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EP4CE6F17C6N

Intel

EP4CE6F17C6N by Intel

EP4CE6F17C6N by Intel is a FPGA with 6272 logic cells, 392 CLBs, and max clock frequency of 472.5 MHz. Ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems due to its low profile package style and high operating temperature range up to 85°C.

Median Price

$34.780

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Mouser Electronics

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DigiKey

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Verical

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Digiode

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Nova Conductors

Japan . 90 parts In-Stock

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Vyrian

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Bristol Electronics

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Cyclops Electronics Ltd

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ACDS - Activité Composants Distribution Service

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Dan-Mar Components

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Andel Nordic

Denmark . 5,765 parts In-Stock

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$2.933

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AZTECH Wire

Italy . 726 parts In-Stock

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One Stop Electronics

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Ampacity Inc.

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Corohmni

South Africa . 745 parts In-Stock

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MARBEL Systems

Belgium . 300 parts In-Stock

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Corphita

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Continental Prestige Electronics

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Semicontronic

India . 60 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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Modulus Dynamics

Lithuania . 597 parts In-Stock

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Kenton Components

USA . 450 parts In-Stock

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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Texas Native Microelectronics

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Vigor

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Qasali Group International

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Perfect Parts

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A-Z Elektronik GmbH

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Microchip USA

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QUARKTWIN TECHNOLOGY LTD

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Alle Elektronik GmbH

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Argo Parts USA

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Glotronic Ltd.

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Supply Digital

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GreenTree Electronics

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Overview

Unleash the power of innovation with the EP4CE6F17C6N by Intel, a cutting-edge Field Programmable Gate Array that offers unmatched quality and reliability. Designed by a trusted manufacturer, this FPGA boasts 6272 logic cells and 392 CLBs, making it ideal for a wide range of applications. With a maximum clock frequency of 472.5 MHz and a low profile grid array package style, this versatile product delivers superior performance while providing customers with the flexibility and customization they need to bring their designs to life. Elevate your projects with the EP4CE6F17C6N and experience the limitless possibilities it has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this FPGA lightweight and durable, ideal for portable and long-lasting electronic devices.

No. of Logic Cells: 6272

With a high number of logic cells, this FPGA is capable of handling complex programming and processing tasks, making it suitable for advanced applications in various industries.

Surface Mount: YES

Being surface mountable allows for easy and convenient integration of this FPGA onto PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 1.25 V

The low maximum supply voltage of 1.25V helps in minimizing power consumption and heat generation, making this FPGA energy-efficient and suitable for battery-operated devices.

No. of CLBs: 392

The high number of Configurable Logic Blocks (CLBs) provides flexibility and scalability in programming options, making this FPGA versatile and suitable for a wide range of applications.

No. of Inputs: 179

With 179 inputs, this FPGA can accommodate a large number of signals and data inputs, enabling complex data processing and manipulation.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a PCB, optimizing component layout and assembly design.

Form Of Terminal: BALL

The ball terminal design enhances reliability and durability during soldering and connection processes, ensuring a robust electrical connection for stable performance.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage of 1.2V ensures consistent and reliable operation, providing stable power delivery for consistent performance.

Power Supplies (V): 1.2,1.2/3.3,2.5

With multiple power supply options, this FPGA can be easily integrated into different power systems, enhancing compatibility and flexibility in design.

No. of Terminals: 25

The high number of terminals allows for versatile connections and interfaces, facilitating complex circuit designs and enabling advanced functionalities.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a Field Programmable Gate Array, this product offers flexibility and customization in logic design and implementation, making it suitable for prototyping and low-volume production.

Package Style (Meter): GRID ARRAY, LOW PROFILE

The grid array and low profile package style offers efficient heat dissipation and space-saving benefits, making this FPGA suitable for compact and high-performance applications.

Minimum Supply Voltage: 1.15 V

The low minimum supply voltage requirement of 1.15V ensures stable operation even under low-power conditions, making this FPGA suitable for energy-efficient designs.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this FPGA can withstand higher temperature environments, making it suitable for industrial and automotive applications.

Pitch Of Terminal: 1 mm

The 1mm pitch of the terminal spacing allows for precise and compact soldering, facilitating efficient PCB assembly and ensuring reliable electrical connections.

Organization: 392 CLBs

The organization of 392 Configurable Logic Blocks provides a structured and efficient architecture for logic design and implementation, enabling optimized performance and functionality.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, this FPGA can start up and function reliably even in cold environments, ensuring consistent performance in diverse conditions.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper finishing on the terminals improves conductivity and corrosion resistance, ensuring long-term reliability and stable performance.

Position Of Terminal: BOTTOM

The bottom position of the terminal enhances ease of soldering and PCB layout, optimizing space utilization and facilitating efficient assembly processes.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this FPGA can withstand moderate exposure to moisture during storage and assembly, ensuring reliability and performance in varied environments.

Maximum Seated Height: 1.55 mm

The low maximum seated height of 1.55mm allows for slim and compact PCB designs, making this FPGA suitable for space-constrained applications.

Width: 17 mm

The width of 17mm provides a compact form factor for this FPGA, enabling easy integration into diverse electronic devices and systems.

Maximum Clock Frequency: 472.5 MHz

With a high maximum clock frequency of 472.5MHz, this FPGA can achieve fast signal processing and data throughput, making it suitable for high-speed applications.

No. of Outputs: 179

With 179 outputs, this FPGA can deliver a large number of processed signals and data, enabling complex communication and control functions in various electronic systems.

Length: 17 mm

The length of 17mm offers a balanced form factor for this FPGA, ensuring compatibility with standard PCB sizes and facilitating easy integration into electronic designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) EP4CE6F17C6N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

6272

No. of Inputs:

179

No. of Outputs:

179

No. of CLBs:

392

Maximum Clock Frequency:

472.5 MHz

Sub-Category:

Field Programmable Gate Arrays

Organization:

392 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Power Supplies:

1.2,1.2/3.3,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

EP4CE6F17C6N Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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