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Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.

Other Function uPs,uCs & Peripheral ICs

Available Parts 2,371

Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
CC2540F128RHAT by Texas Instruments

CC2540F128RHAT

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;

SPI; USART; USB

S-PQCC-N40

e4

6 mm

3

21

40

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC40,.24SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3

Not Qualified

8192

8

1 mm

Other uPs/uCs/Peripheral ICs

3.6 V

2 V

3 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

6 mm

MICROPROCESSOR CIRCUIT

COMPARATORS, TIMER(4)

AR1100T-I/MQ by Microchip Technology

AR1100T-I/MQ

Microchip Technology

Microchip Technology's AR1100T-I/MQ is a CMOS microprocessor circuit with 20 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, with supply voltage range of 3.135V to 3.465V. Ideal for industrial applications requiring very thin profile and heat sink compatibility.

ALSO OPERATES AT 5V SUPPLY

S-PQCC-N20

e3

5 mm

20

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC20,.20SQ,25

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

TS 16949

1 mm

3.465 V

3.135 V

3.3 V

YES

CMOS

INDUSTRIAL

MATTE TIN

NO LEAD

.65 mm

QUAD

5 mm

MICROPROCESSOR CIRCUIT

OMAPL132BZWT2 by Texas Instruments

OMAPL132BZWT2

Texas Instruments

OMAPL132BZWT2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 361 terminals in a GRID ARRAY package. It operates at supply voltages ranging from 0.95V to 1.2V, making it suitable for low-power applications. With a compact size of 16mm x 16mm and surface-mount capability, it is ideal for space-constrained designs in various electronic devices.

ALSO OPERATES AT 1.2 V AND 1.1 V TYP

S-PBGA-B361

e1

16 mm

3

361

PLASTIC/EPOXY

LFBGA

BGA361,19X19,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.2,1.8/3.3

Not Qualified

1.4 mm

Other Microprocessor ICs

1.05 V

.95 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

OMAPL132BZWTA2 by Texas Instruments

OMAPL132BZWTA2

Texas Instruments

OMAPL132BZWTA2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 361 terminals in a GRID ARRAY package. It operates at supply voltages ranging from 0.95V to 1.2V and is suitable for applications requiring low profile, fine pitch ICs. With CMOS technology and TIN SILVER COPPER finish, it offers high performance in compact designs.

ALSO OPERATES AT 1.2 V TYP

S-PBGA-B361

e1

16 mm

3

361

PLASTIC/EPOXY

LFBGA

BGA361,19X19,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.2,1.8/3.3

Not Qualified

1.4 mm

Other Microprocessor ICs

1.05 V

.95 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

TMS320DM6441BZWT by Texas Instruments

TMS320DM6441BZWT

Texas Instruments

TMS320DM6441BZWT by Texas Instruments is a 32-bit microprocessor with 20480 RAM words, operating at -40 to 85°C. It supports Ethernet, I2C, SPI, UART, and USB buses for various applications like multimedia systems and industrial automation due to its low profile grid array package.

ALSO OPERATES AT 1.2 V AND 1.1 V TYP

32

ETHERNET; I2C; SPI; UART; USB

48

FIXED POINT

S-PBGA-B316

e1

16 mm

3

316

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA361,19X19,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.05/1.2,1.8,3.3

Not Qualified

20480

1.4 mm

Digital Signal Processors

1.1 V

1 V

1.05 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

TMS320DM6443BZWT by Texas Instruments

TMS320DM6443BZWT

Texas Instruments

TMS320DM6443BZWT by Texas Instruments is a 32-bit microprocessor with 20480 RAM words. It operates at 1.14-1.26 V, suitable for MICROPROCESSOR CIRCUIT applications like ETHERNET, I2C, SPI, UART, and USB interfaces. The package style is GRID ARRAY with low profile and fine pitch design for compact setups.

32

ETHERNET; I2C; SPI; UART; USB

48

FIXED POINT

S-PBGA-B316

e1

16 mm

3

316

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA361,19X19,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.2,1.8/3.3

Not Qualified

20480

1.4 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

CC2543RHMR by Texas Instruments

CC2543RHMR

Texas Instruments

CC2543RHMR by Texas Instruments is a CMOS microprocessor circuit with 32 terminals and a package style of chip carrier. It operates b/w -40 to 85 °C, with supply voltages ranging from 2V to 3.6V. Ideal for industrial applications requiring low-profile surface-mount components.

