Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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EP3SL340F1760C2 by Intel is a FPGA with 337.5K logic cells, 1120 inputs/outputs, and max clock frequency of 800MHz. It operates at 0.86-0.94V, suitable for applications requiring high-speed processing in compact form factors like telecommunications and industrial automation.
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Plastic/Epoxy material provides durability and protects the internal components of the FPGA, making it suitable for various environmental conditions.
Having a large number of logic cells allows for complex programmable logic functions to be implemented, making the FPGA versatile for different applications.
Surface mount capability makes the FPGA easy to integrate into circuit boards, saving space and simplifying the assembly process.
The low maximum supply voltage of 0.94V helps in reducing power consumption and heat dissipation, making the FPGA energy-efficient.
CMOS technology offers low power consumption and high noise immunity, enhancing the performance and reliability of the FPGA.
With a high number of inputs, the FPGA can handle a large amount of data simultaneously, making it suitable for data-intensive applications.
The square package shape allows for efficient use of space on circuit boards and facilitates easier placement and routing of traces.
Ball terminals provide a secure and reliable connection to the circuit board, ensuring stable performance of the FPGA.
The nominal supply voltage of 0.9V ensures consistent and stable operation of the FPGA within specified voltage ranges.
Having multiple power supply options allows for compatibility with different systems and voltage requirements, increasing the flexibility of the FPGA.
The large number of terminals enables seamless connectivity and integration of the FPGA with other electronic components in a circuit.
Being a field programmable gate array, the FPGA offers reconfigurability and flexibility in implementing custom logic functions, making it suitable for prototyping and rapid development.
The grid array package style provides a high terminal count in a compact footprint, enhancing the connectivity options and overall performance of the FPGA.
The low minimum supply voltage of 0.86V ensures reliable operation of the FPGA even under low power conditions, increasing its robustness.
The high maximum operating temperature of 85°C allows the FPGA to function reliably in a wide range of environmental conditions, enhancing its versatility.
The 1mm pitch of terminals enables easy and precise placement of the FPGA on the circuit board, simplifying the assembly process.
The low minimum operating temperature of 0°C ensures that the FPGA can operate effectively in cold environments, increasing its usability in various applications.
Terminal positioning at the bottom of the FPGA facilitates efficient routing of traces on the circuit board and allows for better heat dissipation.
The low maximum seated height of 3.9mm ensures that the FPGA can be placed in compact devices or systems with limited space requirements.
The moderate width of 42.5mm provides a balance between space efficiency and ease of integration, making the FPGA suitable for various board layouts.
The high maximum clock frequency of 800MHz enables fast data processing and operation of the FPGA, making it ideal for real-time applications.
Having a high number of outputs allows the FPGA to drive multiple devices or circuits simultaneously, enhancing its capability for complex signal processing tasks.
The moderate length of 42.5mm provides a compact form factor for the FPGA, making it suitable for integration into various electronic systems and devices.
Field Programmable Gate Arrays (FPGA) EP3SL340F1760C2 attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel
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EP3SL340F1760C2 Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
FDV303N
Onsemi
FDV303N by Onsemi is a N-CHANNEL FET with 25V DS Breakdown Voltage, 0.68A Drain Current, and 0.45 ohm On Resistance. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE at temperatures ranging from -55 to 150°C. Package style is SMALL OUTLINE with GULL WING terminals for surface mount assembly.
LM358MX
Texas Instruments
LM358MX by Texas Instruments is a dual operational amplifier with a max input offset voltage of 9000 uV. It has a nominal voltage of 5V and a min voltage gain of 15000. This op amp is commonly used in applications requiring amplification and signal conditioning.
ATMEGA328P-AU
Atmel
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE;
2902037
Phoenix Contact
MODULAR TERMINAL BLOCK;
FDC5614P
MSKSEMI SEMICONDUCTOR
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
SMBJ18CA
Changzhou Galaxy Century Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002,215
NXP Semiconductors
2N7002,215 by NXP Semiconductors is a small signal N-CHANNEL FET with a min DS breakdown voltage of 60V and max drain current of 0.3A. It is used for switching applications in enhancement mode, operates b/w -65 to 150 °C, and has a max power dissipation of 0.2W.
M85049/85-08W02
Amphenol
CIRCULAR CONN ACCESSORY; Shell Sizes: 8; 9; IEC Conformity: NO; MIL-Connector Accessory Name: BAND LOCK ADAPTER; MIL Conformity: YES; DIN Conformity: NO;
CR0805-FX-10R0ELF
Bourns
Bourns CR0805-FX-10R0ELF is a SMT fixed resistor with 10 ohm resistance, 1% tolerance, and 0.125 W power dissipation. Ideal for applications requiring a temperature range of -55 to 155 °C, such as automotive electronics and industrial control systems.
1N4148
Bkc Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BAV99
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Output Current: .1 A; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Maximum Reverse Recovery Time: .006 us;
2N2222A
Microchip Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum Operating Temperature: -65 Cel; Terminal Position: BOTTOM;
International Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.1 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
U.FL-R-SMT-1(10)
Hirose Electric
U.FL-R-SMT-1(10) by Hirose Electric is a RF connector with 50 ohm impedance, 0.05 dB insertion loss, and 8 GHz operating frequency. Ideal for board mounting in commercial applications, it features gold termination finish, liquid crystal polymer insulator, and 200VAC dielectric voltage resistance.
