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10M08SAU324I7G

Intel

10M08SAU324I7G by Intel

The Intel 10M08SAU324I7G is an FPGA with 8000 logic cells, 500 CLBs, and 250 inputs/outputs. It operates at a voltage range of 2.85V to 3.15V and has a temperature range of -40°C to 100°C. This FPGA is ideal for industrial applications requiring high-performance programmable ICs in a compact grid array package.

Median Price

$44.390

Lifecycle Status

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Mouser Electronics

USA . 138 parts In-Stock

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$35.510

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$34.620

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DigiKey

USA . 127 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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Digiode

USA . 325 parts In-Stock

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VNN

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Sensible Micro Corp

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Vyrian

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AZTECH Wire

Italy . 888 parts In-Stock

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$13.599

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MARBEL Systems

Belgium . 964 parts In-Stock

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Texas Native Microelectronics

USA . 3,202 parts In-Stock

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Kenton Components

USA . 1,572 parts In-Stock

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Vigor

Singapore . 830 parts In-Stock

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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Corohmni

South Africa . 119 parts In-Stock

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Continental Prestige Electronics

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Bastille Electronics

Australia . 50 parts In-Stock

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Microchip USA

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Ampacity Inc.

Singapore . 68 parts In-Stock

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Semicontronic

India . 68 parts In-Stock

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Corphita

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Qasali Group International

UK . 31,673 parts In-Stock

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Argo Parts USA

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Legend Electronics Inc. (Excess)

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Speed Components Ltd (Excess)

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Overview

Unlock limitless possibilities with the 10M08SAU324I7G by Intel, a cutting-edge Field Programmable Gate Array (FPGA) that boasts 8000 logic cells and 500 CLBs. Designed with precision and quality in mind, Intel's expertise shines through in every aspect of this product, from its high-performance capabilities to its innovative package shape and form of terminal. Whether you're looking to enhance your design flexibility, reduce time-to-market, or streamline your development process, this FPGA delivers unmatched value and benefits to customers across various industries. Elevate your projects to new heights with the Intel 10M08SAU324I7G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and cost-effectiveness for the product.

No. of Logic Cells: 8000

The high number of logic cells allows for complex computations and versatile applications.

Surface Mount: YES

Surface mount technology makes installation and maintenance easier for users.

Maximum Supply Voltage: 3.15 V

This high maximum supply voltage ensures stable performance under varying conditions.

No. of CLBs: 500

The 500 CLBs offer sufficient resources for designing and implementing various logic functions.

No. of Inputs: 250

With 250 inputs, this FPGA can handle a wide range of input signals efficiently.

Package Shape: SQUARE

The square package shape allows for efficient use of space in circuit design.

Form Of Terminal: BALL

The ball terminal form provides enhanced connectivity and reliability for the product.

Nominal Supply Voltage (V): 3

The steady nominal supply voltage of 3V ensures consistent and reliable operation.

No. of Terminals: 324

The high number of terminals allows for versatile connectivity options in circuit design.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

The programmable nature of the IC offers flexibility for customization based on specific application requirements.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers space-saving benefits and easy integration in compact designs.

Minimum Supply Voltage: 2.85 V

The low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions.

Pitch Of Terminal: 0.8 mm

The small pitch of terminals allows for compact circuit layouts and efficient signal routing.

Organization: 500 CLBs

The organization of 500 CLBs provides a structured framework for implementing complex logic functions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures performance even in cold environments.

Position Of Terminal: BOTTOM

The terminal position at the bottom offers easy access and connection points in circuit designs.

Maximum Seated Height: 1.55 mm

The low seated height allows for compact and space-efficient PCB designs.

Width: 15 mm

The standard width of 15mm ensures compatibility with various PCB layouts and design constraints.

No. of Outputs: 250

With 250 outputs, this FPGA can drive a wide range of devices and components in a circuit.

Length: 15 mm

The standard length of 15mm allows for easy installation and integration in different systems.

Grading Of Temperature: INDUSTRIAL

The industrial-grade temperature grading ensures reliability and performance in tough operating conditions.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10M08SAU324I7G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

8000

No. of Inputs:

250

No. of Outputs:

250

No. of CLBs:

500

Organization:

500 CLBS

Additional Features:

Also Operates at 3.3 V nominal supply

Power Characteristics

Nominal Supply Voltage:

3

Minimum Supply Voltage:

2.85 V

Maximum Supply Voltage:

3.15 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA324,18X18,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.8 mm

No. of Terminals:

324

Standards

JESD-30 Code:

S-PBGA-B324

Trade Compliance

10M08SAU324I7G Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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