S-PQCC-N32

e4

5 mm

3

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

2.5/3.3

Not Qualified

.9 mm

Other Microprocessor ICs

3.6 V

2 V

3 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

5 mm

MICROPROCESSOR CIRCUIT

CC2543RHMT by Texas Instruments

CC2543RHMT

Texas Instruments

CC2543RHMT by Texas Instruments is a CMOS microprocessor circuit with 32 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, with supply voltages of 2-3.6 V. Ideal for industrial applications requiring low-profile surface-mount ICs.

S-PQCC-N32

e4

5 mm

3

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

2.5/3.3

Not Qualified

.9 mm

Other Microprocessor ICs

3.6 V

2 V

3 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

5 mm

MICROPROCESSOR CIRCUIT

STM32W108HBU61TR by STMicroelectronics

STM32W108HBU61TR

STMicroelectronics

STM32W108HBU61TR by STMicroelectronics is a 32-bit Cortex-M3 microprocessor with 131072 ROM words and 8192 RAM bytes. It operates in industrial temperatures (-40 to 85 °C) and has a max supply current of 150 mA. Ideal for applications requiring high-speed processing and low power consumption.

32

CORTEX-M3

S-PQCC-N40

e3

3

40

85 Cel

-40 Cel

PLASTIC/EPOXY

QCCN

LCC40,.24SQ,20

SQUARE

CHIP CARRIER

260

1.25,1.8,2.5/3.3

Not Qualified

8192

131072

FLASH

24 rpm

Microcontrollers

150 mA

YES

CMOS

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

MICROPROCESSOR CIRCUIT

XC7Z010-1CLG400C by Xilinx

XC7Z010-1CLG400C

Xilinx

XC7Z010-1CLG400C by Xilinx is a 400-terminal, low-profile, fine-pitch grid array package with a max supply voltage of 1.05V. It is a system-on-chip (SoC) peripheral IC that operates in temperatures ranging from 0 to 85°C. This versatile device is commonly used in various applications requiring high-performance computing and integrated functionality.

S-PBGA-B400

e1

17 mm

3

400

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z010-1CLG400I by Xilinx

XC7Z010-1CLG400I

Xilinx

The Xilinx XC7Z010-1CLG400I is a System on Chip with 400 terminals, operating b/w -40 to 100 °C. It features a low profile grid array package style and CMOS technology, suitable for various applications requiring high performance in a compact form factor. With a supply voltage range of 0.95V to 1.05V, it is ideal for projects demanding efficient power consumption and advanced processing capabilities.

S-PBGA-B400

e1

17 mm

3

400

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z010-2CLG400E by Xilinx

XC7Z010-2CLG400E

Xilinx

The Xilinx XC7Z010-2CLG400E is a System on Chip with 400 terminals in a low profile, fine pitch grid array package. It operates b/w 0-100°C with supply voltage range of 0.95-1.05V. Ideal for applications requiring high-performance processing in compact form factors.

S-PBGA-B400

e1

17 mm

3

400

100 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z010-2CLG400I by Xilinx

XC7Z010-2CLG400I

Xilinx

XC7Z010-2CLG400I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 400 terminals in a low profile grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B400

e1

17 mm

3

400

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z010-3CLG400E by Xilinx

XC7Z010-3CLG400E

Xilinx

XC7Z010-3CLG400E by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage ranging from 0.95V to 1.05V. This low-profile chip in a grid array package is ideal for various applications requiring high performance and compact design.

S-PBGA-B400

e1

17 mm

3

400

100 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z020-1CLG400I by Xilinx

XC7Z020-1CLG400I

Xilinx

The Xilinx XC7Z020-1CLG400I is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 400 terminals in a low profile grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B400

e1

17 mm

3

400

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z020-1CLG484C by Xilinx

XC7Z020-1CLG484C

Xilinx

XC7Z020-1CLG484C by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05 V. This low profile, fine pitch chip in a grid array package is ideal for various applications requiring high performance and integration.

