable Gate Arrays

285 CLBS

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

19 mm

19 mm

1.7 mm

Tray

BGA324,18X18,40

Bottom

Ball

Tin Silver Copper

1 mm

324

S-PBGA-B324

e1

No

AEC-Q100

LAMXO256C-3TN100E by Lattice Semiconductor

LAMXO256C-3TN100E

Lattice Semiconductor

LAMXO256C-3TN100E by Lattice Semiconductor is a 256 Logic Cells FPGA with 32 CLBs, 78 Inputs/Outputs. Operating at 1.71V to 3.465V, it's ideal for automotive applications due to AEC-Q100 screening and -40°C to 125°C temperature range. Package: PLASTIC/EPOXY, GULL WING terminals, 0.5mm pitch, suitable for space-constrained designs.

FPGA

256

78

78

32

Field Programmable Gate Arrays

32 CLBS

Also Operates at 2.5 V and 3.3 V nominal supply

1.8

1.71 V

3.465 V

1.8/2.5/3.3 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

40 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

14 mm

14 mm

1.6 mm

QFP100,.63SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

100

S-PQFP-G100

e3

No

AEC-Q100

LAMXO256E-3TN100E by Lattice Semiconductor

LAMXO256E-3TN100E

Lattice Semiconductor

LAMXO256E-3TN100E by Lattice Semiconductor is a 256 Logic Cells FPGA with 32 CLBs, 78 Inputs/Outputs. Operating at -40 to 125°C, it's AEC-Q100 compliant for automotive applications. With a low profile flatpack package and 0.5mm terminal pitch, it's ideal for compact designs in automotive electronics.

FPGA

256

78

78

32

Field Programmable Gate Arrays

32 CLBS

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

40 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

14 mm

14 mm

1.6 mm

QFP100,.63SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

100

S-PQFP-G100

e3

No

AEC-Q100

LAMXO640C-3FTN256E by Lattice Semiconductor

LAMXO640C-3FTN256E

Lattice Semiconductor

Lattice Semiconductor's LAMXO640C-3FTN256E is a 640 Logic Cells FPGA with 80 CLBs, 159 Inputs/Outputs. Operating at -40 to 125 °C, it has a supply voltage range of 1.71-3.465 V and is AEC-Q100 graded for automotive applications.

FPGA

640

159

159

80

Field Programmable Gate Arrays

80 CLBS

Also Operates at 2.5 V and 3.3 V nominal supply

1.8

1.71 V

3.465 V

1.8/2.5/3.3 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

256

S-PBGA-B256

e1

No

AEC-Q100

LAMXO640C-3TN100E by Lattice Semiconductor

LAMXO640C-3TN100E

Lattice Semiconductor

LAMXO640C-3TN100E by Lattice Semiconductor is a 640 Logic Cells FPGA with 80 CLBs, operating at -40 to 125 °C. Suitable for automotive applications, it has 74 Inputs/Outputs and supports supply voltages of 1.71V to 3.465V in a low-profile package style.

FPGA

640

74

74

80

Field Programmable Gate Arrays

80 CLBS

Also Operates at 2.5 V and 3.3 V nominal supply

1.8

1.71 V

3.465 V

1.8/2.5/3.3 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

40 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

14 mm

14 mm

1.6 mm

Tray

QFP100,.63SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

100

S-PQFP-G100

e3

No

AEC-Q100

LAMXO640C-3TN144E by Lattice Semiconductor

LAMXO640C-3TN144E

Lattice Semiconductor

LAMXO640C-3TN144E by Lattice Semiconductor is a 640 Logic Cells FPGA with 80 CLBs, 113 Inputs/Outputs. It operates at -40 to 125°C, suitable for automotive applications due to AEC-Q100 screening level and low profile package style.