LM317AEMP/NOPB
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: SOP; Terminal Form: GULL WING; Qualification Status: Not Qualified; Width: 3.56 mm;
BSS138PS,115
Nexperia
N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 2; No. of Terminals: 6; Minimum DS Breakdown Voltage: 60 V;
LM358N
Samsung
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
C1005X7R1E103K050BB
TDK
The TDK C1005X7R1E103K050BB is a ceramic capacitor with capacitance of 0.01uF and rated DC voltage of 25V. It features X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications requiring compact size and stable performance in various electronic circuits.
1N4148WS
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
GRM155R71H103KA88D
Murata Manufacturing
The Murata Manufacturing GRM155R71H103KA88D is a ceramic capacitor with 0.01uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring compact size and high reliability.
EP3C16E144C8N
Altera
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: RECTANGULAR;
M2S010-TQG144I
M2S010-TQG144I by Microchip Technology is a 12084 logic cell FPGA with 84 inputs/outputs. It operates b/w -40 to 100 °C and has a supply voltage range of 1.14V to 1.26V. Ideal for applications requiring high-density programmable logic in compact form factors.
10M16SCU169A7G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: BGA; Package Shape: SQUARE;
XC7K160T-1FFG676C
Xilinx
XC7K160T-1FFG676C by Xilinx is a FPGA with 162240 logic cells, 12675 CLBs, and max clock frequency of 1098 MHz. It operates at supply voltages ranging from 0.97V to 3.3V and is used in applications requiring high-speed processing and programmable ICs.
XCAU10P-1SBVB484I
FIELD PROGRAMMABLE GATE ARRAY;
XQR5VFX130-1CN1752B
Xilinx XQR5VFX130-1CN1752B is a 131072 logic cell FPGA with 10240 CLBs, operating at -55 to 125 °C. It uses CMOS technology, has a max supply voltage of 1.05 V, and total dose of 1M Rad(Si). Ideal for military applications requiring high-performance computing in harsh environments.
A3P1000-PQG208
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
XC6SLX45-3FGG484C
Xilinx XC6SLX45-3FGG484C FPGA features 43661 logic cells, 3411 CLBs, and 316 inputs/outputs. Utilized in applications requiring high clock frequencies up to 862 MHz, such as telecommunications and signal processing due to its CMOS technology and low combinatorial delay of 0.21 ns.
EP4CE15F23C8N
The EP4CE15F23C8N by Altera is a field programmable gate array (FPGA) with 15408 logic cells, 963 configurable logic blocks (CLBs), and 346 inputs and outputs. It operates at a maximum clock frequency of 472.5 MHz and has a maximum supply voltage of 1.25V. This FPGA is suitable for various applications such as digital signal processing, wireless communications, and video processing.
XC7A100T-1FTG256I
XC7A100T-1FTG256I by Xilinx is a Field Programmable Gate Array (FPGA) with 101,440 logic cells and 7,925 configurable logic blocks (CLBs). It operates at a max clock frequency of 1.098 GHz and is commonly used in industrial applications requiring high-speed processing and programmability.
XC7S6-2CPGA196C
XC7S6-2CPGA196C by Xilinx is a 6000 logic cell FPGA with a max clock frequency of 1286 MHz. It is used for applications requiring high-speed processing and programmable logic capabilities.
M2GL060-FCSG325I
M2GL060-FCSG325I by Microsemi is a PLASTIC/EPOXY FPGA with a max supply voltage of 1.26V. It has 325 terminals and is suitable for applications requiring a field programmable gate array.
MPF100TS-1FCVG484I
MPF100TS-1FCVG484I by Microchip Tech is a CMOS FPGA with 284 inputs/outputs, operating temp range -40 to 100°C. It has a grid array package style, 0.8mm terminal pitch, and is suitable for applications requiring high-density programmable logic solutions.
M2GL050-VFG400I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE;
XCAU15P-2SBVB484E
M2GL005-TQG144
M2GL005-TQG144 by Microchip Technology is a Field Programmable Gate Array (FPGA) with a max supply voltage of 1.26V and min operating temperature of 0°C. Its package style is flatpack, low profile, fine pitch making it suitable for applications requiring high performance in compact spaces. With 144 terminals and moisture sensitivity level of 3, this FPGA offers versatility and reliability for various electronic designs.
M1A3P250-PQG208
Actel
XC7A50T-1FGG484I
The Xilinx XC7A50T-1FGG484I is a FPGA with 52160 logic cells, 4075 CLBs, and operates at a max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; Maximum Supply Voltage: 1.26 V;
EP4CE6F17C7N
Intel
EP4CE6F17C7N by Intel is a FPGA with 6272 logic cells, 392 CLBs, and max clock frequency of 472.5 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment, industrial automation systems, and digital signal processing.
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EP3SL50F780C4N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE;
EP3SL150F1152C4N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;
EP3SE80F1152C3N
EP3SE80F1152C2G
EP3SL110F780C3N
EP3SL150F780I3N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE;
EP3SL110F1152C4G
EP3SL50F780C2N
EP3SL50F780C4G
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE; Organization: 1900 CLBS;
EP3SE80F1152C3G
EP3SE80F780C4LG
EP3SL110F780I4N
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B780;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): NOT SPECIFIED;
EP3SL150F780I4N
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE; Pitch Of Terminal: 1 mm;
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