S-PBGA-B484

19 mm

484

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z020-1CLG484I by Xilinx

XC7Z020-1CLG484I

Xilinx

XC7Z020-1CLG484I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.95V to 1.05V. This low profile chip in grid array package is ideal for various applications requiring high performance and compact design.

S-PBGA-B484

19 mm

484

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z020-2CLG400E by Xilinx

XC7Z020-2CLG400E

Xilinx

The Xilinx XC7Z020-2CLG400E is a System on Chip with 400 terminals in a low profile, fine pitch grid array package. It operates b/w 0-100°C with supply voltage range of 0.95-1.05V. Ideal for applications requiring high-performance processing in compact designs.

S-PBGA-B400

e1

17 mm

3

400

100 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z020-2CLG484E by Xilinx

XC7Z020-2CLG484E

Xilinx

The Xilinx XC7Z020-2CLG484E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. With 484 terminals in a low profile grid array package, it's ideal for various embedded applications requiring high-performance processing capabilities.

S-PBGA-B484

19 mm

484

100 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z020-2CLG484I by Xilinx

XC7Z020-2CLG484I

Xilinx

The Xilinx XC7Z020-2CLG484I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. Featuring a grid array package style, it is ideal for applications requiring low profile and fine pitch components in the Other Function uPs,uCs & Peripheral ICs category.

S-PBGA-B484

19 mm

484

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z020-3CLG400E by Xilinx

XC7Z020-3CLG400E

Xilinx

The Xilinx XC7Z020-3CLG400E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. Featuring a grid array package style, it's ideal for applications requiring low profile and fine pitch components in the Other Function uPs,uCs & Peripheral ICs category.

S-PBGA-B400

e1

17 mm

3

400

100 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z020-3CLG484E by Xilinx

XC7Z020-3CLG484E

Xilinx

The Xilinx XC7Z020-3CLG484E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. This low profile chip in a square package is ideal for various applications requiring high performance and integration capabilities.

S-PBGA-B484

19 mm

484

100 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

TMS320DM368ZCE48 by Texas Instruments

TMS320DM368ZCE48

Texas Instruments

TMS320DM368ZCE48 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-85 °C and has a supply voltage range of 1.28-1.42 V, making it ideal for applications requiring low power consumption and high performance in compact designs.

S-PBGA-B338

e1

13 mm

3

338

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.42 V

1.28 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

R3910-CFAB-E1B by Onsemi

R3910-CFAB-E1B

Onsemi

R3910-CFAB-E1B by Onsemi is a CMOS microprocessor circuit with 25 terminals, operating b/w 0-40 °C. It has a nominal voltage of 1.25V and is designed for commercial temperature grade applications. This surface-mount IC in rectangular package style is ideal for various microelectronic assemblies.

SEATED HGT-NOM

R-XXMA-N25

5.59 mm

25

40 Cel

0 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

1.525 mm

1.25 V

YES

CMOS

COMMERCIAL

NO LEAD

UNSPECIFIED

NOT SPECIFIED

3.81 mm

MICROPROCESSOR CIRCUIT

R3910-CFAB-E1T by Onsemi

R3910-CFAB-E1T

Onsemi

R3910-CFAB-E1T by Onsemi is a CMOS microprocessor circuit with 25 terminals, operating b/w 0-40°C. It has a supply voltage of 1.25V and can withstand peak reflow temperature of 260°C for up to 30 seconds. Ideal for commercial applications requiring compact surface-mount peripheral ICs.

SEATED HGT-NOM

R-XXMA-N25

5.59 mm

3

25

40 Cel

0 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

260

1.525 mm

1.25 V

YES

CMOS

COMMERCIAL

NO LEAD

UNSPECIFIED

30

3.81 mm

MICROPROCESSOR CIRCUIT

SA3291A-E1-T by Onsemi

SA3291A-E1-T

Onsemi

SA3291A-E1-T by Onsemi is a CMOS microprocessor circuit with 32 terminals. It operates b/w 0-40 °C, ideal for commercial applications. With a nominal voltage of 1.25V, it's suitable for various uPs and uCs functions in surface mount assemblies.