FPGA

640

113

113

80

Field Programmable Gate Arrays

80 CLBS

Also Operates at 2.5 V and 3.3 V nominal supply

1.8

1.71 V

3.465 V

1.8/2.5/3.3 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

40 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

Tray

QFP144,.87SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

144

S-PQFP-G144

e3

No

AEC-Q100

LAMXO640E-3TN144E by Lattice Semiconductor

LAMXO640E-3TN144E

Lattice Semiconductor

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;

FPGA

640

113

113

80

Field Programmable Gate Arrays

80 CLBS

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

40 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

144

S-PQFP-G144

e3

No

AEC-Q100

XA3S1000-4FTG256Q by Xilinx

XA3S1000-4FTG256Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

17280

391

391

1920

1000000

125 MHz

Field Programmable Gate Arrays

1920 CLBS, 1000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

TQFP100,.63SQ

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

256

S-PBGA-B256

e1

No

AEC-Q100

XA3S200-4TQG144Q by Xilinx

XA3S200-4TQG144Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;

FPGA

4320

173

173

480

200000

125 MHz

Field Programmable Gate Arrays

480 CLBS, 200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

144

S-PQFP-G144

e3

No

AEC-Q100

XA2S100E-6TQ144Q by Xilinx

XA2S100E-6TQ144Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE;

FPGA

2700

102

102

600

357 MHz

CMOS

Field Programmable Gate Arrays

600 CLBS

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack

QFP

Square

QFP144,.87SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

144

S-PQFP-G144

e0

No

AEC-Q100

XA2S150E-6FT256Q by Xilinx

XA2S150E-6FT256Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

3888

182

182

864

357 MHz

CMOS

Field Programmable Gate Arrays

864 CLBS

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

AEC-Q100

XA2S200E-6FT256Q by Xilinx

XA2S200E-6FT256Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

5292

182

182

1176

357 MHz

CMOS

Field Programmable Gate Arrays

1176 CLBS

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

AEC-Q100

XA2S300E-6FT256Q by Xilinx

XA2S300E-6FT256Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

6912

182

182

1536

357 MHz

CMOS

Field Programmable Gate Arrays

1536 CLBS

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

AEC-Q100

XA2S50E-6TQ144Q by Xilinx

XA2S50E-6TQ144Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE;

FPGA

1728

102

102

384

357 MHz

CMOS

Field Programmable Gate Arrays

384 CLBS

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack

QFP

Square

QFP144,.87SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

144

S-PQFP-G144

e0

No

AEC-Q100

XA3S100E-4TQG144Q by Xilinx

XA3S100E-4TQG144Q

Xilinx

XA3S100E-4TQG144Q by Xilinx is a FPGA with 2160 logic cells, 240 CLBs, and 100000 gates. It operates at max frequency of 572 MHz, suitable for automotive applications due to AEC-Q100 screening level. With a package size of 20x20 mm and low profile flatpack style, it's ideal for compact designs in harsh environments.

FPGA

2160

108

80

240

100000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

240 CLBS, 100000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

144

S-PQFP-G144

e3

No

AEC-Q100

XA3S100E-4VQG100Q by Xilinx

XA3S100E-4VQG100Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;

FPGA

2160

66

59

240

100000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

240 CLBS, 100000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Thin Profile, Fine Pitch

TFQFP

Square

14 mm

14 mm

1.2 mm

TQFP100,.63SQ

Quad

Gull Wing

Matte Tin

.5 mm

100

S-PQFP-G100

e3

No

AEC-Q100

XA3S1200E-4FGG400Q by Xilinx

XA3S1200E-4FGG400Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

19512

304

232

2168

1200000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

2168 CLBS, 1200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Silver Copper

1 mm

400

S-PBGA-B400

e1

No

AEC-Q100

XA3S1200E-4FTG256Q by Xilinx

XA3S1200E-4FTG256Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

19512

190

150

2168

1200000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

2168 CLBS, 1200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

AEC-Q100

XA3S1600E-4FGG400Q by Xilinx

XA3S1600E-4FGG400Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

33192

304

232

3688

1600000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

3688 CLBS, 1600000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Silver Copper

1 mm

400

S-PBGA-B400

e1

No

AEC-Q100

XA3S1600E-4FGG484Q by Xilinx

XA3S1600E-4FGG484Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

33192

376

294

3688

1600000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

3688 CLBS, 1600000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA3S250E-4CPG132Q by Xilinx

XA3S250E-4CPG132Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 132; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

5508

92

85

612

250000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

612 CLBS, 250000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA132,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

132

S-PBGA-B132

e1

No

AEC-Q100

XA3S250E-4FTG256Q by Xilinx

XA3S250E-4FTG256Q

Xilinx

XA3S250E-4FTG256Q by Xilinx is a FPGA with 5508 logic cells, 612 CLBs, and 250000 gates. It operates at max frequency of 572 MHz, suitable for automotive applications due to AEC-Q100 screening level. The package style is grid array with low profile, making it ideal for compact designs in harsh environments.

