Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Intel's 10M08SCU324C8G FPGA features 8000 logic cells, 500 CLBs, and 250 inputs/outputs. Ideal for applications requiring high-speed data processing in commercial extended temperature environments.
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The plastic/epoxy package material provides a good balance of durability and cost-effectiveness.
With a high number of logic cells, this FPGA offers ample resources for complex programmable logic designs.
Surface mount capability allows for easier and more efficient PCB assembly.
The high maximum supply voltage tolerance accommodates a range of input power requirements.
The 500 configurable logic blocks provide flexibility for a variety of logic functions and designs.
With 250 input pins, this FPGA can handle a significant amount of external inputs.
The square package shape allows for efficient use of space on the PCB.
The ball terminals offer reliable connections and ease of soldering during assembly.
The nominal supply voltage of 3V is common in many electronic systems, simplifying integration.
A sufficient number of terminals for connecting to external components.
Being a FPGA, this IC offers the flexibility of reprogramming for different applications.
The grid array, low profile, and fine pitch package style offers high density and efficient PCB layout.
The low minimum supply voltage ensures compatibility with a range of power sources.
With a high maximum operating temperature, this FPGA can function reliably in a variety of environments.
The small pitch of terminals allows for high-density mounting on the PCB.
The organization of 500 CLBs provides structured logic resources for efficient design implementation.
Reliable operation even in low temperature environments.
The bottom terminal position can provide a more compact and streamlined PCB layout.
Low seated height allows for slim and compact device designs.
Compact width for space-efficient PCB layout designs.
With 250 output pins, this FPGA can drive a large number of output signals.
The 15mm length is suitable for compact and small form factor electronic devices.
The commercial extended temperature grading ensures reliable operation in a wide temperature range.
Field Programmable Gate Arrays (FPGA) 10M08SCU324C8G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel
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10M08SCU324C8G Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Max10 Pin Guide 3/Dec/2021 Mult PN LABEL 01/08/2023
PCN Packaging - Mult Dev Label CHG 24/Jan/2020 Mult Dev Label Chgs 24/Feb/2020
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
2N2222A
Semitronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
2N7002
Dc Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Terminal Form: GULL WING;
ULN2803A
Onsemi
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified;
NC7WZ17P6X
Fairchild Semiconductor
BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
MBR1560CT
General Instrument
MBR1560CT by General Instrument is a common cathode rectifier diode with a max forward voltage of 0.75V and max output current of 15A. It is used for efficiency applications, has a package shape of rectangular, and can operate in temperatures ranging from -65 to 150 °C.
1N4148
Renesas Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Kec
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Non Repetitive Peak Forward Current: 2 A; Config: SINGLE; Maximum Operating Temperature: 200 Cel;
Vishay Intertechnology
2N7002 by Vishay Intertechnology is a N-CHANNEL FET with 60V DS Breakdown Voltage, 0.115A Drain Current, and 7.5 ohm On Resistance. Ideal for SWITCHING applications due to its SINGLE configuration with BUILT-IN DIODE. Operates in ENHANCEMENT MODE, suitable for surface mount with GULL WING terminals.
LL4148
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Leshan Radio
RECTIFIER DIODE; Surface Mount: YES; Maximum Non Repetitive Peak Forward Current: 2 A; Maximum Reverse Recovery Time: .004 us; No. of Phases: 1; Maximum Operating Temperature: 175 Cel;
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Time At Peak Reflow Temperature (s): 30; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
SMBJ18CA
Synsemi
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
C0603C104K5RACAUTO
KEMET Corporation
KEMET C0603C104K5RACAUTO is a ceramic capacitor with 0.1uF capacitance, rated for 50V. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for automotive applications meeting AEC-Q200 standard, it comes in SMT package with matte tin finish and wraparound terminals.
ERJ3EKF1002V
Panasonic
Panasonic's ERJ3EKF1002V is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.1 W power dissipation. It operates b/w -55 to 155 °C and is ideal for surface mount applications in automotive electronics due to AEC-Q200 compliance.
LM317T
Motorola
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; No. of Outputs: 1; Package Equivalence Code: SIP3,.1TB;
ABS06-32.768KHZ-T
Abracon
Abracon's ABS06-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 90000 ohm series resistance, and -40 to 85 °C operating temperature range. Ideal for applications requiring precise timing in compact designs like IoT devices and wearables.
