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EP3SL150F780C4G

Intel

EP3SL150F780C4G by Intel

EP3SL150F780C4G by Intel is a FPGA with 142.5K logic cells, 5700 CLBs, and 488 inputs/outputs. It operates b/w 0-85°C, has a supply voltage range of 0.86-0.94 V, and features a grid array package style. Ideal for applications requiring high-speed data processing and customizable logic functions in electronic systems.

Median Price

$5,472.766

Lifecycle Status

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Nova Conductors

Japan . 100 parts In-Stock

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Vyrian

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Chip Stock

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Digiode

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AZTECH Wire

Italy . 504 parts In-Stock

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Ampacity Inc.

Singapore . 443 parts In-Stock

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MARBEL Systems

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Texas Native Microelectronics

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Kenton Components

USA . 67 parts In-Stock

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Component Stockers USA

USA . 724 parts In-Stock

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Qasali Group International

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Netroflash

USA . 100 parts In-Stock

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$5,089.672

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Microchip USA

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Overview

Unlock endless possibilities with the EP3SL150F780C4G Field Programmable Gate Array by Intel. This cutting-edge FPGA is designed to deliver high-quality performance and reliability, backed by Intel's reputation as a leader in the industry. Ideal for a wide range of applications, this FPGA offers unmatched flexibility and customization, allowing you to bring your innovative ideas to life. Experience the value and benefits of this powerful FPGA, revolutionizing the way you approach your projects. Elevate your designs with the EP3SL150F780C4G and unleash your creativity today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the FPGA.

No. of Logic Cells: 142500

High number of logic cells allows for complex programmable functionality and versatility in the FPGA.

Surface Mount: YES

Surface mount capability makes it easier to mount and install the FPGA onto a circuit board.

Maximum Supply Voltage: 0.94 V

Efficient power consumption with low maximum supply voltage.

No. of CLBs: 5700

Plenty of Configurable Logic Blocks (CLBs) for designing custom logic functions.

No. of Inputs: 488

Large number of inputs allow for flexibility in accepting external signals and data.

Package Shape: SQUARE

Square shape allows for efficient use of space on a circuit board.

Form Of Terminal: BALL

Ball terminals provide reliable connections and easy integration with other components.

Nominal Supply Voltage (V): 0.9

Stable nominal supply voltage for consistent performance.

No. of Terminals: 780

Sufficient number of terminals for connecting the FPGA to other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Field programmable nature allows for customization and reconfiguration of logic functions.

Package Style (Meter): GRID ARRAY

Grid array package style provides easy integration into a circuit board layout.

Minimum Supply Voltage: 0.86 V

Low minimum supply voltage for efficient power usage.

Maximum Operating Temperature: 85 °C

Wide operating temperature range for versatility in different environmental conditions.

Pitch Of Terminal: 1 mm

1 mm pitch terminal spacing for easy connection and layout design.

Organization: 5700 CLBS

Organized into 5700 Configurable Logic Blocks for easier programming and logic design.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for use in various environments.

Position Of Terminal: BOTTOM

Bottom positioned terminals for easy access and connection on a circuit board.

Maximum Seated Height: 3 mm

Low maximum seated height for compact and space-efficient PCB design.

Width: 29 mm

Compact width dimension for fitting into tight spaces on a circuit board.

No. of Outputs: 488

Plenty of outputs for delivering processed data and signals to other components.

Length: 29 mm

Compact length dimension for efficient use of space on a circuit board.

Technical Specifications

Field Programmable Gate Arrays (FPGA) EP3SL150F780C4G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

142500

No. of Inputs:

488

No. of Outputs:

488

No. of CLBs:

5700

Organization:

5700 CLBS

Additional Features:

It can also operate from 1.05 to 1.15 V supply

Power Characteristics

Nominal Supply Voltage:

0.9

Minimum Supply Voltage:

.86 V

Maximum Supply Voltage:

.94 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

29 mm

Width:

29 mm

Maximum Seated Height:

3 mm

Package Equivalence Code:

BGA780,28X28,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

780

Standards

JESD-30 Code:

S-PBGA-B780

Trade Compliance

EP3SL150F780C4G Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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