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XA3S250E-4FTG256Q

Xilinx

XA3S250E-4FTG256Q by Xilinx

XA3S250E-4FTG256Q by Xilinx is a FPGA with 5508 logic cells, 612 CLBs, and 250000 gates. It operates at max frequency of 572 MHz, suitable for automotive applications due to AEC-Q100 screening level. The package style is grid array with low profile, making it ideal for compact designs in harsh environments.

Median Price

$230.770

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Avnet

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VNN

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Component Electronics Inc.

Canada . 50 parts In-Stock

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AZTECH Wire

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Overview

Unlock the power of innovation with the Xilinx XA3S250E-4FTG256Q FPGA. Crafted by industry leader Xilinx, this versatile Field Programmable Gate Array boasts 5508 logic cells and 612 CLBs, offering unmatched flexibility and performance. Ideal for automotive applications, this FPGA delivers a maximum clock frequency of 572 MHz and a wide operating temperature range. Experience seamless integration, rapid prototyping, and enhanced functionality with the XA3S250E-4FTG256Q - the ultimate solution for your next project. Elevate your designs and unleash your creativity with Xilinx.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for easy handling and protection of internal components.

No. of Logic Cells: 5508

High number of logic cells for complex programmable logic design implementations.

Surface Mount: YES

Easy to mount on circuit boards, saving assembly time and space.

Maximum Supply Voltage: 1.26 V

Low maximum supply voltage for energy efficiency and reduced heat dissipation.

No. of CLBs: 612

Sufficient number of Configurable Logic Blocks for versatile logic operations.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity.

No. of Inputs: 172

Wide range of input options for flexible connectivity and data processing.

Nominal Supply Voltage (V): 1.2

Stable nominal supply voltage for consistent performance and reliability.

Maximum Operating Temperature: 125 °C

High operating temperature range suitable for demanding automotive applications.

Maximum Clock Frequency: 572 MHz

High clock frequency for fast data processing and real-time operations.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XA3S250E-4FTG256Q attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

5508

No. of Inputs:

172

No. of Outputs:

132

No. of CLBs:

612

No. of Equivalent Gates:

250000

Maximum Clock Frequency:

572 MHz

CLB Maximum Delay:

4.88 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

612 CLBS, 250000 Gates

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,1.2/3.3,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Screening Level:

AEC-Q100

Trade Compliance

XA3S250E-4FTG256Q Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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