Comset Semiconductors
Siliconix
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain Current (ID): .115 A; Operating Mode: ENHANCEMENT MODE;
BAV99
Weitronic Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
FDC5614P
TAIZHOU ELECTRONICS CO LTD
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.92 W; Maximum Operating Temperature: 150 Cel; Package Body Material: PLASTIC/EPOXY;
EP1C12Q240C8N
Intel
EP1C12Q240C8N by Intel is a FPGA with 12060 logic cells, 173 inputs/outputs, and max clock frequency of 275 MHz. It is used in applications requiring high-speed processing and programmable logic capabilities. With a package style of flatpack and fine pitch, it offers versatility in design and integration.
5CGXFC4F7M11C8N
Intel's 5CGXFC4F7M11C8N FPGA boasts 50000 logic cells, 129 inputs/outputs, and operates at a max temp of 85°C. Ideal for applications requiring high-speed data processing and complex algorithm implementation in industries like telecommunications and automotive.
LAE5UM-45F-6BG381E
Lattice Semiconductor
FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260;
A3P1000-FG144I
Microchip Technology
A3P1000-FG144I by Microchip is a CMOS FPGA with 24576 CLBs and 1000000 gates. It operates at a max frequency of 350 MHz, suitable for industrial applications requiring high-speed processing. With a low profile grid array package, it offers flexibility for various design requirements.
EP3C16F256I7N
Intel's EP3C16F256I7N FPGA features 15408 logic cells, 168 inputs/outputs, and a max clock frequency of 472.5 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with low power consumption.
EP3C40Q240C8N
Altera
The EP3C40Q240C8N by Altera is a field programmable gate array (FPGA) with 39,600 logic cells and 128 inputs/outputs. It has a maximum clock frequency of 472.5 MHz and operates at a supply voltage range of 1.15V to 1.25V. This FPGA is surface mountable and has a compact rectangular package shape. Its applications include digital signal processing, communications, and embedded systems.
LCMXO2-256HC-5SG32I
LCMXO2-256HC-5SG32I by Lattice Semiconductor is a 256 Logic Cells FPGA with 32 CLBs and 21 Inputs/Outputs. Operating at 2.375V to 3.465V, it's ideal for applications requiring high performance in compact form factors like IoT devices and industrial automation systems.
EP3C10M164C8N
EP3C10M164C8N by Intel is a FPGA with 10320 logic cells, 106 inputs/outputs, and max clock frequency of 472.5 MHz. It operates at temperatures b/w 0-85°C and has a package style of grid array for applications requiring high-speed data processing in compact spaces.
EP3C25F256C8NES
EP3C25F256C8NES by Intel is a FPGA with 24624 CLBs, 472.5 MHz clock frequency, and 1.25 V max supply voltage. Ideal for applications requiring high-speed processing and programmable logic in compact form factors like IoT devices and telecommunications equipment.
M1A3P250-VQG100I
Microchip Technology's M1A3P250-VQG100I is a CMOS FPGA with 6144 CLBs and 250000 gates. It operates at temperatures ranging from -40 to 100 °C, with a supply voltage of 1.425V to 1.575V. This field-programmable IC in a square package is ideal for industrial applications requiring high gate count and versatile programmability.
LCMXO3LF-1300C-5BG256C
LCMXO3LF-1300C-5BG256C by Lattice Semiconductor is a 160 CLBs FPGA with max supply voltage of 3.465V and min operating temp of 0°C. Ideal for applications requiring low profile, fine pitch grid array packages in electronics industry.
A3P250-FGG256I
A3P250-FGG256I by Microchip Technology is a CMOS-based Field Programmable Gate Array (FPGA) with 6144 CLBs and 250000 gates. It operates at a max clock frequency of 350 MHz and has a package style of GRID ARRAY. This FPGA is commonly used in industrial applications requiring high-speed processing and programmability.
A3P250-VQG100I
Actel
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
XC7S25-1CSGA225Q
Xilinx
The Xilinx XC7S25-1CSGA225Q is a FPGA with 23360 logic cells, 1825 CLBs, and max clock frequency of 1098 MHz. It is used in automotive applications due to its low profile grid array package style and fine pitch terminals. Operating temperature ranges from -40°C to 125°C.
EP3C40F324I7N
The EP3C40F324I7N by Altera is a CMOS Field Programmable Gate Array with 39,600 logic cells. It has a maximum clock frequency of 472.5 MHz and operates in an industrial temperature range. Its compact BGA package makes it suitable for various applications requiring high performance and programmability.
