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EP3SL70F780I3G

Intel

EP3SL70F780I3G by Intel

EP3SL70F780I3G by Intel is a FPGA with 67500 logic cells, 2700 CLBs, and 488 inputs/outputs. It operates b/w -40 to 100°C, has a supply voltage range of 0.86V to 0.94V, and features a grid array package style. Ideal for industrial applications requiring high-performance programmable ICs in compact form factors.

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Vyrian

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Digiode

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Nova Conductors

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AZTECH Wire

Italy . 1,012 parts In-Stock

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Ampacity Inc.

Singapore . 678 parts In-Stock

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Advanced Electronics

New Zealand . 39 parts In-Stock

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MARBEL Systems

Belgium . 3,914 parts In-Stock

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Texas Native Microelectronics

USA . 3,024 parts In-Stock

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Kenton Components

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Corohmni

South Africa . 339 parts In-Stock

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Microchip USA

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Continental Prestige Electronics

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Argo Parts USA

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Qasali Group International

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Aranea Global

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Overview

Unleash the power of innovation with the Intel EP3SL70F780I3G Field Programmable Gate Array. Manufactured by industry leader Intel, this FPGA offers unparalleled quality and reliability. With a multitude of applications in industries such as telecommunications, automotive, and aerospace, this product provides endless possibilities for customization and optimization. Experience the value and benefits of this cutting-edge technology, from increased efficiency to enhanced performance. Elevate your projects to new heights with the Intel EP3SL70F780I3G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the internal components of the FPGA, making it suitable for various environmental conditions.

No. of Logic Cells: 67500

Large number of logic cells allow for complex and high-performance logic design implementation in the FPGA.

Maximum Supply Voltage: 0.94 V

Low maximum supply voltage helps in reducing power consumption and heat dissipation, making the FPGA energy-efficient.

No. of CLBs: 2700

The high number of Configurable Logic Blocks (CLBs) provide flexibility in designing custom logic functions and circuits in the FPGA.

Package Shape: SQUARE

Square package shape allows for efficient use of space on a circuit board, enabling compact designs and optimal utilization of available PCB area.

Nominal Supply Voltage (V): 0.9

Stable nominal supply voltage ensures reliable performance of the FPGA under varying load conditions.

No. of Terminals: 780

High number of terminals enable seamless integration of the FPGA into a system or PCB, providing connectivity options for various external components.

Maximum Operating Temperature: 100 °C

Wide maximum operating temperature range makes the FPGA suitable for industrial applications where temperature variations are common.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the FPGA can function in extreme cold environments without any performance degradation.

Technical Specifications

Field Programmable Gate Arrays (FPGA) EP3SL70F780I3G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

67500

No. of Inputs:

488

No. of Outputs:

488

No. of CLBs:

2700

Organization:

2700 CLBS

Additional Features:

It can also operate from 1.05 to 1.15 V supply

Power Characteristics

Nominal Supply Voltage:

0.9

Minimum Supply Voltage:

.86 V

Maximum Supply Voltage:

.94 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

29 mm

Width:

29 mm

Maximum Seated Height:

3 mm

Package Equivalence Code:

BGA780,28X28,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

780

Standards

JESD-30 Code:

S-PBGA-B780

Trade Compliance

EP3SL70F780I3G Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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