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10M08SAU324C8G

Intel

10M08SAU324C8G by Intel

Intel's 10M08SAU324C8G FPGA features 8000 logic cells, 500 CLBs, and 250 inputs/outputs. With a package style of grid array and low profile, it is ideal for applications requiring high-speed processing in commercial extended temperature environments.

Median Price

$36.610

Lifecycle Status

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DigiKey

USA . 5 parts In-Stock

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Digiode

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Vyrian

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Sensible Micro Corp

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Nova Conductors

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Ampacity Inc.

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$28.290

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Corphita

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Microchip USA

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Corohmni

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Texas Native Microelectronics

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Advanced Electronics

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Qasali Group International

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Kenton Components

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MARBEL Systems

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Overview

Unlock the power of innovation with the Intel 10M08SAU324C8G Field Programmable Gate Array (FPGA). Manufactured by industry leader Intel, this versatile FPGA offers endless possibilities for your projects. With 8000 logic cells and 500 CLBs, this FPGA is perfect for applications requiring high-performance computing and flexibility. Whether you're designing cutting-edge electronics or optimizing complex algorithms, the Intel 10M08SAU324C8G delivers unmatched value, efficiency, and reliability. Take your projects to the next level with Intel's top-of-the-line FPGA technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the FPGA.

No. of Logic Cells: 8000

Offers a high level of programmability and flexibility for various applications that require complex logic operations.

Surface Mount: YES

Facilitates easy integration onto circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.15 V

Allows for a wide range of input voltages, increasing compatibility with different power sources.

No. of CLBs: 500

Provides ample capacity for implementing custom logic functions, enhancing the versatility of the FPGA.

No. of Inputs: 250

Enables the FPGA to process a large number of input signals simultaneously, supporting high-performance applications.

Package Shape: SQUARE

Optimizes space utilization on circuit boards, allowing for efficient placement and routing of signals.

Nominal Supply Voltage (V): 3

Maintains stable operation within the recommended voltage range, ensuring reliable performance.

No. of Terminals: 324

Provides multiple connection points for interfacing with other components, enhancing the versatility of the FPGA.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Enables users to customize the functionality of the device based on specific requirements, offering flexibility in design.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Facilitates a compact and efficient package design, reducing the footprint on the PCB and enhancing overall system performance.

Minimum Supply Voltage: 2.85 V

Supports operation at lower voltage levels, saving power and minimizing heat dissipation.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature environments, making it suitable for a wide range of applications.

Pitch Of Terminal: 0.8 mm

Provides a fine pitch for the terminals, enabling high-density mounting and enhancing signal integrity.

Organization: 500 CLBS

Indicates a well-structured design with a sufficient number of configurable logic blocks, offering flexibility in implementing complex logic functions.

Minimum Operating Temperature: 0 °C

Supports operation in cold environments without compromising performance, making it suitable for diverse application scenarios.

Position Of Terminal: BOTTOM

Facilitates easy routing of signals on the PCB, enhancing the overall design efficiency.

Maximum Seated Height: 1.55 mm

Provides a low-profile package design, enabling space-saving integration in compact electronic devices.

Width: 15 mm

Offers a compact form factor, allowing for easy integration into various electronic systems.

No. of Outputs: 250

Enables the FPGA to drive multiple output signals, supporting diverse application requirements.

Length: 15 mm

Maintains a balanced design with optimized dimensions, enhancing the overall flexibility in PCB layout.

Grading Of Temperature: COMMERCIAL EXTENDED

Indicates a wide temperature range for operation, making it suitable for both commercial and extended industrial applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10M08SAU324C8G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

8000

No. of Inputs:

250

No. of Outputs:

250

No. of CLBs:

500

Organization:

500 CLBS

Additional Features:

Also Operates at 3.3 V nominal supply

Power Characteristics

Nominal Supply Voltage:

3

Minimum Supply Voltage:

2.85 V

Maximum Supply Voltage:

3.15 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA324,18X18,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.8 mm

No. of Terminals:

324

Standards

JESD-30 Code:

S-PBGA-B324

Trade Compliance

10M08SAU324C8G Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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