LCMXO3LF-4300C-5BG256I
LCMXO3LF-4300C-5BG256I by Lattice Semiconductor is a 4300 Logic Cells FPGA with 540 CLBs and 206 Inputs/Outputs. It operates b/w -40 to 100 °C, has a supply voltage range of 2.375V to 3.465V, and uses PLASTIC/EPOXY package material. Ideal for applications requiring high-performance programmable ICs in compact form factors.
LFXP2-5E-5TN144C
LFXP2-5E-5TN144C by Lattice Semiconductor is a 5000 logic cell FPGA with 625 CLBs, operating at max 435MHz. It has a supply voltage of 1.2V, suitable for applications requiring high-speed processing in compact designs like IoT devices and industrial automation systems.
10M50DAF484I7G
Intel's 10M50DAF484I7G FPGA features 50000 logic cells, 3125 CLBs, and 500 inputs. With a max supply voltage of 1.25V, it is ideal for industrial applications requiring high-performance programmable ICs in a square package with grid array style.
10M25DAF484I7G
The Intel 10M25DAF484I7G is a FPGA with 25000 logic cells, 1563 CLBs, and 360 inputs/outputs. It operates at temperatures from -40 to 100 °C and has a supply voltage range of 1.15-1.25 V. Ideal for industrial applications requiring high-performance programmable ICs in a compact square grid array package.
XC7S75-2FGGA484I
Xilinx XC7S75-2FGGA484I FPGA features 76800 logic cells, 6000 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact square package with 484 terminals.
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10M08SAE144C8G
Intel 10M08SAE144C8G FPGA features 8000 logic cells, 500 CLBs, and 250 inputs/outputs. With a max supply voltage of 3.15V, it is ideal for applications requiring high-performance processing in commercial extended temperature environments.
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE;
10M08SCU169I7G
Intel's 10M08SCU169I7G FPGA features 8000 logic cells, 500 CLBs, and 250 inputs/outputs. With a max supply voltage of 3.15V, it is ideal for industrial applications requiring high-performance programmable ICs in a compact square package with ball terminals.
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: BGA; Package Shape: SQUARE; Pitch Of Terminal: .8 mm;
10M02SCE144I7G
Intel's 10M02SCE144I7G FPGA features 2000 logic cells, 125 CLBs, and 246 inputs/outputs. With a max supply voltage of 3.15V, it is ideal for industrial applications requiring high-performance programmable ICs in a compact square package with gull wing terminals.
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE; Package Equivalence Code: QFP144,.87SQ,20;
10M02SCE144C8G
Intel's 10M02SCE144C8G FPGA features 2000 logic cells, 125 CLBs, and 246 inputs/outputs. With a max supply voltage of 3.15V, it is ideal for applications requiring high-speed data processing in compact electronic systems. The package body material is plastic/epoxy with a square shape and gull wing terminals, making it suitable for surface mount designs with tight space constraints.
10M02SCU169C8G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: BGA; Package Shape: SQUARE;
The Intel 10M02SCU169C8G FPGA features 2000 logic cells, 125 CLBs, and 246 inputs/outputs. With a max supply voltage of 3.15V, it is ideal for applications requiring high-performance programmable ICs in a compact square package with ball terminals.
10M08SAU169C8G
10M08SAE144C8GES
FIELD PROGRAMMABLE GATE ARRAY;
10M08SCE144C8G
10M04DCU324I7G
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;
Intel's 10M04DCU324I7G FPGA features 4000 logic cells, 250 CLBs, and 246 inputs/outputs. With a max supply voltage of 1.25V, it is ideal for industrial applications requiring high-performance programmable ICs in a compact square package with 0.8mm terminal pitch.
10M02SCU169I7G
The Intel 10M02SCU169I7G is a FPGA with 2000 logic cells, 125 CLBs, and 246 inputs/outputs. It operates at a voltage range of 2.85V to 3.15V and has a temperature range of -40°C to 100°C. Ideal for industrial applications requiring high-performance programmable ICs in a compact grid array package.
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: BGA; Package Shape: SQUARE; No. of Inputs: 130;
10M08SAE144I7G
Intel's 10M08SAE144I7G FPGA boasts 8000 logic cells, 500 CLBs, and 250 inputs/outputs. Ideal for industrial applications requiring high performance in a compact package with a max supply voltage of 3.15V and operating temperatures ranging from -40 to 100°C.
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