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LCMXO2-256ZE-1UMG64I

Lattice Semiconductor

LCMXO2-256ZE-1UMG64I by Lattice Semiconductor

LCMXO2-256ZE-1UMG64I by Lattice Semiconductor is a 256 logic cell FPGA with 44 inputs/outputs, operating at 1.2V. It comes in a square grid array package suitable for applications requiring high-density programmable ICs and operates b/w -40 to 100°C.

Median Price

$5.992

Lifecycle Status

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11

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Arrow

USA . 790 parts In-Stock

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$5.133

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Mouser Electronics

USA . 390 parts In-Stock

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$6.850

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$5.720

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Verical

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Nova Conductors

Japan . 98 parts In-Stock

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$5.260

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Bristol Electronics

USA . 285 parts In-Stock

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$10.032

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$4.715

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$4.314

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Vyrian

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Chip Stock

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Dan-Mar Components

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ACDS - Activité Composants Distribution Service

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Andel Nordic

Denmark . 74 parts In-Stock

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$0.960

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$0.675

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Semicontronic

India . 353 parts In-Stock

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$2.180

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$2.126

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$2.115

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Ampacity Inc.

Singapore . 267 parts In-Stock

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$2.180

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Continental Prestige Electronics

USA . 5,863 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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Microchip USA

USA . 2,621 parts In-Stock

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Advanced Electronics

New Zealand . 30 parts In-Stock

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Aztec Data Supply Inc.

USA . 281 parts In-Stock

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Corohmni

South Africa . 97 parts In-Stock

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Argo Parts USA

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Perfect Parts

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Robosynatics

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Lucentia Tech

USA . 150 parts In-Stock

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$2.281

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Overview

Unleash the power of innovation with the LCMXO2-256ZE-1UMG64I by Lattice Semiconductor. As a leader in Field Programmable Gate Arrays (FPGA), Lattice Semiconductor delivers cutting-edge technology that empowers limitless possibilities in various applications. With 256 logic cells and a nominal supply voltage of 1.2V, this FPGA offers unmatched flexibility and performance. Whether you're designing for telecommunications, industrial automation, or automotive systems, the LCMXO2-256ZE-1UMG64I provides exceptional value, reliability, and efficiency. Elevate your projects to new heights with Lattice Semiconductor's superior quality FPGA solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy is a durable and cost-effective material for packaging FPGA products.

No. of Logic Cells: 256

With 256 logic cells, this FPGA offers sufficient capacity for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 1.26 V

Ability to support a maximum supply voltage of 1.26 V provides flexibility in power management.

No. of Inputs: 44

Having 44 inputs allows for versatile connectivity in different circuits and systems.

Package Shape: SQUARE

Square package shape facilitates efficient layout and placement on a PCB.

Form Of Terminal: BALL

Ball terminal configuration eases the soldering process during PCB assembly.

Nominal Supply Voltage (V): 1.2

Stable nominal supply voltage of 1.2 V ensures consistent performance of the FPGA.

Packing Method: TRAY

Tray packaging method provides protective storage and transportation for the FPGA.

Power Supplies (V): 1.2

Support for power supplies at 1.2 V showcases compatibility with various power sources.

No. of Terminals: 64

Having 64 terminals enables sufficient connectivity options for input and output signals.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As an FPGA, this programmable IC offers flexibility in design and customization for different applications.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with fine pitch and thin profile allows for a compact and space-efficient PCB layout.

Minimum Supply Voltage: 1.14 V

Support for a minimum supply voltage of 1.14 V ensures compatibility with low-power applications.

Maximum Operating Temperature: 100 °C

With a maximum operating temperature of 100°C, this FPGA can withstand high-temperature environments.

Pitch Of Terminal: 0.4 mm

Terminal pitch of 0.4 mm offers fine pitch connectivity for efficient signal routing.

Minimum Operating Temperature: -40 °C

Ability to operate at temperatures as low as -40°C makes this FPGA suitable for harsh environmental conditions.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn/Ag/Cu)

Tin/Silver/Copper finish on the terminals provides robust and reliable contact points for soldering.

Position Of Terminal: BOTTOM

Bottom terminal positioning simplifies PCB layout and assembly, ensuring ease of integration.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this FPGA can withstand moderate levels of moisture during storage and handling.

Maximum Seated Height: 1 mm

Low maximum seated height of 1 mm allows for slim and compact product designs.

Width: 4 mm

Width of 4 mm provides a compact form factor for PCB integration, saving valuable board space.

No. of Outputs: 44

Having 44 outputs allows for versatile signal routing and processing capabilities in different applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this FPGA ensures reliable soldering during PCB assembly.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C meets industry standards for reliable soldering and component assembly.

Length: 4 mm

Length of 4 mm contributes to the overall compact size of the FPGA, ideal for space-constrained applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) LCMXO2-256ZE-1UMG64I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of Logic Cells:

256

No. of Inputs:

44

No. of Outputs:

44

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Very Thin Profile, Fine Pitch

Package Code:

Package Shape:

Length:

4 mm

Width:

4 mm

Maximum Seated Height:

1 mm

Packing Method:

Tray

Package Equivalence Code:

BGA64,8X8,16

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper

Terminal Pitch:

.4 mm

No. of Terminals:

64

Standards

JESD-30 Code:

S-PBGA-B64

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

LCMXO2-256ZE-1UMG64I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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