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10M04SCU324C8G

Intel

10M04SCU324C8G by Intel

Intel's 10M04SCU324C8G FPGA features 4000 logic cells, 250 CLBs, and 246 inputs/outputs. With a package style of grid array and low profile, it is suitable for commercial extended temperature applications requiring high-performance programmable ICs.

Median Price

$15.570

Lifecycle Status

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8

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Digiode

USA . 484 parts In-Stock

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Cyclops Electronics Ltd

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Touchstone Systems

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Chip Stock

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Vyrian

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Nova Conductors

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Sensible Micro Corp

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Vigor

Singapore . 335 parts In-Stock

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Ampacity Inc.

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Microchip USA

USA . 1,266 parts In-Stock

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Corphita

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Texas Native Microelectronics

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Qasali Group International

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Continental Prestige Electronics

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Authorized Procurement Solutions

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Alle Elektronik GmbH

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Aranea Global

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Kenton Components

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Overview

Unlock endless possibilities with the Intel 10M04SCU324C8G Field Programmable Gate Array! Manufactured by Intel, this FPGA offers unparalleled quality and reliability, perfect for a wide range of applications. With 4000 logic cells and 250 CLBs, this versatile device provides customers with the flexibility to customize and optimize their designs. The compact package body material and surface mount make installation a breeze, while the low profile grid array package style ensures seamless integration. Experience the power of innovation with Intel's cutting-edge technology, delivering exceptional value and performance to meet your unique needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the FPGA, making it a reliable choice for various applications.

No. of Logic Cells: 4000

Having 4000 logic cells allows for complex logic functions to be implemented efficiently in the FPGA, making it suitable for advanced applications.

Surface Mount: YES

Surface mount capability simplifies the assembly process and makes it easier to integrate the FPGA onto a PCB, saving time and effort.

Maximum Supply Voltage: 3.15 V

With a maximum supply voltage of 3.15 V, this FPGA can operate within a safe voltage range while providing enough power for high-performance tasks.

No. of CLBs: 250

Having 250 Configurable Logic Blocks (CLBs) allows for flexible design options and customization, making it versatile for different applications.

No. of Inputs: 246

With 246 input pins, this FPGA can handle a large amount of external data and signals, enabling complex input processing capabilities.

Package Shape: SQUARE

The square package shape provides a compact form factor, making it easier to fit the FPGA into tight spaces within electronic devices or systems.

Form Of Terminal: BALL

Ball terminals offer reliable connections and easy soldering during the assembly process, ensuring secure integration of the FPGA onto the PCB.

Nominal Supply Voltage (V): 3

Having a nominal supply voltage of 3 V ensures compatibility with standard power sources, making it easy to power up the FPGA in various settings.

No. of Terminals: 324

Having 324 terminals allows for multiple connections and interfaces, enabling the FPGA to communicate with other components efficiently.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array (FPGA) allows for reprogramming of the logic functions and configurations, providing flexibility for different design iterations.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style ensures easy integration onto the PCB with precise alignment and spacing, enhancing overall performance.

Minimum Supply Voltage: 2.85 V

With a minimum supply voltage of 2.85 V, this FPGA can operate efficiently even at lower power levels, saving energy and reducing heat generation.

Maximum Operating Temperature: 85 °C

The maximum operating temperature of 85°C allows the FPGA to function reliably under challenging environmental conditions without overheating.

Pitch Of Terminal: 0.8 mm

Having a terminal pitch of 0.8 mm enables high-density packing of terminals, optimizing board space and allowing for more connections within a limited area.

Organization: 250 CLBS

The organization of 250 Configurable Logic Blocks (CLBs) provides a structured framework for logic implementation, enhancing design efficiency and ease of customization.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures that the FPGA can function reliably even in cold environments, making it suitable for various applications.

Position Of Terminal: BOTTOM

Having terminals located at the bottom facilitates easy PCB routing and layout, simplifying the design process and optimizing signal integrity.

Maximum Seated Height: 1.55 mm

The maximum seated height of 1.55 mm allows for a low-profile design, reducing the overall thickness of the electronic system and enabling compact device integration.

Width: 15 mm

With a width of 15 mm, this FPGA can fit into various board layouts and configurations, providing flexibility in design and compatibility with different systems.

No. of Outputs: 246

Having 246 output pins enables the FPGA to drive multiple external components and interfaces, expanding its functionality and output capabilities.

Length: 15 mm

With a length of 15 mm, this FPGA offers a balanced form factor that can be easily accommodated within different electronic devices or systems.

Grading Of Temperature: COMMERCIAL EXTENDED

The commercial extended temperature grading ensures reliable performance across a wide temperature range, making this FPGA suitable for industrial and commercial applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10M04SCU324C8G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

4000

No. of Inputs:

246

No. of Outputs:

246

No. of CLBs:

250

Organization:

250 CLBS

Additional Features:

Also Operates at 3.3 V nominal supply

Power Characteristics

Nominal Supply Voltage:

3

Minimum Supply Voltage:

2.85 V

Maximum Supply Voltage:

3.15 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA324,18X18,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.8 mm

No. of Terminals:

324

Standards

JESD-30 Code:

S-PBGA-B324

Trade Compliance

10M04SCU324C8G Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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