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10M16SCU169A7P

Intel

10M16SCU169A7P by Intel

Intel's 10M16SCU169A7P FPGA features 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. With a max supply voltage of 3.15V, it is ideal for automotive applications requiring high-performance and low-profile grid array packaging. Operating b/w -40 to 125°C, this FPGA offers versatility in various temperature conditions.

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Overview

Unlock endless possibilities with the Intel 10M16SCU169A7P FPGA. Manufactured by industry giant Intel, this cutting-edge Field Programmable Gate Array offers unparalleled quality and reliability. With 16,000 logic cells and 320 inputs/outputs, this versatile device is perfect for a wide range of applications. Whether you're designing automotive systems or high-performance computing solutions, this FPGA provides the flexibility and power you need to bring your ideas to life. Experience seamless integration and optimal performance with the Intel 10M16SCU169A7P FPGA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the FPGA lightweight and durable, ideal for applications where weight is a concern.

No. of Logic Cells: 16000

With a high number of logic cells, this FPGA offers extensive programmability and flexibility for complex digital logic designs.

Surface Mount: YES

Being surface mount compatible, this FPGA is easy to integrate onto circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 3.15 V

The high maximum supply voltage tolerance of 3.15 V allows for a wider range of input voltages, increasing compatibility with different systems.

No. of CLBs: 1000

Offering 1000 Configurable Logic Blocks (CLBs), this FPGA provides ample resources for implementing complex logic functions and algorithms.

No. of Inputs: 320

With 320 input pins, this FPGA can accept a large number of external signals, ideal for applications requiring extensive input/output capabilities.

Package Shape: SQUARE

The square package shape ensures efficient use of space on a PCB and facilitates uniform heat dissipation across the device.

Form Of Terminal: BALL

The use of ball terminals simplifies the soldering process and improves the reliability of connections, ensuring robust performance in various environments.

Nominal Supply Voltage (V): 3

The nominal supply voltage of 3 V makes this FPGA compatible with standard voltage levels, simplifying power supply design considerations.

No. of Terminals: 169

The 169 terminals provide sufficient connectivity options for interfacing with other components and peripherals in the system.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a Field Programmable Gate Array, this device offers reconfigurable logic and hardware acceleration capabilities, making it versatile for various applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array package style with low profile and fine pitch design enables high-density mounting, allowing for compact PCB layouts and efficient routing of signals.

Minimum Supply Voltage: 2.85 V

The low minimum supply voltage requirement of 2.85 V enhances energy efficiency and extends battery life in portable or low-power applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable performance in harsh environmental conditions and industrial applications.

Pitch Of Terminal: 0.8 mm

The small pitch of 0.8 mm between terminals enables high-density interconnection, making PCB routing easier and optimizing signal integrity.

Organization: 1000 CLBS

With an organization of 1000 Configurable Logic Blocks (CLBs), this FPGA offers a balance between logic resources and routing flexibility for efficient logic implementation.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable operation in cold environments or industrial applications subjected to extreme temperatures.

Position Of Terminal: BOTTOM

Having terminals positioned at the bottom simplifies PCB design and assembly processes, allowing for easy access to connections and minimizing signal interference.

Maximum Seated Height: 1.55 mm

The low maximum seated height of 1.55 mm reduces the overall profile of the device on the PCB, enabling compact system designs and efficient use of space.

Width: 11 mm

The compact width of 11 mm makes this FPGA suitable for applications with size constraints, providing flexibility in board layout and integration.

No. of Outputs: 320

With 320 output pins, this FPGA can drive multiple external devices or circuits, offering enhanced functionality and versatility in system designs.

Length: 11 mm

The length of 11 mm ensures a compact form factor, making this FPGA suitable for space-constrained applications without compromising on performance.

Grading Of Temperature: AUTOMOTIVE

The automotive-grade temperature grading ensures that this FPGA can withstand the temperature fluctuations and environmental challenges commonly encountered in automotive applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10M16SCU169A7P attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

16000

No. of Inputs:

320

No. of Outputs:

320

No. of CLBs:

1000

Organization:

1000 CLBS

Additional Features:

Also Operates at 3.3 V nominal supply

Power Characteristics

Nominal Supply Voltage:

3

Minimum Supply Voltage:

2.85 V

Maximum Supply Voltage:

3.15 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

11 mm

Width:

11 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA169,13X13,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.8 mm

No. of Terminals:

169

Standards

JESD-30 Code:

S-PBGA-B169

Trade Compliance

10M16SCU169A7P Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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