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10CX085YU484I5G

Intel

10CX085YU484I5G by Intel

Intel's 10CX085YU484I5G FPGA boasts 85000 logic cells, TSMC technology, and 31000 CLBs. Ideal for industrial applications requiring high performance with a max operating temperature of 100°C.

Median Price

$184.560

Lifecycle Status

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6

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DigiKey

USA . 114 parts In-Stock

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Digiode

USA . 338 parts In-Stock

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Vyrian

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Chip Stock

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Nova Conductors

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AZTECH Wire

Italy . 312 parts In-Stock

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$6.555

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Ampacity Inc.

Singapore . 144 parts In-Stock

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Semicontronic

India . 144 parts In-Stock

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Corphita

USA . 65 parts In-Stock

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Corohmni

South Africa . 15 parts In-Stock

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Texas Native Microelectronics

USA . 1,834 parts In-Stock

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$127.549

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Aztec Data Supply Inc.

USA . 4,095 parts In-Stock

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Microchip USA

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Vigor

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Qasali Group International

UK . 1,754 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

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Kenton Components

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MARBEL Systems

Belgium . 870 parts In-Stock

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Bastille Electronics

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Overview

Unlock limitless possibilities with the 10CX085YU484I5G FPGA by Intel. Crafted with precision and expertise, this field-programmable gate array boasts 85,000 logic cells and 31,000 CLBs for unparalleled performance. Whether you're designing cutting-edge electronics or revolutionizing automation systems, this FPGA delivers unmatched flexibility and efficiency. With a package body material of plastic/epoxy and a maximum supply voltage of 0.93V, the 10CX085YU484I5G is designed to exceed expectations. Elevate your projects with Intel's top-of-the-line technology and experience seamless innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection to the FPGA, making it suitable for various industrial applications.

No. of Logic Cells: 85000

With a high number of logic cells, this FPGA offers great flexibility and processing power for complex designs and algorithms.

Surface Mount: YES

Being surface mountable makes it easier to integrate this FPGA into circuit boards and ensures reliable connections.

Maximum Supply Voltage: 0.93 V

The low maximum supply voltage helps in reducing power consumption and heat dissipation, making the FPGA more energy-efficient.

No. of CLBs: 31000

The high number of Configurable Logic Blocks (CLBs) allows for extensive customization and optimization of logic functions within the FPGA.

Technology Used: TSMC

Being based on TSMC technology ensures high performance, reliability, and compatibility with other TSMC-based components.

No. of Inputs: 188

Having a large number of inputs enables the FPGA to process a wide range of input signals, making it versatile for different applications.

Package Shape: SQUARE

The square package shape helps in efficient space utilization on PCBs, allowing for compact and streamlined designs.

Form Of Terminal: BALL

The ball terminal form provides good electrical and mechanical connections, ensuring reliability and durability in operation.

Nominal Supply Voltage (V): 0.9

The nominal supply voltage of 0.9 V is within the typical operating range for many electronic devices, facilitating compatibility.

No. of Terminals: 484

Having a high number of terminals allows for more connections and interfaces, enhancing the versatility and functionality of the FPGA.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a field-programmable device, this FPGA offers flexibility for customization and reconfiguration without the need for specialized manufacturing.

Package Style (Meter): GRID ARRAY

The grid array package style provides good thermal performance and mechanical stability, ensuring reliable operation in various conditions.

Minimum Supply Voltage: 0.87 V

The low minimum supply voltage allows for operation in low-power scenarios and ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this FPGA can withstand harsh environmental conditions and industrial applications.

Organization: 31000 CLBS

The organizational structure of 31000 Configurable Logic Blocks (CLBs) provides a good balance of flexibility and processing power for diverse applications.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this FPGA can also function reliably in cold environments and extreme conditions.

Position Of Terminal: BOTTOM

Having terminals positioned at the bottom allows for better PCB layout and easier integration into electronic systems.

No. of Outputs: 188

The high number of outputs enables the FPGA to drive multiple devices and interfaces, expanding its connectivity and application possibilities.

Grading Of Temperature: INDUSTRIAL

Being rated for industrial temperature ranges, this FPGA ensures reliable performance in demanding environments and critical applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10CX085YU484I5G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

85000

No. of Inputs:

188

No. of Outputs:

188

No. of CLBs:

31000

Technology:

TSMC

Organization:

31000 CLBS

Power Characteristics

Nominal Supply Voltage:

.9

Minimum Supply Voltage:

.87 V

Maximum Supply Voltage:

.93 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

Trade Compliance

10CX085YU484I5G Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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