FPGA

5508

172

132

612

250000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

612 CLBS, 250000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

AEC-Q100

XA3S250E-4PQG208Q by Xilinx

XA3S250E-4PQG208Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

FPGA

5508

158

126

612

250000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

612 CLBS, 250000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

245 °C (473 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Tin

.5 mm

208

S-PQFP-G208

e3

No

AEC-Q100

XA3S250E-4TQG144Q by Xilinx

XA3S250E-4TQG144Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;

FPGA

5508

108

80

612

250000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

612 CLBS, 250000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

144

S-PQFP-G144

e3

No

AEC-Q100

XA3S250E-4VQG100Q by Xilinx

XA3S250E-4VQG100Q

Xilinx

XA3S250E-4VQG100Q by Xilinx is a FPGA with 5508 logic cells, 612 CLBs, and 250000 gates. Operating at 572 MHz, it's ideal for automotive applications due to AEC-Q100 screening and CMOS technology. With a compact form factor of 14mm x 14mm and low power consumption at 1.2V, it's suitable for various embedded systems.

FPGA

5508

66

59

612

250000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

612 CLBS, 250000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Thin Profile, Fine Pitch

TFQFP

Square

14 mm

14 mm

1.2 mm

TQFP100,.63SQ

Quad

Gull Wing

Matte Tin

.5 mm

100

S-PQFP-G100

e3

No

AEC-Q100

XA3S500E-4PQG208Q by Xilinx

XA3S500E-4PQG208Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

FPGA

10476

158

126

1164

500000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

1164 CLBS, 500000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

245 °C (473 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Tin

.5 mm

208

S-PQFP-G208

e3

No

AEC-Q100

XA7A100T-1FGG484Q by Xilinx

XA7A100T-1FGG484Q

Xilinx

XA7A100T-1FGG484Q by Xilinx is a FPGA with 101440 logic cells, 7925 CLBs, and 285 inputs/outputs. It operates at max frequency of 1098 MHz, suitable for automotive applications due to AEC-Q100 screening and HKMG technology. With a compact form factor (23mm x 23mm), it's ideal for high-performance computing in harsh environments.

FPGA

101440

285

285

7925

1098 MHz

1.27 ns

HKMG

Field Programmable Gate Arrays

7925 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA6SLX45-2FGG484Q by Xilinx

XA6SLX45-2FGG484Q

Xilinx

XA6SLX45-2FGG484Q by Xilinx is a 1.2V FPGA with 43661 logic cells, 316 inputs/outputs, and max clock frequency of 62.5MHz. Ideal for automotive applications due to AEC-Q100 screening level and operating temperature range of -40 to 125°C.

FPGA

43661

316

316

62.5 MHz

Field Programmable Gate Arrays

1.2

1.2,2.5/3.3 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA3S200A-4FTG256Q by Xilinx