SEATED HGT-NOM

R-XXMA-N32

6.35 mm

32

40 Cel

0 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

1.777 mm

1.25 V

YES

CMOS

COMMERCIAL

NO LEAD

UNSPECIFIED

NOT SPECIFIED

3.68 mm

MICROPROCESSOR CIRCUIT

SB3229-E1-T by Onsemi

SB3229-E1-T

Onsemi

SB3229-E1-T by Onsemi is a CMOS microprocessor circuit with 25 terminals, operating from 0 to 40 °C. It has a nominal voltage of 1.25V and is designed for commercial temperature grade applications. This surface-mount IC in rectangular package style is ideal for various uPs and uCs functions.

SEATED HGT-NOM

R-XXMA-N25

5.59 mm

25

40 Cel

0 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

1.525 mm

1.25 V

YES

CMOS

COMMERCIAL

NO LEAD

UNSPECIFIED

NOT SPECIFIED

3.81 mm

MICROPROCESSOR CIRCUIT

SB3229-E1 by Onsemi

SB3229-E1

Onsemi

Onsemi's SB3229-E1 is a CMOS microprocessor circuit with 25 terminals, operating b/w 0-40 °C. It has a nominal voltage of 1.25V and is designed for commercial applications requiring a compact MICROELECTRONIC ASSEMBLY package style.

SEATED HGT-NOM

R-XXMA-N25

5.59 mm

25

40 Cel

0 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

1.525 mm

1.25 V

YES

CMOS

COMMERCIAL

NO LEAD

UNSPECIFIED

NOT SPECIFIED

3.81 mm

MICROPROCESSOR CIRCUIT

SB3231-E1-T by Onsemi

SB3231-E1-T

Onsemi

SB3231-E1-T by Onsemi is a CMOS microprocessor circuit with 25 terminals, operating from 0 to 40 °C. It has a nominal voltage of 1.25V and is designed for commercial temperature grade applications. This surface-mount IC in a rectangular package is ideal for various microelectronic assemblies.

SEATED HGT-NOM

R-XXMA-N25

5.59 mm

25

40 Cel

0 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

1.525 mm

1.25 V

YES

CMOS

COMMERCIAL

NO LEAD

UNSPECIFIED

NOT SPECIFIED

3.81 mm

MICROPROCESSOR CIRCUIT

SB3231-E1 by Onsemi

SB3231-E1

Onsemi

SB3231-E1 by Onsemi is a CMOS microprocessor circuit with 25 terminals. It operates b/w 0-40 °C, ideal for commercial applications. This rectangular surface-mount IC has a nominal voltage of 1.25V, suitable for various microelectronic assemblies.

SEATED HGT-NOM

R-XXMA-N25

5.59 mm

25

40 Cel

0 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

1.525 mm

1.25 V

YES

CMOS

COMMERCIAL

NO LEAD

UNSPECIFIED

NOT SPECIFIED

3.81 mm

MICROPROCESSOR CIRCUIT

TMS320DM368ZCED48F by Texas Instruments

TMS320DM368ZCED48F

Texas Instruments

TMS320DM368ZCED48F by Texas Instruments is a 32-bit microprocessor with 338 terminals, operating at -40 to 85°C. It features a max supply voltage of 1.42V and supports I2C, SPI, UART, and USB buses. Ideal for industrial applications requiring a low-profile package with fine pitch grid array style.

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B338

e1

13 mm

3

338

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA338,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.35,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.42 V

1.28 V

1.35 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CCUT4 by Texas Instruments

TMS320DM6467CCUT4

Texas Instruments

TMS320DM6467CCUT4 by Texas Instruments is a 32-bit microprocessor with 529 terminals, operating at temperatures from 0 to 85°C. It features a max supply voltage of 1.26V and supports I2C, PCI, SPI, UART, and USB buses. Ideal for applications requiring a MICROPROCESSOR CIRCUIT in a compact GRID ARRAY package style.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

I2C; PCI; SPI; UART; USB

16

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

NOT SPECIFIED

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CCUTAV by Texas Instruments

TMS320DM6467CCUTAV

Texas Instruments

TMS320DM6467CCUTAV by Texas Instruments is a 32-bit microprocessor with 8192 RAM words, operating at -40 to 105 °C. It supports I2C, PCI, SPI, UART, USB buses and has a terminal pitch of 0.8 mm. Ideal for industrial applications requiring high-speed data processing in compact form factors.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

