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Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.

Other Function uPs,uCs & Peripheral ICs

Available Parts 2,371

Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
XC7Z010-1CLG225I by Xilinx

XC7Z010-1CLG225I

Xilinx

The Xilinx XC7Z010-1CLG225I is a low-profile, fine-pitch grid array IC with 225 terminals. Operating b/w -40 to 100°C, it features a CMOS technology and requires a supply voltage of 0.95V to 1.05V. Ideal for System on Chip applications due to its compact size and ball terminal form factor.

S-PBGA-B225

13 mm

225

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA225,15X15,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.5 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

13 mm

SYSTEM ON CHIP

XC7Z010-2CLG225I by Xilinx

XC7Z010-2CLG225I

Xilinx

XC7Z010-2CLG225I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.95V to 1.05V. Ideal for applications requiring low profile and fine pitch grid array packages in Other Function uPs,uCs & Peripheral ICs category.

S-PBGA-B225

13 mm

225

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA225,15X15,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.5 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

13 mm

SYSTEM ON CHIP

XC7Z010-3CLG225E by Xilinx

XC7Z010-3CLG225E

Xilinx

The Xilinx XC7Z010-3CLG225E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. This low profile chip in a grid array package is ideal for various applications requiring high performance and compact design.

S-PBGA-B225

13 mm

225

100 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA225,15X15,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.5 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

13 mm

SYSTEM ON CHIP

XC7Z030-1FBG484C by Xilinx

XC7Z030-1FBG484C

Xilinx

XC7Z030-1FBG484C by Xilinx is a System on Chip with CMOS technology. It operates b/w 0°C to 85°C, with supply voltage ranging from 0.95V to 1.05V. This package has 484 terminals in a square grid array shape, making it suitable for various applications in the field of Other Function uPs,uCs & Peripheral ICs.

S-PBGA-B484

23 mm

484

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

23 mm

SYSTEM ON CHIP

XC7Z030-1FBG484I by Xilinx

XC7Z030-1FBG484I

Xilinx

The Xilinx XC7Z030-1FBG484I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With a grid array package style and 484 terminals, it's ideal for applications requiring high-performance processing in compact spaces.

S-PBGA-B484

23 mm

484

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

23 mm

SYSTEM ON CHIP

XC7Z030-1FBG676C by Xilinx

XC7Z030-1FBG676C

Xilinx

The Xilinx XC7Z030-1FBG676C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage ranging from 0.95V to 1.05V. With a package style of Grid Array and 676 terminals, it's ideal for various applications in Other Function uPs,uCs & Peripheral ICs.

S-PBGA-B676

27 mm

676

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z030-1FBG676I by Xilinx

XC7Z030-1FBG676I

Xilinx

The Xilinx XC7Z030-1FBG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a square grid array package, it's ideal for various applications requiring high-performance computing and peripheral integration.

S-PBGA-B676

27 mm

676

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z030-1FFG676C by Xilinx

XC7Z030-1FFG676C

Xilinx

XC7Z030-1FFG676C by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. With 676 terminals in a grid array package, it's ideal for various applications requiring high-performance computing in compact spaces.

S-PBGA-B676

27 mm

676

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z030-2FBG484E by Xilinx

XC7Z030-2FBG484E

Xilinx

XC7Z030-2FBG484E by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage ranging from 0.95V to 1.05V. This package has 484 terminals in a square grid array shape, suitable for various applications requiring high-performance processing capabilities.

S-PBGA-B484

23 mm

484

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

23 mm

SYSTEM ON CHIP

XC7Z030-2FBG484I by Xilinx

XC7Z030-2FBG484I

Xilinx

The Xilinx XC7Z030-2FBG484I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. This package has 484 terminals in a square grid array shape, suitable for various applications requiring high-performance processing capabilities.

S-PBGA-B484

23 mm

484

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

23 mm

SYSTEM ON CHIP

XC7Z030-2FBG676E by Xilinx

XC7Z030-2FBG676E

Xilinx

The Xilinx XC7Z030-2FBG676E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. With 676 terminals in a square grid array package, it's ideal for various applications requiring high-performance microprocessing capabilities.

S-PBGA-B676

27 mm

676

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z030-2FBG676I by Xilinx

XC7Z030-2FBG676I

Xilinx

The Xilinx XC7Z030-2FBG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a grid array package, it's ideal for applications requiring high-performance processing in compact spaces.

S-PBGA-B676

27 mm

676

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z030-2FFG676E by Xilinx

XC7Z030-2FFG676E

Xilinx

XC7Z030-2FFG676E by Xilinx is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-100 °C with supply voltage range of 0.95-1.05 V. With 676 terminals in a GRID ARRAY package, it's ideal for applications requiring high-performance computing and embedded systems.