XA3S200A-4FTG256Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

4032

195

160

448

200000

667 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

448 CLBS, 200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

AEC-Q100

XA3S400A-4FTG256Q by Xilinx

XA3S400A-4FTG256Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

8064

195

160

896

400000

667 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

AEC-Q100

XA3SD1800A-4CSG484Q by Xilinx

XA3SD1800A-4CSG484Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

37440

309

249

4160

37440

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

4160 CLBS, 37440 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA3SD1800A-4FGG676Q by Xilinx

XA3SD1800A-4FGG676Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

37440

519

409

4160

37440

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

4160 CLBS, 37440 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

AEC-Q100

XA3S1000-4FGG456Q by Xilinx

XA3S1000-4FGG456Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

17280

391

391

1920

1000000

125 MHz

Field Programmable Gate Arrays

1920 CLBS, 1000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

TQFP100,.63SQ

Bottom

Ball

Tin Silver Copper

1 mm

456

S-PBGA-B456

e1

No

AEC-Q100

XA3S200-4PQG208Q by Xilinx

XA3S200-4PQG208Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

FPGA

4320

173

173

480

200000

125 MHz

Field Programmable Gate Arrays

480 CLBS, 200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

245 °C (473 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Tin

.5 mm

208

S-PQFP-G208

e3

No

AEC-Q100

XA3S400-4FTG256Q by Xilinx

XA3S400-4FTG256Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

8064

264

264

896

400000

125 MHz

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

AEC-Q100

XA3S400-4PQG208Q by Xilinx

XA3S400-4PQG208Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

FPGA

8064

264

264

896

400000

125 MHz

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

245 °C (473 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Tin

.5 mm

208

S-PQFP-G208

e3

No

AEC-Q100

XA3S50-4PQG208Q by Xilinx

XA3S50-4PQG208Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

FPGA

1728

124

124

192

50000

125 MHz

Field Programmable Gate Arrays

192 CLBS, 50000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

245 °C (473 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Tin

.5 mm

208

S-PQFP-G208

e3

No

AEC-Q100

XA3S400A-4FGG400Q by Xilinx

XA3S400A-4FGG400Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

8064

311

248

896

400000

667 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Silver Copper

1 mm

400

S-PBGA-B400

e1

No

AEC-Q100

10M16SCU169A7P by Intel

10M16SCU169A7P

Intel

Intel's 10M16SCU169A7P FPGA features 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. With a max supply voltage of 3.15V, it is ideal for automotive applications requiring high-performance and low-profile grid array packaging. Operating b/w -40 to 125°C, this FPGA offers versatility in various temperature conditions.

FPGA

16000

320

320

1000

1000 CLBS

Also Operates at 3.3 V nominal supply

3

2.85 V

3.15 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

11 mm

11 mm

1.55 mm

BGA169,13X13,32

Bottom

Ball

.8 mm

169

S-PBGA-B169

XA7A50T-1CSG325Q by Xilinx

XA7A50T-1CSG325Q

Xilinx

The Xilinx XA7A50T-1CSG325Q is a FPGA with 52160 logic cells, 4075 CLBs, and 150 inputs/outputs. It operates at max frequency of 1098 MHz and supports automotive applications due to AEC-Q100 screening level. With HKMG technology, it offers high performance in a compact package for various electronic systems.

FPGA

52160

150

150

4075

1098 MHz

1.27 ns

HKMG

Field Programmable Gate Arrays

4075 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

325

S-PBGA-B325

e1

No

AEC-Q100

XA7A35T-1CSG324Q by Xilinx

XA7A35T-1CSG324Q

Xilinx

The Xilinx XA7A35T-1CSG324Q is a FPGA with 33280 logic cells, 2600 CLBs, and max clock frequency of 1098 MHz. It is used in automotive applications due to AEC-Q100 screening level and HKMG technology for high reliability in harsh environments. With a compact grid array package style, it offers low profile design suitable for space-constrained systems.

FPGA

33280

210

210

2600

1098 MHz

1.27 ns

HKMG

Field Programmable Gate Arrays

2600 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA7A75T-1CSG324Q by Xilinx

XA7A75T-1CSG324Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

75520

210

210

5900

1098 MHz

1.27 ns

HKMG

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA7A35T-1CSG325Q by Xilinx

XA7A35T-1CSG325Q

Xilinx

XA7A35T-1CSG325Q by Xilinx is a FPGA with 33280 logic cells, 2600 CLBs, and 150 inputs/outputs. It operates at max frequency of 1098 MHz, suitable for automotive applications due to AEC-Q100 screening and HKMG technology.

FPGA

33280

150

150

2600

1098 MHz

1.27 ns

HKMG

Field Programmable Gate Arrays

2600 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

325

S-PBGA-B325

e1

No

AEC-Q100

XA7A75T-1FGG484Q by Xilinx

XA7A75T-1FGG484Q

Xilinx

XA7A75T-1FGG484Q by Xilinx is a FPGA with 75520 logic cells, 5900 CLBs, and 285 inputs/outputs. It operates at max frequency of 1098 MHz, suitable for automotive applications due to AEC-Q100 screening and HKMG technology.

FPGA

75520

285

285

5900

1098 MHz

1.27 ns

HKMG

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA7A35T-1CPG236Q by Xilinx

XA7A35T-1CPG236Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 236; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

33280

106

106

2600

1098 MHz

1.27 ns

HKMG

Field Programmable Gate Arrays

2600 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA238,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

236

S-PBGA-B236

e1

No

AEC-Q100