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10M16SAU324I7G

Intel

10M16SAU324I7G by Intel

The Intel 10M16SAU324I7G is a Field Programmable Gate Array (FPGA) with 16000 logic cells. It has a max supply voltage of 3.15V and can operate in temperatures ranging from -40 to 100 °C. This FPGA is suitable for industrial applications requiring high-performance programmable ICs.

Median Price

$60.350

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Verical

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Nova Conductors

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Digiode

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Vyrian

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Cyclops Electronics Ltd

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Sensible Micro Corp

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Component Sense

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AZTECH Wire

Italy . 246 parts In-Stock

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Ampacity Inc.

Singapore . 153 parts In-Stock

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Semicontronic

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Vigor

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Advanced Electronics

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Corohmni

South Africa . 413 parts In-Stock

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Microchip USA

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Texas Native Microelectronics

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Kenton Components

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Qasali Group International

UK . 650 parts In-Stock

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Overview

Experience next-level performance and versatility with the 10M16SAU324I7G by Intel. As a leader in the industry, Intel brings you top-quality Field Programmable Gate Arrays (FPGA) that revolutionize the way you design and innovate. With its 16,000 logic cells, 1,000 CLBs, and 320 inputs/outputs, this FPGA is a game-changer for any application. Whether you're in telecommunications, automotive, or IoT, the 10M16SAU324I7G offers unmatched value, benefits, and advantages to meet your unique needs. Say goodbye to limitations and unlock endless possibilities with Intel. Trust in a brand that delivers excellence every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This FPGA utilizes a durable plastic/epoxy package body material, ensuring reliability and longevity, making it a great choice for rugged industrial applications.

No. of Logic Cells: 16000

With a high number of logic cells, this FPGA offers ample resources for complex designs, making it suitable for advanced and demanding applications.

Surface Mount: YES

Being surface mountable, this FPGA allows for easy and efficient integration onto PCBs, facilitating streamlined production processes.

Maximum Supply Voltage: 3.15 V

The FPGA's ability to operate at a maximum supply voltage of 3.15 V provides flexibility in power supply options and compatibility with various systems, enhancing its versatility.

No. of CLBs: 1000

Having a significant number of configurable logic blocks (CLBs), this FPGA offers substantial programmable resources, enabling the implementation of various sophisticated functionalities, making it an ideal choice for complex designs.

No. of Inputs: 320

With ample input capabilities, this FPGA accommodates a multitude of external signals and data sources, providing the necessary flexibility for diverse applications.

Package Shape: SQUARE

The square package shape of this FPGA promotes easy handling, placement, and alignment during integration, simplifying assembly processes.

Form Of Terminal: BALL

Utilizing ball terminals, this FPGA guarantees secure and reliable electrical connections, minimizing the risk of signal loss or failure, ensuring exceptional performance.

Nominal Supply Voltage (V): 3

The FPGA's nominal supply voltage of 3 V offers compatibility with a wide range of systems, facilitating seamless integration and operation across diverse applications.

No. of Terminals: 324

Having numerous terminals, this FPGA provides ample connectivity options, enabling efficient communication with external devices and peripherals, enhancing its versatility.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a versatile field-programmable gate array (FPGA), this product allows for efficient customization and reconfiguration of logic circuits, offering unparalleled flexibility for various applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The FPGA's grid array, low profile, and fine pitch packaging style enable high-density integration and compact designs, making it suitable for space-constrained applications.

Minimum Supply Voltage: 2.85 V

Supporting a minimum supply voltage of 2.85 V, this FPGA ensures compatibility with low power systems and optimizes energy efficiency, making it an ideal choice for battery-operated devices.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature of 100°C, this FPGA can withstand demanding thermal environments, ensuring stable and reliable operation in harsh conditions.

Pitch Of Terminal: 0.8 mm

The small pitch of 0.8 mm between terminals enables high-density wiring and compact PCB layouts, facilitating efficient space utilization and miniaturized designs.

Organization: 1000 CLBS

This FPGA's organization with 1000 configurable logic blocks (CLBs) allows for flexible and efficient utilization of resources, enabling the implementation of complex and versatile functionalities.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature of -40°C, this FPGA can withstand extremely cold environments, making it suitable for a wide range of applications, including automotive and industrial settings.

Position Of Terminal: BOTTOM

The position of the terminal at the bottom of the package simplifies PCB layout and routing, optimizing space utilization and ensuring straightforward assembly and integration.

Maximum Seated Height: 1.55 mm

The FPGA's low maximum seated height of 1.55 mm enables compact and slim designs, making it suitable for space-constrained applications where slim form factors are required.

Width: 15 mm

With a width of 15 mm, this FPGA offers a compact footprint, allowing for efficient use of PCB real estate while providing versatile functionality.

No. of Outputs: 320

Boasting an ample number of outputs, this FPGA facilitates seamless integration with external devices and subsystems, enabling efficient signal routing and communication.

Length: 15 mm

With a length of 15 mm, this FPGA offers a compact form factor, making it suitable for applications with limited physical space while providing high performance and functionality.

Grading Of Temperature: INDUSTRIAL

With an industrial temperature grading, this FPGA can withstand wide operating temperature ranges, ensuring reliable operation in demanding environments, making it ideal for industrial-grade applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10M16SAU324I7G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

16000

No. of Inputs:

320

No. of Outputs:

320

No. of CLBs:

1000

Organization:

1000 CLBS

Additional Features:

Also Operates at 3.3 V nominal supply

Power Characteristics

Nominal Supply Voltage:

3

Minimum Supply Voltage:

2.85 V

Maximum Supply Voltage:

3.15 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA324,18X18,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.8 mm

No. of Terminals:

324

Standards

JESD-30 Code:

S-PBGA-B324

Trade Compliance

10M16SAU324I7G Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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