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10M08SAU169I7P

Intel

10M08SAU169I7P by Intel

The Intel 10M08SAU169I7P is an FPGA with 8000 logic cells, 500 CLBs, and 250 inputs/outputs. It operates at a voltage range of 2.85V to 3.15V and has a temperature range of -40°C to 100°C. This FPGA is ideal for industrial applications requiring high-performance programmable ICs in a compact grid array package.

Median Price

$22.410

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Verical

USA . 528 parts In-Stock

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Nova Conductors

Japan . 58 parts In-Stock

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Digiode

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Vyrian

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AZTECH Wire

Italy . 272 parts In-Stock

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Semicontronic

India . 254 parts In-Stock

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Vigor

Singapore . 498 parts In-Stock

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Corohmni

South Africa . 67 parts In-Stock

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Continental Prestige Electronics

USA . 4,081 parts In-Stock

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Netroflash

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Microchip USA

USA . 1,262 parts In-Stock

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Corphita

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Component Stockers USA

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Aztec Data Supply Inc.

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Ampacity Inc.

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Texas Native Microelectronics

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Kenton Components

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Argo Parts USA

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MARBEL Systems

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Qasali Group International

UK . 566 parts In-Stock

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Perfect Parts

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Speed Components Ltd (Excess)

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Overview

Unlock unlimited possibilities with the Intel 10M08SAU169I7P FPGA. Manufactured by industry giant Intel, this cutting-edge Field Programmable Gate Array boasts 8000 logic cells and a multitude of inputs and outputs for maximum versatility. Whether you're looking to optimize performance in automotive, industrial, or telecom applications, this FPGA's high-quality construction and advanced features ensure top-notch reliability and efficiency. Enhance your projects with the Intel advantage and revolutionize your designs today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the FPGA lightweight and durable, ensuring easy handling and long-lasting performance.

No. of Logic Cells: 8000

With 8000 logic cells, this FPGA offers a high level of programmability and flexibility for designing complex digital circuits.

Surface Mount: YES

Being surface mountable, this FPGA can be easily mounted on circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.15 V

The high maximum supply voltage of 3.15 V allows for reliable operation and compatibility with various power sources.

No. of CLBs: 500

With 500 configurable logic blocks, this FPGA can efficiently handle a wide range of logic functions and tasks.

No. of Inputs: 250

Having 250 input pins enables the FPGA to interface with multiple external devices and sensors, enhancing its connectivity and versatility.

Package Shape: SQUARE

The square package shape provides a symmetrical layout for easy integration into circuit designs and PCB layouts.

Form Of Terminal: BALL

The ball terminals allow for secure soldering and reliable connections, ensuring stable electrical contact in various operating conditions.

Nominal Supply Voltage (V): 3

The nominal supply voltage of 3 V is a common standard, making it easier to power and integrate the FPGA into existing systems.

No. of Terminals: 169

Having 169 terminals provides sufficient I/O options for connecting to external components and peripherals, expanding the FPGA's capabilities.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a field-programmable gate array, this IC type allows for on-the-fly reconfigurability and customization, making it ideal for prototyping and rapid development.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style enhances the FPGA's thermal performance, mechanical stability, and signal integrity in compact designs.

Minimum Supply Voltage: 2.85 V

The low minimum supply voltage of 2.85 V ensures energy efficiency and compatibility with low-power applications, optimizing the FPGA's performance.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature of 100°C, this FPGA can withstand harsh environmental conditions and maintain stable functioning in demanding applications.

Pitch Of Terminal: 0.8 mm

The tight pitch of 0.8 mm between terminals allows for high-density packaging and efficient routing of signals, enabling compact and streamlined circuit designs.

Organization: 500 CLBS

The organization of 500 configurable logic blocks ensures efficient resource utilization and facilitates the implementation of complex logic functions in the FPGA.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature of -40°C, this FPGA can operate reliably in cold environments and extreme temperature conditions without performance degradation.

Position Of Terminal: BOTTOM

The bottom position of the terminals simplifies PCB layout and assembly, making it easier to integrate the FPGA into circuit designs and optimize signal routing.

Maximum Seated Height: 1.55 mm

The low maximum seated height of 1.55 mm allows for close placement of components and minimal board clearance, enabling compact and space-efficient PCB designs.

Width: 11 mm

The compact width of 11 mm contributes to the overall small form factor of the FPGA, making it suitable for applications with limited space constraints.

No. of Outputs: 250

Having 250 output pins enables the FPGA to drive multiple devices and peripherals, facilitating complex digital signal processing and data communication.

Length: 11 mm

The short length of 11 mm further enhances the compactness of the FPGA, allowing for easy integration into tight spaces and small electronic devices.

Grading Of Temperature: INDUSTRIAL

The industrial-grade temperature grading ensures reliable operation in rugged and demanding environments, making this FPGA suitable for industrial applications with stringent temperature requirements.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10M08SAU169I7P attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

8000

No. of Inputs:

250

No. of Outputs:

250

No. of CLBs:

500

Organization:

500 CLBS

Additional Features:

Also Operates at 3.135 V min 3.3 V nominal and 3.465 max VCC

Power Characteristics

Nominal Supply Voltage:

3

Minimum Supply Voltage:

2.85 V

Maximum Supply Voltage:

3.15 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

11 mm

Width:

11 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA169,13X13,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.8 mm

No. of Terminals:

169

Standards

JESD-30 Code:

S-PBGA-B169

Trade Compliance

10M08SAU169I7P Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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