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10M16SCU169I7P

Intel

10M16SCU169I7P by Intel

Intel's 10M16SCU169I7P FPGA features 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. With a max supply voltage of 3.15V, it is ideal for industrial applications requiring high-performance programmable ICs in a compact square package with ball terminals.

Median Price

$62.330

Lifecycle Status

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6

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DigiKey

USA . 48 parts In-Stock

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Digiode

USA . 495 parts In-Stock

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Vyrian

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Chip Stock

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Nova Conductors

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AZTECH Wire

Italy . 321 parts In-Stock

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Corphita

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Ampacity Inc.

Singapore . 106 parts In-Stock

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Semicontronic

India . 106 parts In-Stock

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Microchip USA

USA . 2,806 parts In-Stock

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Advanced Electronics

New Zealand . 92 parts In-Stock

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Texas Native Microelectronics

USA . 6,464 parts In-Stock

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Corohmni

South Africa . 135 parts In-Stock

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Qasali Group International

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Continental Prestige Electronics

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MARBEL Systems

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Argo Parts USA

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Vigor

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Bastille Electronics

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Kenton Components

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Overview

Unleash the power of innovation with the 10M16SCU169I7P by Intel! This cutting-edge Field Programmable Gate Array (FPGA) boasts superior quality and reliability backed by Intel's renowned reputation. With 16000 logic cells and 1000 CLBs, this FPGA is perfect for a wide range of applications, from industrial automation to telecommunications. Experience seamless performance and flexibility with the 10M16SCU169I7P, delivering unmatched value and benefits that will take your projects to new heights. Elevate your designs with Intel's exceptional technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this FPGA lightweight and durable, ideal for portable and rugged applications.

No. of Logic Cells: 16000

With a large number of logic cells, this FPGA offers high flexibility and processing power for complex designs and computations.

Surface Mount: YES

The ability to surface mount this FPGA simplifies the assembly process and allows for compact device designs.

Maximum Supply Voltage: 3.15 V

The high maximum supply voltage provides flexibility in power supply options while ensuring stable operation.

No. of CLBs: 1000

The abundant CLBs offer versatile logic configurations, enabling diverse functionality in the FPGA design.

No. of Inputs: 320

Having a large number of inputs allows for extensive connectivity and input options for data processing.

Package Shape: SQUARE

The square shape of the package helps in efficient board layout and space utilization in compact electronic devices.

Form Of Terminal: BALL

The use of ball terminals simplifies the soldering process and enhances the reliability of the FPGA connections.

Nominal Supply Voltage (V): 3

The nominal supply voltage of 3V provides standard power compatibility and ensures reliable operation.

No. of Terminals: 169

The sufficient number of terminals enables easy integration and connection with other electronic components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable device, this FPGA offers flexibility for customization and reconfiguration according to specific application requirements.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The fine pitch and low profile design of the package style allow for high-density mounting and space savings on circuit boards.

Minimum Supply Voltage: 2.85 V

The low minimum supply voltage helps in reducing power consumption and heat generation, contributing to energy efficiency.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this FPGA can withstand challenging environmental conditions and industrial applications.

Pitch Of Terminal: 0.8 mm

The small pitch of the terminal spacing ensures high-density packaging and facilitates compact electronic designs.

Organization: 1000 CLBS

The organized structure of 1000 CLBs provides a systematic layout for logic operations, simplifying design and debugging processes.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows for reliable performance even in extreme cold environments.

Position Of Terminal: BOTTOM

The terminal positioning at the bottom of the package enhances thermal management and improves signal integrity for efficient operation.

Maximum Seated Height: 1.55 mm

The low maximum seated height enables slim device profiles and contributes to space-saving designs.

Width: 11 mm

The compact width of 11mm ensures compatibility with various board layouts and dimensions, enhancing versatility in device integration.

No. of Outputs: 320

The numerous outputs provide ample options for data transmission and result display, enhancing the functionality of the FPGA.

Length: 11 mm

The short length of 11mm contributes to space-saving designs and allows for compact device configurations.

Grading Of Temperature: INDUSTRIAL

With an industrial temperature grading, this FPGA is suitable for demanding applications that require reliability and durability in harsh operating conditions.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10M16SCU169I7P attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

16000

No. of Inputs:

320

No. of Outputs:

320

No. of CLBs:

1000

Organization:

1000 CLBS

Additional Features:

Also Operates at 3.3 V nominal supply

Power Characteristics

Nominal Supply Voltage:

3

Minimum Supply Voltage:

2.85 V

Maximum Supply Voltage:

3.15 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

11 mm

Width:

11 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA169,13X13,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.8 mm

No. of Terminals:

169

Standards

JESD-30 Code:

S-PBGA-B169

Trade Compliance

10M16SCU169I7P Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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