I2C; PCI; SPI; UART; USB

16

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

NOT SPECIFIED

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CCUTD7 by Texas Instruments

TMS320DM6467CCUTD7

Texas Instruments

TMS320DM6467CCUTD7 by Texas Instruments is a 32-bit microprocessor with 529 terminals, operating at -40 to 85°C. It features a 16-bit external data bus width and supports I2C, PCI, SPI, UART, and USB buses. Ideal for industrial applications requiring a CMOS technology-based microprocessor circuit in a compact square package.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

I2C; PCI; SPI; UART; USB

16

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

NOT SPECIFIED

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CCUTV by Texas Instruments

TMS320DM6467CCUTV

Texas Instruments

TMS320DM6467CCUTV by Texas Instruments is a 32-bit microprocessor with 529 terminals, operating at temperatures from 0 to 85°C. It features a max supply voltage of 1.26V and supports various bus compatibilities like I2C, PCI, SPI, UART, and USB. Ideal for applications requiring a high-performance microprocessor circuit in a compact square package style.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

I2C; PCI; SPI; UART; USB

16

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

NOT SPECIFIED

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CCUT by Texas Instruments

TMS320DM6467CCUT

Texas Instruments

TMS320DM6467CCUT by Texas Instruments is a 32-bit microprocessor with 529 terminals, operating at temperatures from 0 to 85°C. It features a max supply voltage of 1.26V and supports I2C, PCI, SPI, UART, and USB buses. Ideal for applications requiring a fixed-point format and external data bus width of 16 bits.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

I2C; PCI; SPI; UART; USB

16

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

NOT SPECIFIED

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467CGUTA6 by Texas Instruments

TMS320DM6467CGUTA6

Texas Instruments

TMS320DM6467CGUTA6 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. Operating at 1.14-1.26V, it has a max temp of 85°C and uses CMOS technology. Ideal for applications requiring MICROPROCESSOR CIRCUIT in a PLASTIC/EPOXY package style with 529 terminals.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

FIXED POINT

S-PBGA-B529

e0

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

220

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN LEAD

BALL

.8 mm

BOTTOM

20

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467TCUT1 by Texas Instruments

TMS320DM6467TCUT1

Texas Instruments

TMS320DM6467TCUT1 by Texas Instruments is a 32-bit microprocessor with 529 terminals, operating at max 35 MHz. It has a supply voltage range of 1.235-1.365 V and supports Ethernet, I2C, SPI, UART, USB buses. Ideal for applications requiring high-speed processing in compact devices.

ALSO REQUIRES 3.3V I/O SUPPLY

32

ETHERNET; I2C; SPI; UART; USB

35 MHz

48

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.3,1.8/3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467TCUT9 by Texas Instruments

TMS320DM6467TCUT9

Texas Instruments

TMS320DM6467TCUT9 by Texas Instruments is a 32-bit microprocessor with 529 terminals, operating at max 35 MHz. It features 8192 RAM words, 48-bit external data bus width, and supports Ethernet, I2C, SPI, UART & USB. Ideal for applications requiring high-speed processing in a compact form factor.

ALSO REQUIRES 3.3V I/O SUPPLY

32

ETHERNET; I2C; SPI; UART; USB

35 MHz

48

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.3,1.8/3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467TCUTD1 by Texas Instruments

TMS320DM6467TCUTD1

Texas Instruments

TMS320DM6467TCUTD1 by Texas Instruments is a 32-bit microprocessor with 529 terminals, operating at max 35 MHz. Ideal for industrial applications, it supports Ethernet, I2C, SPI, UART, and USB bus compatibility with a supply voltage range of 1.3-3.3V.

ALSO REQUIRES 3.3V I/O SUPPLY

32

ETHERNET; I2C; SPI; UART; USB

35 MHz

48

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.3,1.8/3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

TMS320DM6467TZUT9 by Texas Instruments

TMS320DM6467TZUT9

Texas Instruments

TMS320DM6467TZUT9 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. Operating at 1.3V, it has a max supply voltage of 1.365V and supports power supplies of 1.8/3.3V. This MICROPROCESSOR CIRCUIT is ideal for applications requiring high performance in a compact form factor, with a package style of GRID ARRAY and FINE PITCH.