S-PBGA-B676

27 mm

676

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z030-3FBG484E by Xilinx

XC7Z030-3FBG484E

Xilinx

The Xilinx XC7Z030-3FBG484E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. With 484 terminals in a square grid array package, it's ideal for various applications requiring high-performance microprocessors and peripheral ICs.

S-PBGA-B484

23 mm

484

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

23 mm

SYSTEM ON CHIP

XC7Z030-3FBG676E by Xilinx

XC7Z030-3FBG676E

Xilinx

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

S-PBGA-B676

27 mm

676

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z030-3FFG676E by Xilinx

XC7Z030-3FFG676E

Xilinx

The Xilinx XC7Z030-3FFG676E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. With 676 terminals in a grid array package, it's ideal for various applications requiring high-performance computing in compact spaces.

S-PBGA-B676

27 mm

676

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z045-1FBG676C by Xilinx

XC7Z045-1FBG676C

Xilinx

The Xilinx XC7Z045-1FBG676C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. With 676 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B676

27 mm

676

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z045-1FBG676I by Xilinx

XC7Z045-1FBG676I

Xilinx

The Xilinx XC7Z045-1FBG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a grid array package, it's ideal for applications requiring high-performance processing in compact spaces.

S-PBGA-B676

27 mm

676

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z045-1FFG676C by Xilinx

XC7Z045-1FFG676C

Xilinx

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Terminal Pitch: 1 mm;

S-PBGA-B676

27 mm

676

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z045-1FFG900C by Xilinx

XC7Z045-1FFG900C

Xilinx

XC7Z045-1FFG900C by Xilinx is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-85 °C, with supply voltage range of 0.95-1.05 V. With 900 terminals in a GRID ARRAY package, it's ideal for applications requiring high performance and integration in compact spaces.

S-PBGA-B900

27 mm

900

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z045-1FFG900I by Xilinx

XC7Z045-1FFG900I

Xilinx

XC7Z045-1FFG900I by Xilinx is a System on Chip with 900 terminals, operating b/w -40 to 100°C. It features a supply voltage range of 0.95V to 1.05V and utilizes CMOS technology. Ideal for applications requiring high-performance processing in compact spaces, such as IoT devices and embedded systems.

S-PBGA-B900

27 mm

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z045-2FBG676E by Xilinx

XC7Z045-2FBG676E

Xilinx

XC7Z045-2FBG676E by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B676

27 mm

676

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z045-2FBG676I by Xilinx

XC7Z045-2FBG676I

Xilinx

The Xilinx XC7Z045-2FBG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a grid array package, it's ideal for applications requiring high-performance processing and integration capabilities.

S-PBGA-B676

27 mm

676

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z045-2FFG676E by Xilinx

XC7Z045-2FFG676E

Xilinx

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

S-PBGA-B676

27 mm

676

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z045-2FFG676I by Xilinx

XC7Z045-2FFG676I

Xilinx

The Xilinx XC7Z045-2FFG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a square grid array package, it's ideal for various applications requiring high-performance microprocessors and peripheral ICs.

S-PBGA-B676

27 mm

676

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z045-2FFG900E by Xilinx

XC7Z045-2FFG900E

Xilinx

The Xilinx XC7Z045-2FFG900E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage ranging from 0.95V to 1.05V. With a grid array package style and 900 terminals, it's ideal for applications requiring high-performance processing in compact spaces.

S-PBGA-B900

27 mm

900

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z045-2FFG900I by Xilinx

XC7Z045-2FFG900I

Xilinx

The Xilinx XC7Z045-2FFG900I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. Featuring a grid array package style, it's ideal for applications requiring high-performance processing in compact spaces.

S-PBGA-B900

27 mm

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z045-3FBG676E by Xilinx

XC7Z045-3FBG676E

Xilinx

XC7Z045-3FBG676E by Xilinx is a System on Chip with CMOS technology. It operates b/w 0 to 100°C, with supply voltage ranging from 0.95V to 1.05V. This package has a grid array style and is suitable for various applications requiring high-performance processing capabilities in a compact form factor.

S-PBGA-B676

27 mm

676

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z045-3FFG676E by Xilinx

XC7Z045-3FFG676E

Xilinx

XC7Z045-3FFG676E by Xilinx is a CMOS system-on-chip with 676 terminals and a package size of 27mm x 27mm. It operates at a voltage range of 0.95V to 1.05V and has a max temperature rating of 100°C. This versatile IC is commonly used in various applications requiring high-performance processing capabilities.

S-PBGA-B676

e1

27 mm

4

676

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z045-3FFG900E by Xilinx

XC7Z045-3FFG900E

Xilinx

The Xilinx XC7Z045-3FFG900E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage ranging from 0.95V to 1.05V. With 900 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B900

27 mm

900

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z100-1FFG1156I by Xilinx

XC7Z100-1FFG1156I

Xilinx

The Xilinx XC7Z100-1FFG1156I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With a grid array package style and 1156 terminals, it's ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B1156

35 mm

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1156,34X34,40

SQUARE

GRID ARRAY

3.1 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

35 mm

SYSTEM ON CHIP

XC7Z100-1FFG900I by Xilinx

XC7Z100-1FFG900I

Xilinx

The Xilinx XC7Z100-1FFG900I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 900 terminals in a grid array package, it's ideal for applications requiring high-performance processing in compact spaces.

S-PBGA-B900

27 mm

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z100-2FFG1156I by Xilinx

XC7Z100-2FFG1156I

Xilinx

XC7Z100-2FFG1156I by Xilinx is a 1156-terminal, square-shaped GRID ARRAY package with a max supply voltage of 1.05V and a min operating temperature of -40°C. It is a CMOS-based SYSTEM ON CHIP (SoC) used in Other Function uPs,uCs & Peripheral ICs applications.

S-PBGA-B1156

35 mm

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1156,34X34,40

SQUARE

GRID ARRAY

3.1 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

35 mm

SYSTEM ON CHIP

XC7Z100-2FFG900I by Xilinx

XC7Z100-2FFG900I

Xilinx

XC7Z100-2FFG900I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 900 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B900

27 mm

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

CP3SP33SMR/NOPB by Texas Instruments

CP3SP33SMR/NOPB

Texas Instruments

CP3SP33SMR/NOPB by Texas Instruments is a 16-bit microprocessor with 32768 RAM bytes. Operating at speeds up to 96 rpm, it has a low profile grid array package style suitable for industrial applications. With a supply voltage range of 1.62V to 1.98V and operating temperature from -40°C to 85°C, it offers high performance in compact dimensions.

16

CR16C

S-PBGA-B144

e1

10 mm

3

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.8

Not Qualified

32768

1.4 mm

96 rpm

Microcontrollers

200 mA

1.98 V

1.62 V

1.8 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

10 mm

MICROPROCESSOR CIRCUIT

TCI6636K2HDAAW24 by Texas Instruments

TCI6636K2HDAAW24

Texas Instruments

TCI6636K2HDAAW24 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 1517 terminals in a GRID ARRAY package. It operates at a supply voltage range of 0.95V to 1.05V and features a peak reflow temperature of 245°C. Ideal for applications requiring high-performance processing capabilities in compact electronic devices.

S-PBGA-B1517

e1

40 mm

4

1517

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

3.75 mm

1.05 V

.95 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT

TCI6636K2HDAAW2 by Texas Instruments

TCI6636K2HDAAW2

Texas Instruments

TCI6636K2HDAAW2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates at a supply voltage range of 0.95V to 1.05V and has 1517 terminals in a GRID ARRAY package style, making it suitable for high-performance computing applications. With a compact square shape measuring 40mm x 40mm, this IC is ideal for space-constrained designs requiring advanced processing capabilities.

S-PBGA-B1517

e1

40 mm

4

1517

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

3.75 mm

1.05 V

.95 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT

TCI6636K2HDAAWA24 by Texas Instruments

TCI6636K2HDAAWA24

Texas Instruments

TCI6636K2HDAAWA24 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates at 0.95-1.05 V, has 1517 terminals in a GRID ARRAY package style, and measures 40mm x 40mm. Ideal for applications requiring high-performance processing capabilities in compact electronic devices.

S-PBGA-B1517

e1

40 mm

4

1517

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

3.75 mm

1.05 V

.95 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT

TCI6636K2HDAAWA2 by Texas Instruments

TCI6636K2HDAAWA2

Texas Instruments

TCI6636K2HDAAWA2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0.95V to 1.05V, has 1517 terminals in a GRID ARRAY package style, and measures 40mm x 40mm. Ideal for applications requiring high-performance processing capabilities in compact electronic devices.

S-PBGA-B1517

e1

40 mm

4

1517

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

3.75 mm

1.05 V

.95 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT

TCI6638K2KDAAW24 by Texas Instruments

TCI6638K2KDAAW24

Texas Instruments

TCI6638K2KDAAW24 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 1517 terminals in a GRID ARRAY package. It operates at a supply voltage range of 0.95V to 1.05V and has a peak reflow temperature of 245°C. This IC is ideal for applications requiring high processing power in compact electronic devices.

