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10M16DAF484I7P

Intel

10M16DAF484I7P by Intel

Intel's 10M16DAF484I7P FPGA features 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. Ideal for industrial applications requiring high performance in a compact form factor with a max operating temperature of 100°C.

Median Price

$107.370

Lifecycle Status

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8

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Arrow

USA . 210 parts In-Stock

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$107.370

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$83.740

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$80.520

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$80.520

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$80.520

DigiKey

USA . 210 parts In-Stock

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$118.110

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$92.114

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Verical

USA . 210 parts In-Stock

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$107.370

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Nova Conductors

Japan . 59 parts In-Stock

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$86.097

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Digiode

USA . 393 parts In-Stock

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Vyrian

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VNN

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Chip Stock

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AZTECH Wire

Italy . 732 parts In-Stock

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$8.357

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Aztec Data Supply Inc.

USA . 2,522 parts In-Stock

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$43.680

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Netroflash

USA . 2,000 parts In-Stock

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$86.097

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$84.375

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Continental Prestige Electronics

USA . 459 parts In-Stock

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Corphita

USA . 445 parts In-Stock

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Corohmni

South Africa . 286 parts In-Stock

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Semicontronic

India . 210 parts In-Stock

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$91.260

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$88.978

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$88.522

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Ampacity Inc.

Singapore . 193 parts In-Stock

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Microchip USA

USA . 1,684 parts In-Stock

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$110.890

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$109.390

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$108.890

Texas Native Microelectronics

USA . 4,490 parts In-Stock

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$130.189

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$124.981

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$121.076

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$114.566

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Advanced Electronics

New Zealand . 830 parts In-Stock

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$141.233

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$128.522

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$115.811

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Qasali Group International

UK . 10 parts In-Stock

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Kenton Components

USA . 7,763 parts In-Stock

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Argo Parts USA

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MARBEL Systems

Belgium . 3,470 parts In-Stock

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Overview

Unlock limitless possibilities with the Intel 10M16DAF484I7P FPGA. Crafted by the renowned manufacturer Intel, this field programmable gate array boasts 16,000 logic cells and 1,000 CLBs, making it a powerhouse for a variety of applications. With a nominal supply voltage of 1.2V and a maximum operating temperature of 100°C, this FPGA offers unmatched performance and reliability. Whether you're in the automotive, industrial, or telecommunications industry, this versatile product is sure to elevate your projects to new heights. Experience the value and innovation that Intel brings to the table with the 10M16DAF484I7P FPGA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and cost-effective packaging for the FPGA.

No. of Logic Cells: 16000

Offers a high level of programmability and flexibility for complex designs.

Surface Mount: YES

Allows for easy integration into circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 1.25 V

Ensures stable and reliable performance within specified voltage range.

No. of CLBs: 1000

Provides ample capacity for implementing logic functions and routing signals.

No. of Inputs: 320

Offers multiple input options for interfacing with external devices and signals.

Package Shape: SQUARE

Facilitates efficient placement on circuit boards and optimizes space utilization.

Form Of Terminal: BALL

Enables reliable and secure connections with the circuit board for signal routing.

Nominal Supply Voltage (V): 1.2

Ideal voltage level for stable operation and compatibility with common power sources.

No. of Terminals: 484

Provides sufficient connection points for interfacing with external components and circuits.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Offers reprogrammable functionality for rapid prototyping and design iterations.

Package Style (Meter): GRID ARRAY

Facilitates easy and precise mounting on printed circuit boards for reliable connections.

Minimum Supply Voltage: 1.15 V

Ensures reliable operation even at lower voltage levels for power efficiency.

Maximum Operating Temperature: 100 °C

Can withstand high temperature environments common in industrial applications.

Pitch Of Terminal: 1 mm

Allows for precise and compact arrangement of terminals for efficient routing and connection.

Organization: 1000 CLBS

Structured organization of CLBs facilitates logical design implementation and signal routing.

Minimum Operating Temperature: -40 °C

Ensures reliable operation even in extreme cold environments.

Position Of Terminal: BOTTOM

Provides easy access to terminal connections during assembly and maintenance.

Maximum Seated Height: 2 mm

Low profile design allows for compact integration in space-constrained environments.

Width: 23 mm

Compact width dimension enables efficient use of board space for tight layouts.

No. of Outputs: 320

Generates multiple output signals for driving external components or communicating with devices.

Length: 23 mm

Compact length dimension for space-efficient placement on circuit boards.

Grading Of Temperature: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges for robust performance.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10M16DAF484I7P attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

16000

No. of Inputs:

320

No. of Outputs:

320

No. of CLBs:

1000

Organization:

1000 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

Trade Compliance

10M16DAF484I7P Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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