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10M50DAF484I7P

Intel

10M50DAF484I7P by Intel

Intel's 10M50DAF484I7P FPGA features 50000 logic cells, 3125 CLBs, and 500 inputs/outputs. Ideal for industrial applications requiring high performance with a wide operating temperature range (-40 to 100°C) in a compact square package (23x23mm).

Median Price

$309.250

Lifecycle Status

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DigiKey

USA . 116 parts In-Stock

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$309.250

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Nova Conductors

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Vyrian

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Digiode

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AZTECH Wire

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Semicontronic

India . 362 parts In-Stock

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Corohmni

South Africa . 329 parts In-Stock

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Ampacity Inc.

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Aztec Data Supply Inc.

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Texas Native Microelectronics

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Kenton Components

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Aranea Global

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Continental Prestige Electronics

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Microchip USA

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Advanced Electronics

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Component Stockers USA

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Vigor

Singapore . 100 parts In-Stock

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Argo Parts USA

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MARBEL Systems

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Qasali Group International

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Overview

Unlock the potential of your projects with the Intel 10M50DAF484I7P FPGA. Manufactured by industry leader Intel, this innovative device offers a versatile platform for a wide range of applications. With 50000 logic cells and 3125 CLBs, this FPGA allows for high-performance customization and flexibility. Whether you're designing cutting-edge electronics or optimizing industrial processes, the Intel 10M50DAF484I7P provides the value and reliability you need to succeed. Upgrade your projects today with Intel's top-of-the-line FPGA technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the FPGA a reliable choice for various applications.

No. of Logic Cells: 50000

With a large number of logic cells, this FPGA can handle complex designs and processes efficiently.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on circuit boards, saving time and effort.

Maximum Supply Voltage: 1.25 V

The high maximum supply voltage ensures stable operation and compatibility with a wide range of systems.

No. of CLBs: 3125

The ample number of Configurable Logic Blocks (CLBs) provides flexibility in designing and implementing logic functions.

No. of Inputs: 500

Having a high number of inputs allows for versatile connectivity and input options for the FPGA.

Package Shape: SQUARE

The square package shape enables efficient use of space on a PCB and simplifies layout design.

Form Of Terminal: BALL

The use of ball terminals facilitates good electrical connections and reliable soldering during assembly.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage is well within standard operating ranges, ensuring compatibility with various systems.

No. of Terminals: 484

Having a sufficient number of terminals allows for robust connectivity and signal routing within the FPGA.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a field programmable device, this FPGA offers flexibility for customization and reconfiguration based on application requirements.

Package Style (Meter): GRID ARRAY

The grid array package style simplifies PCB layout and assembly, making integration into electronic systems more efficient.

Minimum Supply Voltage: 1.15 V

The low minimum supply voltage ensures energy efficiency and compatibility with power-sensitive applications.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this FPGA can withstand harsh environmental conditions and extended use.

Pitch Of Terminal: 1 mm

The tight terminal pitch allows for compact PCB designs and efficient use of space in electronic assemblies.

Organization: 3125 CLBS

The organized structure of 3125 Configurable Logic Blocks (CLBs) enhances the FPGA's performance and design capabilities.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance in cold environments or temperature variations.

Position Of Terminal: BOTTOM

The placement of terminals at the bottom makes it easier to integrate the FPGA into circuit boards and improves connectivity.

Maximum Seated Height: 2 mm

The low maximum seated height allows for compact system designs and efficient use of space in electronic devices.

Width: 23 mm

The moderate width of the FPGA ensures compatibility with standard PCB sizes and facilitates integration into electronic systems.

No. of Outputs: 500

Having a high number of outputs enables versatile signal routing and connectivity options for the FPGA within a system.

Length: 23 mm

The moderate length of the FPGA allows for flexibility in layout design and compatibility with standard PCB dimensions.

Grading Of Temperature: INDUSTRIAL

The industrial-grade temperature grading ensures reliable performance in demanding environments and extended use scenarios.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10M50DAF484I7P attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

50000

No. of Inputs:

500

No. of Outputs:

500

No. of CLBs:

3125

Organization:

3125 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

Trade Compliance

10M50DAF484I7P Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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