S-PBGA-B1517

e1

40 mm

4

1517

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

3.75 mm

1.05 V

.95 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT

TCI6638K2KDAAW2 by Texas Instruments

TCI6638K2KDAAW2

Texas Instruments

TCI6638K2KDAAW2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 1517 terminals in a GRID ARRAY package. It operates at a supply voltage range of 0.95V to 1.05V and has a peak reflow temperature of 245°C. Ideal for applications requiring high-performance processing capabilities in compact electronic devices.

S-PBGA-B1517

e1

40 mm

4

1517

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

3.75 mm

1.05 V

.95 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT

TCI6638K2KDAAWA24 by Texas Instruments

TCI6638K2KDAAWA24

Texas Instruments

TCI6638K2KDAAWA24 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w supply voltages of 0.95V to 1.05V and has 1517 terminals in a GRID ARRAY package style. Ideal for applications requiring high processing power in compact spaces.

S-PBGA-B1517

e1

40 mm

4

1517

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

3.75 mm

1.05 V

.95 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT

TCI6638K2KDAAWA2 by Texas Instruments

TCI6638K2KDAAWA2

Texas Instruments

TCI6638K2KDAAWA2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 1517 terminals in a GRID ARRAY package. It operates at 0.95-1.05 V and has a peak reflow temperature of 245°C, making it suitable for high-performance computing applications. The CMOS technology and compact size of 40x40 mm make it ideal for advanced embedded systems requiring efficient processing power.

S-PBGA-B1517

e1

40 mm

4

1517

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

3.75 mm

1.05 V

.95 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT

CP3SP33SMS/NOPB by Texas Instruments

CP3SP33SMS/NOPB

Texas Instruments

CP3SP33SMS/NOPB by Texas Instruments is a 16-bit microprocessor with 32-bit external data bus width, operating at speeds up to 96 rpm. It features a low profile grid array package style with 224 terminals and supports I2C, I2S, SPI, UART, and USB buses. Ideal for industrial applications requiring high-speed processing in a compact form factor.

16

I2C; I2S; SPI; UART; USB

CR16C

32

S-PBGA-B224

e0

13 mm

3

224

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA224,15X15,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.8

Not Qualified

32768

1.4 mm

96 rpm

Microcontrollers

200 mA

1.98 V

1.62 V

1.8 V

YES

CMOS

INDUSTRIAL

TIN LEAD

BALL

.8 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

M82710-14 by Mindspeed Technologies

M82710-14

Mindspeed Technologies

Mindspeed Technologies' M82710-14 is a CMOS microprocessor circuit with 484 terminals in a grid array package. It operates b/w -25°C to 110°C, suitable for various applications requiring high-performance processing capabilities in compact form factors. The surface-mountable rectangular package makes it ideal for space-constrained designs.

R-PBGA-B484

484

110 Cel

-25 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

CMOS

OTHER

BALL

BOTTOM

MICROPROCESSOR CIRCUIT

MTFC32GJVED-4MIT by Micron Technology

MTFC32GJVED-4MIT

Micron Technology

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 169; Package Code: VFBGA; Package Shape: RECTANGULAR;

IT ALSO OPERATES AT 3.3 VOLTS

R-PBGA-B169

e1

18 mm

169

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1 mm

1.95 V

1.65 V

1.8 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

14 mm

MICROPROCESSOR CIRCUIT

MTFC4GMVEA-4MIT by Micron Technology

MTFC4GMVEA-4MIT

Micron Technology

MTFC4GMVEA-4MIT by Micron Technology is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.65V to 1.95V, making it ideal for INDUSTRIAL applications requiring high performance in a compact GRID ARRAY package style.

IT ALSO OPERATES AT 3.3 VOLTS

R-PBGA-B153

e1

13 mm

153

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

1.95 V

1.65 V

1.8 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

11.5 mm

MICROPROCESSOR CIRCUIT

MTFC64GJVDN-4MIT by Micron Technology

MTFC64GJVDN-4MIT

Micron Technology

MTFC64GJVDN-4MIT by Micron Technology is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.65V to 1.95V. This low profile, fine pitch GRID ARRAY package is ideal for industrial applications requiring high performance uPs and uCs.

IT ALSO OPERATES AT 3.3 VOLTS

R-PBGA-B169

e1

18 mm

169

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

1.4 mm

1.95 V

1.65 V

1.8 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

14 mm

MICROPROCESSOR CIRCUIT