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10CX085YF672I6G

Intel

10CX085YF672I6G by Intel

Intel's 10CX085YF672I6G FPGA boasts 85000 logic cells, TSMC technology, and 31000 CLBs. Ideal for industrial applications requiring high performance with a max operating temperature of 100°C.

Median Price

$160.594

Lifecycle Status

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Nova Conductors

Japan . 300 parts In-Stock

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Vyrian

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Digiode

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AZTECH Wire

Italy . 304 parts In-Stock

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Ampacity Inc.

Singapore . 946 parts In-Stock

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Semicontronic

India . 1,110 parts In-Stock

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Advanced Electronics

New Zealand . 600 parts In-Stock

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MARBEL Systems

Belgium . 800 parts In-Stock

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Texas Native Microelectronics

USA . 3,345 parts In-Stock

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Kenton Components

USA . 256 parts In-Stock

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Corohmni

South Africa . 201 parts In-Stock

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Continental Prestige Electronics

USA . 4,102 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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Microchip USA

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Argo Parts USA

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Corphita

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Qasali Group International

UK . 300 parts In-Stock

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Vigor

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Overview

Unlock limitless possibilities with the 10CX085YF672I6G by Intel, a top-of-the-line Field Programmable Gate Array designed to revolutionize your projects. Crafted by the renowned manufacturer, Intel, this FPGA boasts 85,000 logic cells and 31,000 CLBs, perfect for a wide range of applications. From automation to telecommunications, this versatile device offers unparalleled flexibility and performance. Experience the value of seamless integration, increased efficiency, and unmatched reliability with the 10CX085YF672I6G - your key to innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material offers durability and reliability in various operating conditions, making it a good choice for long-term use.

No. of Logic Cells: 85000

With a high number of logic cells, this FPGA offers extensive programmability and customization options for complex applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, enabling efficient and space-saving designs.

Maximum Supply Voltage: 0.93 V

Low maximum supply voltage helps in reducing power consumption and heat dissipation, making the device energy-efficient.

Technology Used: TSMC

Utilizing TSMC technology ensures high performance, reliability, and quality in the FPGA design.

No. of Inputs: 216

A sufficient number of inputs enable versatile input/output configurations, allowing for flexible connectivity options.

Package Shape: SQUARE

Square package shape facilitates easier board layout and assembly, optimizing space utilization and overall system design.

No. of Terminals: 672

A high number of terminals provide ample connectivity possibilities, supporting diverse interfacing requirements in complex systems.

Minimum Operating Temperature: -40 °C

With a wide operating temperature range, this FPGA can function effectively in harsh environmental conditions, enhancing its reliability and durability.

No. of Outputs: 216

A balanced number of outputs enable efficient data processing and communication, ensuring smooth operation in various applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10CX085YF672I6G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

85000

No. of Inputs:

216

No. of Outputs:

216

No. of CLBs:

31000

Technology:

TSMC

Organization:

31000 CLBS

Power Characteristics

Nominal Supply Voltage:

.9

Minimum Supply Voltage:

.87 V

Maximum Supply Voltage:

.93 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

No. of Terminals:

672

Standards

JESD-30 Code:

S-PBGA-B672

Trade Compliance

10CX085YF672I6G Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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