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10M04SAU324I7G

Intel

10M04SAU324I7G by Intel

Intel's 10M04SAU324I7G FPGA features 4000 logic cells, 250 CLBs, and 246 inputs/outputs. With a package style of grid array, it is ideal for industrial applications requiring high performance in a compact form factor. Operating b/w -40 to 100 °C, this FPGA offers versatility and reliability for various electronic designs.

Median Price

$28.780

Lifecycle Status

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8

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1k+

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Mouser Electronics

USA . 6 parts In-Stock

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$34.660

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$27.730

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Verical

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Nova Conductors

Japan . 10 parts In-Stock

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$24.119

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Vyrian

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Digiode

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Touchstone Systems

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AZTECH Wire

Italy . 837 parts In-Stock

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$15.864

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Ampacity Inc.

Singapore . 119 parts In-Stock

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$19.460

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Vigor

Singapore . 246 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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$23.636

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$22.691

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Continental Prestige Electronics

USA . 5,740 parts In-Stock

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Microchip USA

USA . 1,458 parts In-Stock

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$25.770

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$24.270

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$23.770

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Component Stockers USA

USA . 4,773 parts In-Stock

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$28.570

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$22.860

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$68.410

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Texas Native Microelectronics

USA . 6,203 parts In-Stock

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$100.506

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$96.486

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Kenton Components

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A-Z Elektronik GmbH

Germany . 5,711 parts In-Stock

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Authorized Procurement Solutions

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MARBEL Systems

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Argo Parts USA

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GreenTree Electronics

Israel . 238 parts In-Stock

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Corphita

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Qasali Group International

UK . 88 parts In-Stock

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Speed Components Ltd (Excess)

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Overview

Looking for a powerful and versatile solution for your FPGA needs? Look no further than the 10M04SAU324I7G by Intel. With high-quality manufacturing and top-notch performance, this Field Programmable Gate Array is perfect for a wide range of applications. From industrial automation to telecommunications, this FPGA offers unmatched value, benefits, and advantages to customers seeking reliable and efficient solutions. Upgrade your projects with the Intel 10M04SAU324I7G and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection for the FPGA, making it suitable for various environments.

No. of Logic Cells: 4000

With 4000 logic cells, this FPGA has sufficient resources to handle complex logic circuits and processing tasks efficiently.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration of the FPGA onto circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 3.15 V

The higher maximum supply voltage of 3.15V allows for greater flexibility in power requirements for the FPGA.

No. of CLBs: 250

With 250 Configurable Logic Blocks (CLBs), this FPGA offers a good balance between logic resources and flexibility for various applications.

No. of Inputs: 246

Having 246 input pins provides ample opportunities for connectivity and data input to the FPGA for processing.

Package Shape: SQUARE

The square package shape is ideal for space efficiency and ease of mounting onto circuit boards, making it suitable for compact designs.

Nominal Supply Voltage (V): 3

The nominal supply voltage of 3V ensures stable and efficient operation of the FPGA within specified voltage limits.

No. of Terminals: 324

Having 324 terminals allows for connectivity and interfacing with other components and systems, enhancing the versatility of the FPGA.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array allows for flexibility in reprogramming and customizing the logic functions of the FPGA according to specific application requirements.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers ease of integration, reduced signal interference, and precise placement of the FPGA on PCBs.

Minimum Supply Voltage: 2.85 V

The minimum supply voltage of 2.85V ensures reliable operation within a wide voltage range, offering stability for various power supply scenarios.

Maximum Operating Temperature: 100 °C

With a maximum operating temperature of 100°C, this FPGA can withstand high temperature environments and is suitable for industrial applications.

Pitch Of Terminal: 0.8 mm

The 0.8mm pitch of terminals allows for compact and precise connections, facilitating efficient signal routing and reducing signal crosstalk.

Organization: 250 CLBS

The organizational structure of 250 CLBs provides a balanced distribution of logic resources, making the FPGA versatile and adaptable to a range of applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this FPGA can operate reliably in harsh cold environments and industrial settings.

Position Of Terminal: BOTTOM

Having terminals positioned at the bottom offers ease of soldering and PCB layout, ensuring secure connections and efficient board assembly.

Maximum Seated Height: 1.55 mm

The low maximum seated height of 1.55mm allows for slim and compact designs, enabling the FPGA to be easily integrated into space-constrained applications.

Width: 15 mm

With a width of 15mm, this FPGA is compact and space-efficient, making it suitable for applications where board real estate is limited.

No. of Outputs: 246

Having 246 output pins enables the FPGA to drive multiple external devices and communicate with various components, enhancing its functionality and connectivity.

Length: 15 mm

The length of 15mm complements the compact width of the FPGA, making it a small and versatile component suitable for a variety of circuit board layouts.

Grading Of Temperature: INDUSTRIAL

The industrial temperature grading ensures that this FPGA can reliably operate in demanding industrial environments with extended temperature ranges.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10M04SAU324I7G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

4000

No. of Inputs:

246

No. of Outputs:

246

No. of CLBs:

250

Organization:

250 CLBS

Additional Features:

Also Operates at 3.3 V nominal supply

Power Characteristics

Nominal Supply Voltage:

3

Minimum Supply Voltage:

2.85 V

Maximum Supply Voltage:

3.15 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA324,18X18,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.8 mm

No. of Terminals:

324

Standards

JESD-30 Code:

S-PBGA-B324

Trade Compliance

10M04SAU324I7G Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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