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EP3SL150F780I4N

Intel

EP3SL150F780I4N by Intel

EP3SL150F780I4N by Intel is a FPGA with 142.5K logic cells, 5700 CLBs, and 488 inputs/outputs. It operates at -40 to 100°C, with supply voltages of 0.86V to 1.2/3.3V. Ideal for applications requiring high-speed data processing and complex logic functions in compact designs.

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Flip Electronics

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Nova Conductors

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Cyclops Electronics Ltd

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Andel Nordic

Denmark . 5,950 parts In-Stock

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Semicontronic

India . 1,357 parts In-Stock

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One Stop Electronics

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Ampacity Inc.

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MARBEL Systems

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Texas Native Microelectronics

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Kenton Components

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Qasali Group International

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Modulus Dynamics

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Microchip USA

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Overview

Unlocking endless possibilities in electronic design, the Intel EP3SL150F780I4N FPGA offers unparalleled quality and reliability. Manufactured by industry leader Intel, this Field Programmable Gate Array is perfect for a wide range of applications. From telecommunications to automotive systems, this FPGA provides customers with exceptional value, flexibility, and performance. Experience the advantages of cutting-edge technology with the EP3SL150F780I4N, where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Being made of plastic/epoxy material makes the FPGA lightweight and durable, making it suitable for various applications.

No. of Logic Cells: 142500

With a large number of logic cells, this FPGA has high processing power, allowing for complex designs and computations.

Maximum Supply Voltage: 0.94 V

The low maximum supply voltage helps in reducing power consumption and heat generation, contributing to energy efficiency.

No. of CLBs: 5700

Having 5700 configurable logic blocks enables flexibility in design and customization for specific applications.

No. of Inputs: 488

With a high number of inputs, this FPGA can handle a large amount of data and signals simultaneously, enhancing its processing capability.

Nominal Supply Voltage (V): 0.9

The nominal supply voltage of 0.9V is ideal for efficient power consumption and performance optimization in various electronic systems.

Power Supplies (V): 1.2/3.3

Support for multiple power supply voltages allows compatibility with different systems and flexibility in voltage requirements.

No. of Terminals: 780

Having 780 terminals provides ample connectivity options for interfacing with other components and subsystems in a design.

Package Style (Meter): GRID ARRAY

The grid array package style offers a compact and organized layout for easy integration into circuit boards and systems.

Minimum Operating Temperature: -40 °C

The wide minimum operating temperature range of -40°C ensures reliability and performance in harsh environments and varying climate conditions.

Moisture Sensitivity Level (MSL): 3

With MSL 3 rating, the FPGA is protected against moisture damage, ensuring operational integrity in humid conditions.

Width: 29 mm

The compact width of 29mm allows for space-efficient placement on PCBs, enabling dense and high-performance electronic designs.

No. of Outputs: 488

Having 488 outputs enhances the ability of the FPGA to drive multiple external devices and communicate with various components in a system.

Technical Specifications

Field Programmable Gate Arrays (FPGA) EP3SL150F780I4N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

142500

No. of Inputs:

488

No. of Outputs:

488

No. of CLBs:

5700

Sub-Category:

Field Programmable Gate Arrays

Organization:

5700 CLBS

Additional Features:

It can also operate from 1.05 to 1.15 V supply

Power Characteristics

Nominal Supply Voltage:

0.9

Minimum Supply Voltage:

.86 V

Maximum Supply Voltage:

.94 V

Power Supplies:

1.2/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

29 mm

Width:

29 mm

Maximum Seated Height:

3.2 mm

Package Equivalence Code:

BGA780,28X28,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

780

Standards

JESD-30 Code:

S-PBGA-B780

Qualified:

No

Trade Compliance

EP3SL150F780I4N Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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