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LCMXO2-256HC-4UMG64I

Lattice Semiconductor

LCMXO2-256HC-4UMG64I by Lattice Semiconductor

LCMXO2-256HC-4UMG64I by Lattice Semiconductor is a 256 logic cell FPGA with 44 inputs/outputs, operating at 2.5V. It comes in a square grid array package and is suitable for applications requiring programmable ICs with fine pitch terminals and low power consumption.

Median Price

$7.085

Lifecycle Status

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8

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1k+

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Mouser Electronics

USA . 569 parts In-Stock

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$6.960

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$5.680

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$5.500

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DigiKey

USA . 484 parts In-Stock

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$7.210

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$5.775

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$5.500

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Nova Conductors

Japan . 100 parts In-Stock

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$4.940

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Bristol Electronics

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Tomark Electronics Ltd

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Vyrian

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ACDS - Activité Composants Distribution Service

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Continental Prestige Electronics

USA . 1,582 parts In-Stock

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$4.940

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$4.841

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Microchip USA

USA . 1,527 parts In-Stock

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$5.440

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Semicontronic

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Ampacity Inc.

Singapore . 68 parts In-Stock

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Advanced Electronics

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Aztec Data Supply Inc.

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Corohmni

South Africa . 38 parts In-Stock

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Argo Parts USA

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ChipstoGo Electronic ltd

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Overview

Unleash the power of innovation with the LCMXO2-256HC-4UMG64I from Lattice Semiconductor. This cutting-edge Field Programmable Gate Array (FPGA) offers unparalleled quality and reliability, making it the ideal choice for a wide range of applications. With 256 logic cells and a variety of inputs and outputs, this versatile device delivers exceptional performance and flexibility. Whether you're designing advanced electronics or pushing the boundaries of technology, the LCMXO2-256HC-4UMG64I provides the value, benefits, and advantages you need to succeed. Trust Lattice Semiconductor to deliver excellence in every package.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is durable and cost-effective, making this FPGA suitable for a wide range of applications.

No. of Logic Cells: 256

With 256 logic cells, this FPGA offers sufficient resources for implementing complex logic functions in electronic circuits.

Surface Mount: YES

Surface mount capability simplifies the assembly process and allows for more compact designs.

Maximum Supply Voltage: 3.465 V

The high maximum supply voltage tolerance of 3.465 V provides flexibility in power supply design.

No. of Inputs: 44

With 44 inputs, this FPGA can accommodate a wide range of signal inputs for versatile applications.

Package Shape: SQUARE

The square package shape enables easy integration into circuit layouts and PCB designs.

Form Of Terminal: BALL

Ball terminals offer a reliable and efficient means of connection in the assembly process.

Nominal Supply Voltage (V): 2.5

The nominal supply voltage of 2.5 V is commonly used in many electronic systems, ensuring compatibility.

Packing Method: TRAY

Tray packing method facilitates efficient storage, handling, and shipping of the FPGAs.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages (2.5 V and 3.3 V) allows flexibility in system design and compatibility.

No. of Terminals: 64

With 64 terminals, this FPGA provides ample connectivity options for interfacing with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable gate array allows for customization and reconfiguration of the logic functions as needed.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a thin profile and fine pitch enables high-density mounting and efficient use of PCB space.

Minimum Supply Voltage: 2.375 V

The low minimum supply voltage requirement of 2.375 V helps in minimizing power consumption and optimizing energy efficiency.

Maximum Operating Temperature: 100 °C

With a maximum operating temperature of 100°C, this FPGA can withstand high-temperature environments and industrial applications.

Pitch Of Terminal: 0.4 mm

The small pitch of 0.4 mm allows for high-density mounting and efficient use of PCB space.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C ensures reliable performance even in extreme cold conditions.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn/Ag/Cu)

The use of tin/silver/copper finishing on the terminals offers good conductivity and corrosion resistance for long-term reliability.

Position Of Terminal: BOTTOM

Bottom-positioned terminals facilitate easy soldering and assembly of the FPGA onto the PCB.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates that proper handling and storage procedures are necessary to prevent damage from moisture.

Maximum Seated Height: 1 mm

With a maximum seated height of 1 mm, this FPGA is suitable for compact and slim electronic device designs.

Width: 4 mm

The compact width of 4 mm allows for space-saving integration in electronic assemblies and PCB layouts.

No. of Outputs: 44

With 44 outputs, this FPGA can generate a variety of signals and drive multiple components in a circuit.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds indicates efficient reflow soldering process for assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper solder melting and reflow during the assembly process.

Length: 4 mm

The compact length of 4 mm allows for space-efficient placement on the PCB and integration into electronic systems.

Technical Specifications

Field Programmable Gate Arrays (FPGA) LCMXO2-256HC-4UMG64I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of Logic Cells:

256

No. of Inputs:

44

No. of Outputs:

44

Sub-Category:

Field Programmable Gate Arrays

Additional Features:

Also Operates at 3.3 V nominal supply

Power Characteristics

Nominal Supply Voltage:

2.5

Minimum Supply Voltage:

2.375 V

Maximum Supply Voltage:

3.465 V

Power Supplies:

2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Very Thin Profile, Fine Pitch

Package Code:

Package Shape:

Length:

4 mm

Width:

4 mm

Maximum Seated Height:

1 mm

Packing Method:

Tray

Package Equivalence Code:

BGA64,8X8,16

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper

Terminal Pitch:

.4 mm

No. of Terminals:

64

Standards

JESD-30 Code:

S-PBGA-B64

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

LCMXO2-256HC-4UMG64I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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