ALSO REQUIRES 3.3V I/O SUPPLY

32

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.3,1.8/3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

TMS32DM6467CCUTAV6 by Texas Instruments

TMS32DM6467CCUTAV6

Texas Instruments

TMS32DM6467CCUTAV6 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words, operating at -40 to 105 °C. It features a package style of GRID ARRAY, FINE PITCH and supports I2C, PCI, SPI, UART, USB buses. Ideal for industrial applications requiring high-performance computing in compact form factors.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

I2C; PCI; SPI; UART; USB

16

FIXED POINT

S-PBGA-B529

e1

19 mm

4

529

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.2,1.8,3.3

Not Qualified

8192

3.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

NOT SPECIFIED

19 mm

MICROPROCESSOR CIRCUIT

CY8C20347-24LQXI by Cypress Semiconductor

CY8C20347-24LQXI

Cypress Semiconductor

CY8C20347-24LQXI by Cypress Semiconductor is an 8-bit M8C CPU with 16384 ROM words and 2048 RAM bytes. Operating at -40 to 85 °C, it has a supply voltage range of 1.71-5.5 V, making it ideal for industrial microprocessor circuits requiring low power consumption and high performance in a compact square package.

8

M8C

S-XQCC-N24

e4

4 mm

3

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1.8/5

Not Qualified

2048

16384

FLASH

.6 mm

25.2 rpm

Microcontrollers

4 mA

5.5 V

1.71 V

3.3 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

30

4 mm

MICROPROCESSOR CIRCUIT

L99MM70XPTR by STMicroelectronics

L99MM70XPTR

STMicroelectronics

L99MM70XPTR by STMicroelectronics is a CMOS MICROPROCESSOR CIRCUIT with 36 terminals in a SMALL OUTLINE package. It operates b/w -40 to 125 °C and supports supply voltages from 6V to 18V, making it ideal for AUTOMOTIVE applications requiring high performance and reliability.

R-PDSO-G36

e3

10.3 mm

3

36

125 Cel

-40 Cel

PLASTIC/EPOXY

HSSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

260

2.45 mm

18 V

6 V

13.5 V

YES

CMOS

AUTOMOTIVE

Tin (Sn)

GULL WING

.5 mm

DUAL

30

7.5 mm

MICROPROCESSOR CIRCUIT

MTFC8GACAANA-4MIT by Micron Technology

MTFC8GACAANA-4MIT

Micron Technology

MICROPROCESSOR CIRCUIT; Technology: CMOS; Terminal Finish: TIN SILVER COPPER; JESD-609 Code: e1; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30;

e1

260

CMOS

TIN SILVER COPPER

30

MICROPROCESSOR CIRCUIT

SA3229-E1-T by Onsemi

SA3229-E1-T

Onsemi

SA3229-E1-T by Onsemi is a CMOS microprocessor circuit with 25 terminals in a rectangular chip carrier package. Operating temperature range of 0-40°C makes it suitable for commercial applications. With a nominal voltage of 1.25V, it's ideal for various uPs and uCs functions requiring surface mount technology.

R-PBCC-B25

5.59 mm

25

40 Cel

0 Cel

PLASTIC/EPOXY

BCC

RECTANGULAR

CHIP CARRIER

NOT SPECIFIED

1.781 mm

1.25 V

YES

CMOS

COMMERCIAL

BUTT

BOTTOM

NOT SPECIFIED

3.18 mm

MICROPROCESSOR CIRCUIT

SA3229-E1 by Onsemi

SA3229-E1

Onsemi

SA3229-E1 by Onsemi is a CMOS microprocessor circuit with 25 terminals in a rectangular chip carrier package. It operates b/w 0-40 °C, suitable for commercial applications. With a nominal voltage of 1.25V, it's ideal for various uPs and uCs functions requiring surface mount technology.

R-PBCC-B25

5.59 mm

25

40 Cel

0 Cel

PLASTIC/EPOXY

BCC

RECTANGULAR

CHIP CARRIER

NOT SPECIFIED

1.781 mm

1.25 V

YES

CMOS

COMMERCIAL

BUTT

BOTTOM

NOT SPECIFIED

3.18 mm

MICROPROCESSOR CIRCUIT

XC7Z030-1FFG676I by Xilinx

XC7Z030-1FFG676I

Xilinx

The Xilinx XC7Z030-1FFG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B676

27 mm

676

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP