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10M16SAU324C8G

Intel

10M16SAU324C8G by Intel

Intel's 10M16SAU324C8G FPGA features 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. With a package style of grid array and low profile, it is ideal for applications requiring high-speed processing in commercial extended temperature environments.

Median Price

$68.510

Lifecycle Status

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DigiKey

USA . 112 parts In-Stock

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$53.427

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Mouser Electronics

USA . 24 parts In-Stock

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$68.510

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$54.790

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$53.430

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Digiode

USA . 427 parts In-Stock

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$55.300

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Vyrian

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VNN

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Nova Conductors

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Ampacity Inc.

Singapore . 77 parts In-Stock

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$49.480

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Corphita

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Microchip USA

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Texas Native Microelectronics

USA . 24,227 parts In-Stock

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Kenton Components

USA . 3,824 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

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Aranea Global

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Qasali Group International

UK . 784 parts In-Stock

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MARBEL Systems

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Overview

Unlock the power of cutting-edge technology with Intel's 10M16SAU324C8G FPGA. Designed by a trusted industry leader, this Field Programmable Gate Array offers endless possibilities for innovation in a compact package. With 16,000 logic cells and 1,000 CLBs, this versatile device is perfect for a wide range of applications. Whether you're designing high-performance electronics or creating intricate algorithms, this FPGA delivers unmatched flexibility and performance. Experience the future of technology with Intel's 10M16SAU324C8G - where quality meets ingenuity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the FPGA lightweight and durable, ideal for various applications.

No. of Logic Cells: 16000

Having a high number of logic cells allows for complex designs and processing capabilities within the FPGA.

Surface Mount: YES

Surface mount capability makes installation and integration of the FPGA easier and more efficient.

Maximum Supply Voltage: 3.15 V

A higher maximum supply voltage allows for flexibility in power requirements and compatibility with various systems.

No. of CLBs: 1000

Having a high number of Configurable Logic Blocks (CLBs) provides versatility and customization options in the FPGA design.

No. of Inputs: 320

A high number of inputs allows for extensive data processing and connectivity within the FPGA.

Package Shape: SQUARE

Square package shape allows for efficient use of space and easy integration into electronic systems.

Form Of Terminal: BALL

The ball terminal form provides reliable and secure connections for effective communication within the FPGA.

Nominal Supply Voltage (V): 3

Having a standard nominal supply voltage ensures compatibility with a wide range of systems and power sources.

No. of Terminals: 324

A high number of terminals allows for versatile connectivity options and enhanced functionality of the FPGA.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

The FPGA is programmable, allowing for flexible design changes and customization according to specific requirements.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style provides compactness, efficiency, and enhanced performance in the FPGA.

Minimum Supply Voltage: 2.85 V

A low minimum supply voltage helps in reducing power consumption and enhancing energy efficiency of the FPGA.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature ensures reliability and stability of the FPGA in various environmental conditions.

Pitch Of Terminal: 0.8 mm

The small pitch of the terminal enables high-density packaging and efficient signal routing within the FPGA.

Organization: 1000 CLBS

Well-organized CLBs provide structured logic and processing capabilities within the FPGA, enhancing overall performance.

Minimum Operating Temperature: 0 °C

A low minimum operating temperature allows the FPGA to function effectively even in cold environments.

Position Of Terminal: BOTTOM

The bottom position of the terminal facilitates easy installation and connectivity of the FPGA within electronic systems.

Maximum Seated Height: 1.55 mm

Having a low seated height makes the FPGA suitable for compact and slim device designs.

Width: 15 mm

The width of 15 mm offers a good balance between size and functionality, making the FPGA versatile for different applications.

No. of Outputs: 320

A high number of outputs allows for efficient data transfer and processing capabilities within the FPGA.

Length: 15 mm

The length of 15 mm provides a compact form factor, ideal for space-constrained electronic devices.

Grading Of Temperature: COMMERCIAL EXTENDED

Commercial extended temperature grading ensures reliable performance even in harsh operating conditions, making the FPGA suitable for industrial applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10M16SAU324C8G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

16000

No. of Inputs:

320

No. of Outputs:

320

No. of CLBs:

1000

Organization:

1000 CLBS

Additional Features:

Also Operates at 3.3 V nominal supply

Power Characteristics

Nominal Supply Voltage:

3

Minimum Supply Voltage:

2.85 V

Maximum Supply Voltage:

3.15 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA324,18X18,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.8 mm

No. of Terminals:

324

Standards

JESD-30 Code:

S-PBGA-B324

Trade Compliance

10M16SAU324C8G Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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